公开(公告)号：US20090205858A1

公开(公告)日：2009-08-20

申请号：US12314086

申请日：2008-12-03

Applicant: Bernd Haegele

Inventor： Bernd Haegele

IPC: H05K1/18 ,  B05D5/12 ,  B05D3/00

CPC classification number: H05K1/053 ,  C03C3/064 ,  C23C4/18 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2203/1147 ,  H05K2203/1366 ,  Y10T29/49126 ,  Y10T29/49146

Abstract: Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

Abstract translation: 具有金属支撑层的电路载体，其至少一些部分被电介质层覆盖，该电介质层具有多个孔，孔至少在电介质层的与支撑层相反的一侧被玻璃密封 。

公开(公告)号：US07514785B2

公开(公告)日：2009-04-07

申请号：US11337687

申请日：2006-01-24

Applicant: Susumu Toba ,  Akira Morozumi ,  Kazuo Furihata

Inventor： Susumu Toba ,  Akira Morozumi ,  Kazuo Furihata

IPC: H01L23/34

CPC classification number: H05K3/0061 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/5385 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/142 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/017 ,  H05K2201/0323 ,  H05K2203/0545 ,  H01L2924/00

Abstract: A semiconductor device includes a solder dam for restricting the flow of solder during manufacturing. The device includes a semiconductor chip bonded to a first side of a circuit board, a metal base for dissipating heat produced by the semiconductor chip, the metal base being bonded to a second side of the circuit board, and a dam material disposed on the metal base in a predetermined pattern for restricting the flow of solder used in bonding a plurality of the circuit boards to the metal base. By employing the solder dam, solderability is not impaired, device contamination can be avoided, and a highly reliable semiconductor device can be produced.

Abstract translation: 半导体器件包括用于在制造期间限制焊料流动的焊料坝。 该装置包括接合到电路板的第一侧的半导体芯片，用于散发由半导体芯片产生的热的金属基底，金属基底接合到电路板的第二侧，以及设置在金属 以预定图案为基础，用于限制将多个电路板接合到金属基底时使用的焊料的流动。 通过使用焊料坝，可焊性不受损害，可以避免器件污染，可以生产高可靠性的半导体器件。

公开(公告)号：US20070003781A1

公开(公告)日：2007-01-04

申请号：US11479159

申请日：2006-06-30

Applicant: L. de Rochemont

Inventor： L. de Rochemont

IPC: B32B15/00

CPC classification number: H01Q9/0414 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q15/0086 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T428/12493

Abstract: An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

Abstract translation: 电气部件提供位于电介质基板上或介质基板之间的陶瓷元件，其与一对电导体接触并接触，其中陶瓷元件包括一种或多种具有小于或等于1.5摩尔的金属 - 氧化物组成均匀性波动的金属氧化物 ％整个陶瓷元件。 一种制造电气部件的方法，在衬底上提供或形成与一对电导体接触的陶瓷元件，包括沉积金属有机前体的混合物并引起金属氧化物前体的同时分解以形成陶瓷元件，包括一个 或更多的金属氧化物。

公开(公告)号：US20060186520A1

公开(公告)日：2006-08-24

申请号：US11337687

申请日：2006-01-24

Applicant: Susumu Toba ,  Akira Morozumi ,  Kazuo Furihata

Inventor： Susumu Toba ,  Akira Morozumi ,  Kazuo Furihata

IPC: H01L23/02

CPC classification number: H05K3/0061 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/5385 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/142 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/017 ,  H05K2201/0323 ,  H05K2203/0545 ,  H01L2924/00

Abstract: A semiconductor device includes a solder dam for restricting the flow of solder during manufacturing. The device includes a semiconductor chip bonded to a first side of a circuit board, a metal base for dissipating heat produced by the semiconductor chip, the metal base being bonded to a second side of the circuit board, and a dam material disposed on the metal base in a predetermined pattern for restricting the flow of solder used in bonding a plurality of the circuit boards to the metal base. By employing the solder dam, solderability is not impaired, device contamination can be avoided, and a highly reliable semiconductor device can be produced.

公开(公告)号：US06800815B1

公开(公告)日：2004-10-05

申请号：US10051984

申请日：2002-01-15

Applicant: Michael Richard Ehlert ,  William Jeffrey Schaefer

Inventor： Michael Richard Ehlert ,  William Jeffrey Schaefer

IPC: H05K111

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10126 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/248 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4061 ,  H05K2201/017 ,  H05K2201/035 ,  H05K2201/09909 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.

Abstract translation: 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。

公开(公告)号：US06452264B2

公开(公告)日：2002-09-17

申请号：US09798758

申请日：2001-03-02

Applicant: Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

Inventor： Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

IPC: H01L2310

CPC classification number: C04B35/195 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K3/3452 ,  H05K3/4629 ,  H05K2201/017

Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

Abstract translation: 提供了一种用于形成具有高位置精度的阻焊层的绝缘厚膜组合物，其可以抑制多层陶瓷基板的翘曲和起伏，并且可以保持其优异的电气特性。 绝缘厚膜组合物主要由具有与生陶瓷片中所含的粉末状陶瓷相同组成体系的粉末陶瓷组成，绝缘厚膜组合物的粉末状陶瓷的平均粒径小于 包含在绿色陶瓷体中的粉末状陶瓷。

公开(公告)号：US4409261A

公开(公告)日：1983-10-11

申请号：US322413

申请日：1981-11-18

Applicant: Charles Y. Kuo

Inventor： Charles Y. Kuo

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28 ,  B05D5/12

CPC classification number: H05K3/28 ,  H05K1/092 ,  H05K3/248 ,  H05K1/0306 ,  H05K2201/017 ,  Y10T428/24851 ,  Y10T428/24909 ,  Y10T428/24926 ,  Y10T428/252

Abstract: A thick film is formed initially as a paste and made up of such oxidizable conductor ingredients as copper which is then mixed with glass frit and next printed on a non-conductive inert substrate by silk screening. The silk screen printed thick film with vehicle is then dried, and a coating of boron in suitable paste or paint form having been mixed with a thixotropic organic vehicle is covered over the entirety of the substrate and silk screen printed thick film. The resulting product after a second air drying is then fired to bond the glass frit-copper as a thick film onto the substrate, with the copper particles being sintered throughout into a thick film. Superposed boron, where contiguous with the copper printing, is fused as a protective layer over the copper allowing the sintering of the copper and bonding with the substrate to occur without oxidation of the copper. Oxidized boron that covers portions of the substrate not occupied by the thick film and not superposing the copper layer is then washed away and the boron bonded to the copper remains as a protective coating.

Abstract translation: 最初形成一层厚的薄膜作为糊状物，由铜等可氧化的导电成分组成，然后与玻璃料混合，然后通过丝网印刷印在非导电的惰性基材上。 然后将具有载体的丝网印刷的厚膜干燥，并将与触变有机载体混合的合适的糊剂或油漆形式的硼涂层覆盖在整个基材和丝网印刷的厚膜上。 然后将第二次空气干燥后的所得产物烧制，将作为厚膜的玻璃料铜结合到基材上，将铜颗粒整个烧结成厚膜。 与铜印刷邻接的叠加的硼作为铜上的保护层熔合，允许铜的烧结并与基底结合发生而不会氧化铜。 然后冲洗覆盖未被厚膜占据并且不叠加铜层的衬底的氧化硼，并且与铜结合的硼保持为保护涂层。

公开(公告)号：US4312896A

公开(公告)日：1982-01-26

申请号：US126396

申请日：1980-03-03

Applicant: Harris W. Armstrong

Inventor： Harris W. Armstrong

IPC: B23K35/00 ,  C04B41/51 ,  C04B41/88 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28 ,  H05K3/40 ,  H05K3/12

CPC classification number: C04B41/88 ,  B23K35/001 ,  C04B41/009 ,  C04B41/5144 ,  H05K1/092 ,  H05K3/28 ,  H05K1/0306 ,  H05K2201/017 ,  H05K2203/1105 ,  H05K2203/125 ,  H05K3/4007 ,  Y10T29/49149 ,  Y10T29/49155

Abstract: A novel process for fastening ceramic material such as alumina or the like to metallic material such as an electrical conductor. The process is characterized by the fact that a solder wettable, oxidation-resistant barrier is used, on metal particles printed onto the ceramic. In some advantageous processes, the carbide layer allows metallizing processes to be carried out in non-hydrogen atmospheres. The process requires no expensive noble metal; and it utilizes a barrier material which is sufficiently stable to tolerate conductive film formation at high temperatures. Nickel-carbide coated nickel is a particularly favorable material for use in the invention because it is conductive, in the ohmic sense, and is readily wetted by common solders.Also disclosed are novel articles and compositions useful in practice of the process of the invention, and novel articles produced by the process of the invention.

Abstract translation: 用于将诸如氧化铝等的陶瓷材料紧固到诸如电导体的金属材料的新颖方法。 该方法的特征在于，在印刷在陶瓷上的金属颗粒上使用焊料可湿性，抗氧化屏障。 在一些有利的方法中，碳化物层允许金属化方法在非氢气氛中进行。 该方法不需要昂贵的贵金属; 并且使用足够稳定的耐受高温导电膜形成的阻挡材料。 镍碳化物涂覆的镍是用于本发明的特别有利的材料，因为它在欧姆意义上是导电的，并且容易被普通焊料润湿。 还公开了可用于实践本发明方法的新型制品和组合物，以及通过本发明方法制备的新型制品。

公开(公告)号：US09905928B2

公开(公告)日：2018-02-27

申请号：US14268082

申请日：2014-05-02

Applicant: L. Pierre de Rochemont

Inventor： L. Pierre de Rochemont

IPC: H01Q15/02 ,  H01Q9/04 ,  B82Y30/00 ,  H01C7/00 ,  H01C17/00 ,  H01C17/065 ,  H01G4/10 ,  H01G4/33 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q15/00 ,  H01L23/64 ,  H01L23/498 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/20

CPC classification number: H01Q9/0414 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q15/0086 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T428/12493

Abstract: An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

公开(公告)号：US09711386B2

公开(公告)日：2017-07-18

申请号：US14336717

申请日：2014-07-21

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Zheng Yuan

IPC: H01L21/683 ,  H05K3/10 ,  H05K3/28 ,  H05K1/03 ,  H05K1/16

CPC classification number: H01L21/6833 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2203/0195 ,  H05K2203/1338 ,  Y10T29/49155

Abstract: Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member is fabricated from one of a ceramic material or glass.