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    METHOD FOR ZINC COATING ALUMINUM
    171.
    发明申请
    METHOD FOR ZINC COATING ALUMINUM 审中-公开
    锌涂层铝的方法

    公开(公告)号：WO2005080633A3

    公开(公告)日：2006-02-09

    申请号：PCT/US2005004932

    申请日：2005-02-16

    Applicant: TYCO PRINTED CIRCUIT GROUP LP

    Inventor： STRUBBE JOHN L

    IPC: C23C18/18 ,  B05D5/12 ,  C23C18/16 ,  C23C18/31 ,  C23C22/66 ,  C23F1/20 ,  C23G1/12 ,  C25D5/44 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

    CPC classification number: C23C18/31 ,  C23C18/1653 ,  C23C18/1844 ,  C23C22/66 ,  C23F1/20 ,  C23G1/125 ,  C25D5/44 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/09554

    Abstract: This invention is a zincating process of aluminum surfaces for subsequent plating in which the aluminum surfaces are cleaned, contacted with an acidic etching solution comprising a peroxygen compound, the acidic etching solution being substantially free of corrosive nitrate compounds, and contacting the aluminum surfaces with a zincate solution containing 6-60 g/1 zinc and 100-500 g/1 hydroxide ion. The acidic etching solution is substantially free of toxic inorganic fluoride compounds in order to simplify waste treatment. This invention may be understood with reference to Figure 2, in particular Step 6.

    Abstract translation: 本发明是用于后续电镀的铝表面的锌化工艺，其中铝表面被清洁，与包含过氧化合物的酸性蚀刻溶液接触，酸性蚀刻溶液基本上不含腐蚀性硝酸盐化合物，并使铝表面与 含有6-60g / l锌和100-500g / l氢氧化物离子的锌酸盐溶液。 酸性蚀刻溶液基本上不含有毒的无机氟化物，以简化废物处理。 可以参考图2，特别是步骤6来理解本发明。

    METHOD OF ELECTROPLATING ON ALUMINUM
    172.
    发明申请
    METHOD OF ELECTROPLATING ON ALUMINUM 审中-公开
    在铝上电镀的方法

    公开(公告)号：WO2005080633A2

    公开(公告)日：2005-09-01

    申请号：PCT/US2005/004932

    申请日：2005-02-16

    Applicant: TYCO PRINTED CIRCUIT GROUP LP

    Inventor： STRUBBE, John, L.

    IPC: C23C18/18

    CPC classification number: C23C18/31 ,  C23C18/1653 ,  C23C18/1844 ,  C23C22/66 ,  C23F1/20 ,  C23G1/125 ,  C25D5/44 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/09554

    Abstract: This invention is a zincating process of aluminum surfaces for subsequent plating in which the aluminum surfaces are cleaned, contacted with an acidic etching solution comprising a peroxygen compound, the acidic etching solution being substantially free of corrosive nitrate compounds, and contacting the aluminum surfaces with a zincate solution containing 6-60 g/1 zinc and 100-500 g/1 hydroxide ion. The acidic etching solution is substantially free of toxic inorganic fluoride compounds in order to simplify waste treatment. This invention may be understood with reference to Figure 2, in particular Step 6.

    Abstract translation: 本发明是用于后续电镀的铝表面的锌化工艺，其中铝表面被清洁，与包含过氧化合物的酸性蚀刻溶液接触，酸性蚀刻溶液基本上不含腐蚀性硝酸盐化合物，并使铝表面与 含有6-60g / l锌和100-500g / l氢氧化物离子的锌酸盐溶液。 酸性蚀刻溶液基本上不含有毒的无机氟化物，以简化废物处理。 可以参考图2，特别是步骤6来理解本发明。

    ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME
    173.
    发明申请
    ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME 审中-公开
    电气电路装置及其组装方法

    公开(公告)号：WO2005039254A3

    公开(公告)日：2005-06-16

    申请号：PCT/US2004030755

    申请日：2004-09-17

    Applicant: MOTOROLA INC ,  WALDVOGEL JOHN M ,  BIELICK BRIAN R ,  MILLER HERMAN J ,  VAN CANNON BILLY J

    Inventor： WALDVOGEL JOHN M ,  BIELICK BRIAN R ,  MILLER HERMAN J ,  VAN CANNON BILLY J

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K7/20

    CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

    Abstract translation: 一种电路设备（300），包括：具有接地层（336），至少一个器件孔（332）和至少一个焊料孔（334）的衬底（330）; 散热器（310）; 以及用于将所述散热器机械耦合到所述基板的接地层的粘合剂层（320），使得所述基板装置孔的至少一部分与所述散热器重叠，所述粘合剂层具有至少一个装置孔和至少一个焊料 孔，其中将所述至少一个衬底焊接孔与所述至少一个粘合剂层焊接孔对准并且将所述至少一个衬底器件孔与所述至少一个粘合剂层器件孔对准使得焊料在所述散热器和所述散热器之间的预定区域中润湿 衬底的接地层。

    ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME
    174.
    发明申请
    ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME 审中-公开
    电路装置和组装该装置的方法

    公开(公告)号：WO2005039254A2

    公开(公告)日：2005-04-28

    申请号：PCT/US2004/030755

    申请日：2004-09-17

    Applicant: MOTOROLA, INC. ,  WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

    Inventor： WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

    IPC: H05K

    CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

    Abstract translation: 一种电路装置（300），包括：具有接地层（336），至少一个器件孔（332）和至少一个焊料孔（334）的衬底（330）; 散热器（310）; 和粘合剂层（320），用于将所述散热器机械地耦合到所述衬底的所述接地层，使得所述衬底器件孔的至少一部分覆盖所述散热器，所述粘合剂层具有至少一个器件孔和至少一种焊料 其中将所述至少一个基板焊料孔与所述至少一个粘合剂层焊料孔对齐并且将所述至少一个基板器件孔与所述至少一个粘合剂层器件孔对准使得焊料在所述散热器和所述散热器之间的预定区域中变湿 衬底的底层。

    MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME
    176.
    发明申请
    MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME 审中-公开
    多层电路组件及其制备方法

    公开(公告)号：WO2002073685A2

    公开(公告)日：2002-09-19

    申请号：PCT/US2002/003488

    申请日：2002-02-05

    Applicant: PPG INDUSTRIES OHIO, INC.

    Inventor： STURNI, Lance C. ,  OLSON, Kevin C.

    IPC: H01L21/48

    CPC classification number: C09D5/4488 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/388 ,  H05K3/426 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0179 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2203/0582 ,  H05K2203/135 ,  H01L2924/00

    Abstract: A process for fabricating a multi-layer circuit assembly is provided. The process generally comprises:(a) providing a perforate electrically conductive core having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter);(b) applying a dielectric coating onto all exposed surfaces of the electrically conductive core to form a conformal coating on all exposed surfaces of the electrically conductive core;(c) ablating the surface of the dielectric coating in a predetermined pattern to expose sections of the electrically conductive core;(d) applying a layer of metal to all surfaces to form metallized vias through the electrically conductive core; and(e) applying a resinous photosensitive layer to the metal layer.The multi-layer circuit assemblies produced by the process, having high via density and thermal coefficients of expansion, are also provided.

    Abstract translation: 提供了一种用于制造多层电路组件的工艺。 该方法通常包括：（a）提供具有500至10,000个孔/平方英寸（75至1550个孔/平方厘米）的通孔密度的穿孔导电芯;（b）将电介质涂层施加到电学上的所有暴露表面上 导电芯，以在导电芯的所有暴露表面上形成保形涂层;（c）以预定图案烧蚀电介质涂层的表面以暴露导电芯的部分;（d）将金属层施加到所有 表面以形成通过导电芯的金属化通孔; 并且（e）将树脂感光层施加到金属层。还提供了具有高通孔密度和热膨胀系数的由该方法生产的多层电路组件。

    PRINTED CIRCUIT BOARD COMPRISING A HEAT DISSIPATING ALUMINIUM PLATE AND A METHOD FOR PRODUCING SAME
    177.
    发明申请
    PRINTED CIRCUIT BOARD COMPRISING A HEAT DISSIPATING ALUMINIUM PLATE AND A METHOD FOR PRODUCING SAME 审中-公开
    WITH A散热铝板印刷电路板及其制造方法

    公开(公告)号：WO01050827A1

    公开(公告)日：2001-07-12

    申请号：PCT/DE2001/000104

    申请日：2001-01-08

    IPC: H05K1/11 ,  H05K3/42 ,  H05K3/44

    CPC classification number: H05K3/44 ,  H05K1/111 ,  H05K3/427 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09745

    Abstract: The invention relates to a printed circuit board comprising a heat dissipating aluminium plate and a method for producing the same. An insulating layer is applied to the aluminium plate and a copper layer is subsequently applied. The aim of the invention is to produce an aluminium plate in a simple manner and by means of the inventive method, whereby a thermal and a galvanic connection is provided between the aluminium plate (1) and the copper layer. According to the invention, an aluminium-zincate layer (11, 12) is produced at least in the area of the galvanic juncture on the aluminium plate (1). A copper coating (13, 14) is applied to said aluminium-zincate layer (11, 12). The copper coating (13, 14) and surface areas adjacent thereto are coated with a copper layer (15, 16), whereby the galvanic juncture is produced.

    Abstract translation: 本发明涉及一种具有散热铝板及其制备的方法的电路板，其中绝缘层被施加到铝板上，然后施加的铜层。 为了制造（13，14），在一个简单的方法这样的方法的铝板与铝板之间的热和电连接（1）和铜层，根据本发明，至少在铝板上的电连接点的区域（1）是铝 形成在铜涂层锌酸盐层（11，12）（13,14）被施加; 铜涂层（13，14）和躺在表面具有涂覆以产生电接头的铜层（15，16）的区域。

    PCB TO METALLIC GROUND CONNECTION METHOD
    178.
    发明申请
    PCB TO METALLIC GROUND CONNECTION METHOD 审中-公开
    PCB到金属接地连接方法

    公开(公告)号：WO99062143A1

    公开(公告)日：1999-12-02

    申请号：PCT/US1999/005318

    申请日：1999-03-11

    IPC: H01R12/04 ,  H01R43/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H01R9/00

    CPC classification number: H05K3/4038 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

    Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

    Abstract translation: 一种用于在印刷电路板（700）和金属基板（200）之间提供电接地连接的方法（100）包括以下步骤：（i）在所述基板（200）中提供孔（204）; （ii）从金属坯料（300）形成接地塞（302）; （iii）将接地插头（300）插入基板（200）中的孔中; （iv）将接地插头（302）压缩到衬底（200）中的孔（204）中; （v）将印刷电路板（700）放置在基板（200）上; 和（vi）将焊料施加到印刷电路板（700）中的孔中并到达接地插头（302）上。 在单次冲压操作（120）中进行形成（104），插入（106）和压缩（108）的步骤。 方法（100）有效地提供高质量的电接地连接，并且避免了对复杂机械的任何需要。

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