公开(公告)号：US08921706B2

公开(公告)日：2014-12-30

申请号：US13823700

申请日：2010-10-01

Applicant: Mitsuaki Toda ,  Yoshio Imamura ,  Takuya Hasegawa

Inventor： Mitsuaki Toda ,  Yoshio Imamura ,  Takuya Hasegawa

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/32 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

Abstract translation: 部件嵌入式基板包括树脂电绝缘基座（11），嵌入在绝缘基座（11）中的电气或电子嵌入式部件（8）和虚拟嵌入部件（7），形成有导体图案（18） 在所述绝缘基体（11）的至少一侧上并且直接连接到所述嵌入部件（8）和所述虚拟嵌入部件（7）的连接层（6）或间接连接，以及形成在所述绝缘基体 并且当形成导体图案（18）时用作参考，从而能够提高导体图案（18）相对于嵌入部件（8）的位置精度。

公开(公告)号：US20130115428A1

公开(公告)日：2013-05-09

申请号：US13808580

申请日：2010-09-09

Applicant: Jae Ku Kim

Inventor： Jae Ku Kim

IPC: H01B17/14 ,  H01B19/00 ,  H05K1/11

CPC classification number: H01B17/14 ,  B81C2203/054 ,  C23F1/02 ,  C23F1/18 ,  G02F1/13452 ,  H01B19/00 ,  H05K1/02 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2201/2036 ,  Y10T29/303 ,  Y10T29/49227 ,  Y10T428/24488 ,  Y10T428/31678

Abstract: The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.

Abstract translation: 根据本发明的一个实施例的基板间隙支撑件（30）包括具有六面体形状并由绝缘体制成的主体（31），安装在主体（31）的相对侧表面上的金属箔（32a）和（32b） ）露出两侧面的上部并覆盖两个侧面的下部，以及安装在主体（31）的底面的基板（210）。 根据本发明，间隙支撑件可以通过自动化工艺制造，从而精确地控制尺寸。 由于间隙支撑体附着在基板的表面上，所以发生高度差异的可能性很小。 而且，由于间隙支架可以安装在自动化过程中，因此适用于批量生产过程。

公开(公告)号：US08395407B2

公开(公告)日：2013-03-12

申请号：US12958869

申请日：2010-12-02

Applicant: Swen Weitemeier ,  Christian Oldendorf

Inventor： Swen Weitemeier ,  Christian Oldendorf

IPC: G01R31/28

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: An electronic device, and associated method, provided with a circuit board (10) with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM), and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one inductive element, which is formed by a conductor wire (201) wound into a coil around a break (202) in the circuit board (10), which in the assembled condition, is penetrated by a ferromagnetic bar or fixing pin (203), such that the inductance of the inductive element in the assembled state differs from the inductance thereof in the disassembled state.

Abstract translation: 一种具有电路板（10）的电子设备和相关方法，所述电路板具有一组输入触点（IN / COM），一组输出触点（OUT / COM）和连接在输入触点之间的电路（18） （IN / COM）和输出触点（OUT / COM）和控制器。 控制器使用引入到电路中的测试信号来执行电路板的实时测试，电路（18）被设计为具有特征传递函数并具有至少一个电感元件的无源网络，其中 由绕在电路板（10）中的断路（202）周围卷绕成线圈的导体线（201）形成，在组装状态下，该导体线被铁磁棒或固定销（203）穿透，使得电感 在组装状态下的电感元件与其分解状态下的电感不同。

公开(公告)号：US20120103674A1

公开(公告)日：2012-05-03

申请号：US12941985

申请日：2010-11-08

Applicant: MENG-CHE YU

Inventor： MENG-CHE YU

IPC: H05K1/11

CPC classification number: H05K3/4015 ,  G11C29/24 ,  H05K1/141 ,  H05K3/4046 ,  H05K2201/10204 ,  H05K2201/10409 ,  H05K2203/162

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract translation: 虚拟存储卡包括电路板和金手指板。 电路板包括连接到第一电负载的第一导电元件和第二导电元件。 金手指板从电路板延伸并插入主板的存储槽中。 金指板包括第一电源引脚和第一接地引脚。 第一导电元件电连接到第一电源引脚。 第二导电元件电连接到第二电源引脚。

公开(公告)号：US08153903B2

公开(公告)日：2012-04-10

申请号：US12328955

申请日：2008-12-05

Applicant: Akihiko Kanouda ,  Ryuji Kurihara ,  Fusao Sakuramori ,  Takeshi Mochizuki ,  Yoshihiko Sugawara ,  Masami Joraku

Inventor： Akihiko Kanouda ,  Ryuji Kurihara ,  Fusao Sakuramori ,  Takeshi Mochizuki ,  Yoshihiko Sugawara ,  Masami Joraku

IPC: H05K7/20 ,  H05K7/00 ,  H05K5/00 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K7/142 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/3447 ,  H05K5/02 ,  H05K7/20963 ,  H05K2201/10204 ,  H05K2201/2036

Abstract: In a circuit board disposed in parallel to a fixing plane, a guard spacer (abutting member) is disposed on a multi-layer printed circuit board on the side of the fixing plane to suppress deformation of the multi-layer printed circuit board to prevent short circuit if an impact is applied to the circuit board. The guard spacer may be a dummy electronic component or a plate member. An image display using the circuit board is also disclosed.

Abstract translation: 在与固定平面平行设置的电路板中，在固定平面侧的多层印刷电路板上设置防护间隔物（抵接构件），以抑制多层印刷电路板的变形，防止短路 电路如果对电路板施加冲击。 防护间隔件可以是虚拟电子部件或板部件。 还公开了使用电路板的图像显示。

公开(公告)号：US08056795B2

公开(公告)日：2011-11-15

申请号：US12511951

申请日：2009-07-29

Applicant: Corey A. Peterson

Inventor： Corey A. Peterson

IPC: B23K1/00 ,  B23K5/00 ,  G01N11/00

CPC classification number: H05K3/3489 ,  B23K3/082 ,  H05K2201/10204 ,  H05K2203/0169 ,  H05K2203/162

Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.

Abstract translation: 提供了流量计系统和方法。 流量计包括框架，设置在框架中的模拟电路板，并且具有形成在其中的多个孔，其大致横向于板的平面和盖。 盖子被接收在模拟电路板上的框架上，并且包括模拟延伸到模拟电路板的孔中的引线的几个突起。 流量计还包括设置在模拟电路板和盖之间的指示片，突出部延伸穿过指示片。

公开(公告)号：US20110133752A1

公开(公告)日：2011-06-09

申请号：US12958982

申请日：2010-12-02

Applicant: Swen Weitemeier ,  Christian Oldendorf

Inventor： Swen Weitemeier ,  Christian Oldendorf

IPC: G01R27/28

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: An electronic device, and associated method, provided with a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one capacitive element, wherein the capacitive element is a conductor surface (221) forming a capacitor in the assembled state with a corresponding, device-side conductor surface (222″), which is connected to the electrical circuit (18) via a contact element in the assembled state, whereby the capacitive value of the capacitive element in the assembled state differs from the capacitive value of the capacitive element in the disassembled state.

Abstract translation: 一种具有电路板（10）的电子设备和相关方法，具有一组输入触点（IN / COM），一组输出触点（OUT / COM）和连接在输入端之间的电路（18） 触点（IN / COM）和输出触点（OUT / COM）和控制器。 控制器使用引入电路的测试信号对电路板进行实时测试，电路（18）被设计为具有特征传递函数并具有至少一个电容元件的无源网络，其中 所述电容元件是在组装状态下形成电容器的导体表面（221），该电容器与相应的器件侧导体表面（222“）形成，所述导体表面（222”）在组装状态下通过接触元件连接到电路（18） 由此，组装状态下的电容元件的电容值与分解状态下的电容元件的电容值不同。

公开(公告)号：US20110006405A1

公开(公告)日：2011-01-13

申请号：US12818331

申请日：2010-06-18

Applicant: Keiichi YAMAMOTO ,  Takashi FUKUDA

Inventor： Keiichi YAMAMOTO ,  Takashi FUKUDA

IPC: H01L23/00 ,  H01L21/71

CPC classification number: H05K1/0271 ,  H01L23/498 ,  H01L23/562 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/09909 ,  H05K2201/10204 ,  H05K2201/10689 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, an electronic component and a resin member. The substrate has a first electrode. The electronic component is provided on the substrate, and has a second electrode electrically connected to the first electrode. The resin member alleviates an external stress to the second electrode of the electronic component. The resin member is disposed on the substrate at a region separated from the electronic component.

Abstract translation: 半导体器件包括基板，电子部件和树脂部件。 基板具有第一电极。 电子部件设置在基板上，并且具有与第一电极电连接的第二电极。 树脂构件减轻对电子部件的第二电极的外部应力。 树脂构件在与电子部件分离的区域处设置在基板上。

公开(公告)号：US20100073022A1

公开(公告)日：2010-03-25

申请号：US12628276

申请日：2009-12-01

Applicant: Ted R. Schnetker

Inventor： Ted R. Schnetker

IPC: G01R31/26

CPC classification number: H05K1/0268 ,  H01L23/3128 ,  H01L2224/48091 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/10204 ,  H05K2201/10734 ,  H05K2203/163 ,  H01L2924/00014

Abstract: A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip.

Abstract translation: 监视系统包括焊接到印刷电路板的监视器芯片或芯片。 通过与显示器芯片镜像功能IC芯片接口，可以容易地确定基于通过监视芯片实际经历的使用寿命的功能IC芯片的消耗和剩余的热和/或振动疲劳寿命。 监视器芯片包括监视互连和/或电路，其确定监视器芯片的故障开放焊接终端的数量和/或位置。

公开(公告)号：US20100071207A1

公开(公告)日：2010-03-25

申请号：US12545371

申请日：2009-08-21

Applicant: Woo-suk CHOI ,  Deok-heung KIM

Inventor： Woo-suk CHOI ,  Deok-heung KIM

IPC: H05K3/10 ,  B05C13/02

CPC classification number: H05K3/0085 ,  B65H18/103 ,  B65H23/188 ,  B65H2301/522 ,  B65H2701/1752 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2201/10204 ,  H05K2203/1545

Abstract: Provided are an apparatus for roll-to-roll manufacturing of semiconductor parts and a method of the roll-to-roll manufacturing. The apparatus includes a material supplying unit continuously supplying a material, a processing unit processing the material supplied by the material supplying unit, a transferring unit transferring the material, a tension adjusting unit adjusting tension of the material in a direction in which the material is being transferred; and a connection operating unit, which is disposed between the material supplying unit and the processing unit, attaching a leading board to a leading portion of the material.

Abstract translation: 提供了一种用于半导体部件的卷对卷制造的设备和卷对卷制造的方法。 该设备包括连续供应材料的材料供应单元，处理由材料供应单元供应的材料的处理单元，转移材料的转移单元，调节材料沿材料方向的张力的张力调节单元 转入; 以及连接操作单元，其设置在所述材料供应单元和所述处理单元之间，将前导板附接到所述材料的前端部分。