公开(公告)号：US20090269976A1

公开(公告)日：2009-10-29

申请号：US12108010

申请日：2008-04-23

Applicant: Brian Patrick Costello

Inventor： Brian Patrick Costello

IPC: H01R31/08 ,  H05K7/00

CPC classification number: H01R12/52 ,  H01R12/585 ,  H05K1/142 ,  H05K3/308 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/1059

Abstract: A bridge connector that is configured to electrically and mechanically couple first and second circuit boards is provided. Each circuit board includes a board surface having through-holes. The connector includes a housing having a coupling side configured to interface with the board surfaces when the housing is coupled to the first and second circuit boards. The connector also includes a plurality of bridge contacts that are held within the housing. Each contact includes tail portions that project from the coupling side. Each tail portion is configured to form an interference fit with a corresponding through-hole in order to couple the first and second circuit boards. The tail portions are arranged to hold the first and second circuit boards along the coupling side.

Abstract translation: 提供了一种被配置为电和机械地耦合第一和第二电路板的桥连接器。 每个电路板包括具有通孔的电路板表面。 连接器包括壳体，该壳体具有联接侧，当壳体联接到第一和第二电路板时，耦合侧被配置为与板表面接合。 连接器还包括保持在壳体内的多个桥接触头。 每个触点包括从耦合侧突出的尾部。 每个尾部构造成与对应的通孔形成过盈配合，以便联接第一和第二电路板。 尾部布置成沿联接侧保持第一和第二电路板。

公开(公告)号：US07414228B2

公开(公告)日：2008-08-19

申请号：US10550576

申请日：2004-04-09

Applicant: Haruo Suenaga ,  Hideaki Moriya ,  Hisashi Morikawa ,  Shinichi Sakai ,  Makoto Mihara ,  Nobuo Shirokawa ,  Toyotsubu Matsukura ,  Masato Matsuda

Inventor： Haruo Suenaga ,  Hideaki Moriya ,  Hisashi Morikawa ,  Shinichi Sakai ,  Makoto Mihara ,  Nobuo Shirokawa ,  Toyotsubu Matsukura ,  Masato Matsuda

IPC: H05B6/68

CPC classification number: H05B6/666 ,  H01L2924/0002 ,  H05K1/18 ,  H05K2201/10363 ,  H01L2924/00

Abstract: There is constructed a constitution such that a shunt resistor 30 is interposed in series with a portion capable of measuring an output current of a unidirectional power source portion 1 of a high frequency heating apparatus and a voltage generated at the shunt resistor 30 is outputted by a buffer 31. Further, an operational amplifier 3101 having a high input impedance is used for the buffer 31. Further, a diode bridge 101 and a semiconductor switching element 205 are fixed to a common heat radiating plate 33, the heat radiating plate 33 is formed with a notched portion 33a to thereby ensure insulating distances to the diode bridge 101 and the semiconductor switching element 205, and the shunt resistor 30 is arranged on a straight line the same as that between the diode bridge 101 and the semiconductor switching element 205.

Abstract translation: 构成为使得分流电阻器30与能够测量高频加热装置的单向电源部分1的输出电流的部分串联插入并且在分流电阻器30上产生的电压被输出的结构 缓冲区31。 此外，缓冲器31使用具有高输入阻抗的运算放大器3101。 此外，二极管电桥101和半导体开关元件205固定到公共散热板33上，散热板33形成有切口部分33a，从而确保到二极管电桥101和半导体开关元件的绝缘距离 205，并且分流电阻器30布置在与二极管电桥101和半导体开关元件205之间的直线相同的直线上。

公开(公告)号：US20080059685A1

公开(公告)日：2008-03-06

申请号：US11759238

申请日：2007-06-07

Applicant: SHOU-KUO HSU ,  CHENG-SHIEN LI

Inventor： SHOU-KUO HSU ,  CHENG-SHIEN LI

IPC: G06F13/36

CPC classification number: G06F13/4068 ,  G06F2213/0024 ,  H05K1/029 ,  H05K1/0295 ,  H05K2201/10363

Abstract: A motherboard includes a chipset, a first connector pad suitable for receiving a first type of PCI connector, a second connector pad suitable for receiving a second type of PCI connector, a plurality of first transmission lines, a plurality of second transmission lines, and a plurality of areas for mounting switches. One end of each first transmission line is connected to the chipset, another end of each first transmission line is connected to an end of a corresponding area, one end of each second transmission line is connected to another end of the corresponding area, another end of each second transmission line is connected to the second connector pad, the first connector pad is connected to the plurality of first transmission lines, and the switches are selectively mounted on the plurality of areas.

Abstract translation: 主板包括芯片组，适于接收第一类型的PCI连接器的第一连接器焊盘，适于接收第二类型的PCI连接器的第二连接器焊盘，多个第一传输线，多条第二传输线，以及 多个安装开关的区域。 每个第一传输线的一端连接到芯片组，每个第一传输线的另一端连接到相应区域的一端，每个第二传输线的一端连接到相应区域的另一端，另一端 每个第二传输线连接到第二连接器焊盘，第一连接器焊盘连接到多个第一传输线，并且开关选择性地安装在多个区域上。

公开(公告)号：US20060272852A1

公开(公告)日：2006-12-07

申请号：US11146316

申请日：2005-06-03

Applicant: Patrick Carrier ,  John Loffink

Inventor： Patrick Carrier ,  John Loffink

IPC: H05K7/06 ,  H03H7/38

CPC classification number: G06F13/4086 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/025 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/10363

Abstract: The present invention provides a matched-impedance jumper that is operable to connect pairs of differential signal conductors to provide improved signal transmission characteristics. In an embodiment of the invention, the impedance-matched jumper is used to connect a first pair of differential signal conductors to a selected pair of differential signal conductors selected from a plurality of second pairs of differential signal conductors. The impedance-matched jumper comprises a plurality of input pins that are operable to connect with a plurality of connection pads on the first pair of differential signal conductors and a plurality of output pins operable to connect with a plurality of connection pads on the predetermined second pair of differential signal conductors. A plurality of internal conductors are operably connected to the input pins and the output pins to define a signal path therebetween. The signal path defined by the input pins, the output pins, and the internal conductors provides an impedance-matched passthrough for differential signals.

Abstract translation: 本发明提供一种匹配阻抗跳线，其可操作以连接差分信号导体对以提供改进的信号传输特性。 在本发明的一个实施例中，阻抗匹配的跳线用于将第一对差分信号导体连接到从多个第二对差分信号导体中选择的一对差分信号导体。 阻抗匹配跳线包括多个输入引脚，其可操作以与第一对差分信号导体上的多个连接焊盘连接，并且多个输出引脚可操作以与预定第二对上的多个连接焊盘连接 的差分信号导体。 多个内部导体可操作地连接到输入引脚和输出引脚以在其间限定信号路径。 由输入引脚，输出引脚和内部导体定义的信号路径为差分信号提供阻抗匹配的直通。

公开(公告)号：US20060172614A1

公开(公告)日：2006-08-03

申请号：US11051393

申请日：2005-02-03

Applicant: Sang Ta

Inventor： Sang Ta

IPC: H01R4/48

CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K2201/09963 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2203/173

Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said Blocks, when joined together with other Blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other Blocks.

Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于并且可重用于原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

公开(公告)号：US20060121778A1

公开(公告)日：2006-06-08

申请号：US11269686

申请日：2005-11-09

Applicant: Jen-Yuan Huang

Inventor： Jen-Yuan Huang

IPC: H01R31/08

CPC classification number: H05K3/222 ,  H01R31/08 ,  H05K2201/10363

Abstract: A jumper device includes a jumper and a connecting member. In this case, one end of the connecting member connects with the jumper device. Another end of the connecting member has at least one connecting portion. A jumper assembly including the jumper device is also provided.

Abstract translation: 跳线装置包括跳线和连接构件。 在这种情况下，连接构件的一端与跳线装置连接。 连接构件的另一端具有至少一个连接部。 还提供了包括跳线装置的跳线组件。

公开(公告)号：US20050224932A1

公开(公告)日：2005-10-13

申请号：US11134693

申请日：2005-05-20

Applicant: Eddy Vanhoutte ,  Gilbert De Clercq

Inventor： Eddy Vanhoutte ,  Gilbert De Clercq

IPC: H01R11/01 ,  B23K1/20 ,  B23K31/02 ,  B23K35/14 ,  H01L23/02 ,  H01L23/48 ,  H01R4/00 ,  H01R4/02 ,  H01R12/52 ,  H01R43/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/526 ,  H01R4/02 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/3489 ,  H05K3/4046 ,  H05K2201/10363 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.

公开(公告)号：US20040253850A1

公开(公告)日：2004-12-16

申请号：US10865852

申请日：2004-06-14

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Tsutomu Naitou ,  Tatsuya Oka

IPC: H01R012/00

CPC classification number: H05K7/026 ,  H01R12/52 ,  H01R12/523 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10363 ,  Y10S439/949

Abstract: The invention relates to an electrical connector housing having a first casing, a second casing and a sidewall, and including a first printed circuit board and a second printed circuit board superposed with a given space. The first printed circuit board includes at least a first conductor and the second printed circuit board includes at least a second conductor. The electrical connector housing further includes a connector-receiving portion projecting from the sidewall and placed at a position between the first and second printed circuit boards. The first conductor on the first printed circuit board is connected to a first terminal device, while the second conductor on the second printed circuit board is connected to a second terminal device, and the first and second terminal devices protrude at the connector-receiving portion, so that they are adapted to connect to a terminal of an outside connector to be inserted into the connector-receiving portion.

Abstract translation: 本发明涉及具有第一壳体，第二壳体和侧壁的电连接器壳体，并且包括叠置有给定空间的第一印刷电路板和第二印刷电路板。 第一印刷电路板包括至少第一导体，第二印刷电路板包括至少第二导体。 电连接器壳体还包括从侧壁突出并放置在第一和第二印刷电路板之间的位置的连接器接收部分。 第一印刷电路板上的第一导体连接到第一终端装置，而第二印刷电路板上的第二导体连接到第二终端装置，并且第一和第二终端装置在连接器接收部分突出， 使得它们适于连接到要插入到连接器接收部分中的外部连接器的端子。

公开(公告)号：US5801601A

公开(公告)日：1998-09-01

申请号：US789749

申请日：1997-01-27

Applicant: Christopher R. Gayle

Inventor： Christopher R. Gayle

IPC: H01P7/00 ,  H05K1/02 ,  H05K3/22 ,  H01P1/18

CPC classification number: H05K1/0248 ,  H01P7/00 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09336 ,  H05K2201/10174 ,  H05K2201/10363 ,  H05K3/222

Abstract: A printed circuit board with a microstrip radio frequency delay line deposited thereon. In addition, a plurality of delay line segments are deposited on the board in close proximity to one end of the delay line. To achieve an overall desired delay length, one of the delay line segments is selected and serially inserted in circuit with the delay line by populating a surface mount circuit element between terminals at the ends of the delay line and the selected delay line segment.

Abstract translation: 具有沉积在其上的微带射频延迟线的印刷电路板。 此外，多个延迟线段沉积在板上，紧邻延迟线的一端。 为了实现总体期望的延迟长度，通过在延迟线的端部和所选择的延迟线段的端子之间填充表面安装电路元件，选择一个延迟线段并且与延迟线串联插入到电路中。

公开(公告)号：US5416274A

公开(公告)日：1995-05-16

申请号：US156915

申请日：1993-11-24

Applicant: Kiyohiko Ushiyama ,  Shizunori Mitsuma

Inventor： Kiyohiko Ushiyama ,  Shizunori Mitsuma

IPC: H05K1/11 ,  H05K3/22 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K3/222 ,  H05K3/4685 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: An object of this invention is to provide a circuit board low in manufacturing cost in which aimed circuit patterns having a circuit gap therebetween can be short-circuited substantially irrespective of the length of the circuit gap while being insulated from other circuit patterns which are laid in the circuit gap. In a circuit board on which a plurality of circuit patterns are arranged, a selected one of circuit patterns is cut to have a circuit gap where the selected circuit pattern is laid across the remaining circuit patterns, in such a manner that the circuit gap divides the selected circuit patterns into two parts, a conductor formed by cutting a wire to the length of the circuit gap bridges the circuit gap, to short-circuit the two parts thereby to complete the selected circuit pattern, the conductor being insulated from the remaining circuit patterns laid across the circuit gap.

Abstract translation: 本发明的目的是提供一种制造成本低的电路板，其中具有电路间隙的目标电路图案可以与电路间隙的长度基本上短路，同时与放置在其中的其它电路图案绝缘 电路间隙。 在其上布置多个电路图形的电路板中，选择的一个电路图案被切割成具有电路间隙，其中所选择的电路图案跨越剩余的电路图案，使得电路间隙将 所选择的电路图案分成两部分，通过将线切割到电路间隙的长度而形成的导体桥接电路间隙，使两部分短路，从而完成所选择的电路图案，导体与剩余电路图案绝缘 跨越电路间隙。