Abstract:
A chemical mechanical polishing process for the formation of self-aligned gate structures surrounding an electron emission tip for use in field emission displays in which the emission tip is i) optionally sharpened through oxidation, ii) deposited with a conformal insulating material, iii) deposited with a flowable insulating material, which is reflowed below the level of the tip, iv) optionally deposited with another insulating material, v) deposited with a conductive material layer, and vi) optionally, deposited with a buffering material, vii) planarized with a chemical mechanical planarization (CMP) step, to expose the conformal insulating layer, viii) wet etched to remove the insulating material and thereby expose the emission tip, afterwhich ix) the emitter tip may be coated with a material having a lower work function than silicon.
Abstract:
The invention relates to a field-emission electron gun comprising an electron emission tip, an extractor anode, as well as a means for creating an electric-potential difference between the emission tip and the extractor anode. The emission tip comprises a metal tip and an end cone produced by chemical vapour deposition on a nanofilament, the cone being aligned and welded onto the metal tip. The invention can be used for a transmission electron microscope.
Abstract:
An electron emission element capable of improving the focusing performance of emitted electrons. The electron emission element comprises a cathode electrode, an insulation layer, and an electron drawing electrode that are laminated in that order on a substrate, and an electron emission layer provided on the bottom surface of a hole reaching from the drawing electrode up to the cathode electrode with which the electron emission layer contacts, wherein the electron emission layer is provided so that the front surface thereof is closer to the substrate than the interface between the cathode electrode and the insulation layer, and the contact area between the electron emission layer and the cathode electrode is limited to a peripheral area, excluding the center portion, on the bottom surface of the hole. Accordingly, since the electron emission layer receives electrons from the cathode electrode positioned at the side surface thereof, electrons are mostly emitted from the ends of the front surface of the electron emission layer to thereby enhance the focusing performance of electrons.
Abstract:
The present invention relates to an improved technique of an image display apparatus and a method for manufacturing the image display apparatus. The image display apparatus of the present invention is composed of a rear plate and a face plate disposed opposite to each other, the rear plate being equipped with a plurality of electron-emitting devices, each provided with a pair of electrodes and an electroconductive film including an electron-emitting region disposed between the electrodes, the face plate being equipped with a phosphor for displaying an image by being irradiated by electrons from the electron-emitting devices and a film exposed on a surface of the phosphor, the film comprising a metal or a metal compound material. The improved respects are that a film comprising the same metal or the same metal compound material as the metal or the metal compound material constituting the film exposed on the surface of the phosphor, the film formed on each of the electroconductive films of the plurality of electron-emitting devices to have a thickness in a range from 0.2 nm to 4.5 nm. Thereby, it is possible to provide an image display apparatus capable of keeping the homogeneity of brightness over a long period.
Abstract:
A method of forming a field emission device and the resulting device including emitters formed of fiber segments. Tips are formed on the fiber segments that have a radius substantially small by exposing the tips to a reactive liquid for a duration of time. The tips are coated with a low work function conducting material to form emitters.
Abstract:
The work function of electron emitters can be modified by forming a modifying layer at the surface using low energy ion implantation, in a controlled environment, placing chosen elements below the surface of electron emitters as Cs implanted in Si(100) at four different doses illustrates. Sometimes implanted species are deep enough that they do not react with the atmosphere during subsequent low-temperature processing. Then, species implanted in the emitting surfaces are segregated using elevated temperature treatment of the emitters in vacuum and/or reactive gases. The implanted ions modify the work function at the surface, via thin layers of the implanted species on top of the emitter surfaces, or compounds or alloy layers at the surface of the emitters. Depending on the implanted species, the initial emitter material, and the environment, these layers can either increase or decease the work function of the emitter.
Abstract:
A withdrawn electrode is formed on a silicon substrate with intervention of upper and lower silicon oxide films each having circular openings corresponding to regions in which cathodes are to be formed. Tower-shaped cathodes are formed in the respective openings of the upper and lower silicon oxide films and of the withdrawn electrode. Each of the cathodes has a sharply tapered tip portion having a radius of 2nm or less, which has been formed by crystal anisotropic etching and thermal oxidation process for silicon. The region of the silicon substrate exposed in the openings of the upper and lower silicon oxide films and the cathode have their surfaces coated with a thin surface coating film made of a material having a low work function such that a high-concentration impurity layer is formed as an emission layer of the cathode in a surface region thereof and contains a charge carrier concentration higher than the charge carrier concentration of the substrate.
Abstract:
A withdrawn electrode is formed on a silicon substrate with intervention of upper and lower silicon oxide films each having circular openings corresponding to regions in which cathodes are to be formed. Tower-shaped cathodes are formed in the respective openings of the upper and lower silicon oxide films and of the withdrawn electrode. Each of the cathodes has a sharply tapered tip portion having a radius of 2 nm or less, which has been formed by crystal anisotropic etching and thermal oxidation process for silicon. The region of the silicon substrate exposed in the openings of the upper and lower silicon oxide films and the cathode have their surfaces coated with a thin surface coating film made of a material having a low work function.