公开(公告)号：US07494555B2

公开(公告)日：2009-02-24

申请号：US10945737

申请日：2004-09-20

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: B32B37/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US20080292888A1

公开(公告)日：2008-11-27

申请号：US11597281

申请日：2006-10-20

Applicant: Martyn John Hucker ,  Clyde Warsop

Inventor： Martyn John Hucker ,  Clyde Warsop

IPC: B32B17/06

CPC classification number: B81C1/00103 ,  B81B2201/038 ,  B81B2203/033 ,  B81B2203/0376 ,  B81B2203/0384 ,  B81C2201/034

Abstract: A method of forming a surface of micrometer dimensions conforming to a desired contour for a MEMS device, the method comprising providing a crystalline silicon substrate with a recess in an upper surface, providing a thinner layer of crystalline silicon over the upper surface of the substrate, fusion bonding the layer to the substrate under vacuum conditions, and applying heat to the layer and applying atmospheric pressure on the layer, such as to plastically deform the diaphragm within the recess to the desired contour. The substrate may form the fixed electrode of an electrostatic MEMS actuator, operating on the zip principle.

Abstract translation: 一种形成符合MEMS器件的期望轮廓的微米尺寸表面的方法，所述方法包括在上表面提供具有凹陷的晶体硅衬底，在衬底的上表面上提供更薄的晶体硅层， 在真空条件下将层熔合到衬底上，并且将热量施加到层上并在层上施加大气压力，例如使凹部内的隔膜塑性变形到期望的轮廓。 基板可以形成静电MEMS致动器的固定电极，以拉链原理运行。

公开(公告)号：US20080116608A1

公开(公告)日：2008-05-22

申请号：US12001564

申请日：2007-12-12

Applicant: Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca Jackman ,  Xiao-Mei Zhao ,  Stephen Smith ,  Mara Prentiss ,  George Whitesides ,  Christian Marzolin

Inventor： Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca Jackman ,  Xiao-Mei Zhao ,  Stephen Smith ,  Mara Prentiss ,  George Whitesides ,  Christian Marzolin

IPC: B29C45/16

CPC classification number: B81C1/00206 ,  A61K47/6957 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00416 ,  B01J2219/0043 ,  B01J2219/00466 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00619 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00648 ,  B01J2219/00659 ,  B01J2219/00713 ,  B29C31/04 ,  B29C33/42 ,  B29C37/0053 ,  B29C39/24 ,  B29C43/021 ,  B29C67/246 ,  B29D11/00346 ,  B29D11/00663 ,  B29K2105/0002 ,  B29L2011/0016 ,  B81B2201/0214 ,  B81C1/00031 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y30/00 ,  C40B60/14 ,  G01N21/7703 ,  G01N2021/7776 ,  G02B6/138 ,  H05K3/0079 ,  H05K3/061

Abstract: Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface. Waveguide arrays, combinatorial chemical or biochemical libraris, etc. can be made. Differences in refractive index of waveguide and cladding can be created by subjecting the waveguide and cladding, made of identical prepolymeric material, to different polymerization or cross-linking conditions. Interferometers are defined by coupling arrays of waveguides, where coupling can be controlled by altering the difference in refractive index between cladding and waveguide at any desired location of the array. Alteration and refractive index can be created photochemically, chemically, or the like. Sensors also are disclosed, including biochemical sensors.

Abstract translation: 化学或生物化学活性剂或其它物质通过提供具有轮廓表面的微胶体并在基底表面上形成结构的化学或生物化学活性剂或流体前体而在基底表面上图案化。 化学或生物化学活性剂或流体前体也可以从敷料器中的凹陷转移到基底表面。 衬底表面可以是平面的或非平面的。 聚合物结构，无机陶瓷和盐等的流体前体可用于在表面形成图案化聚合物制品，无机盐和陶瓷，反应离子蚀刻掩模等。 制品可以形成为包括横向尺寸小于约1毫米或更小的部分的图案。 涂抹器的压痕图案可以用于将单独的，不同的化学或生物化学活性剂或流体前体转移到基底表面的分离的，分离的区域。 可以制作波导阵列，组合化学或生化图谱等。 可以通过将由相同的预聚物材料制成的波导和包层进行不同的聚合或交联条件来产生波导和包层的折射率差异。 干涉仪通过耦合波导阵列来定义，其中可以通过改变阵列的任何所需位置处的包层和波导之间的折射率差来控制耦合。 改变和折射率可以通过光化学，化学等方式产生。 还公开了传感器，包括生化传感器。

公开(公告)号：US20080085551A1

公开(公告)日：2008-04-10

申请号：US11697140

申请日：2007-04-05

Applicant: Dong-Sung Kim ,  Tai-Hun Kwon

Inventor： Dong-Sung Kim ,  Tai-Hun Kwon

IPC: C12M1/34 ,  H01L21/77

CPC classification number: C12M3/00 ,  B01F5/0641 ,  B01F13/0059 ,  B01L3/502738 ,  B01L3/502746 ,  B01L3/502753 ,  B01L2200/12 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0867 ,  B01L2400/0406 ,  B01L2400/0487 ,  B01L2400/0688 ,  B81C1/00119 ,  B81C2201/034

Abstract: The present invention is directed to a microfluidic biochip based on an agglutination reaction that is frequently used in qualitative typing in the diagnostic medicine field by realizing a specimen inlet, a reagent inlet, a split microchannel, transfer microchannels, a chaos micromixer, a reaction microchamber, a microfilter, a passive microvalve, and an outlet on a plastic microchip. Particularly, the biochip of the present invention is characterized in that portability thereof is superior and a small amount (about 1 μl) of each of a specimen and a reagent is used. In addition, the biochip of the present invention can be cheaply made through conventional photolithography, electroplating, injection molding, and bonding. Therefore, by utilizing the microfluidic biochip for blood typing according to the present invention, a point-of-care diagnosis for performing blood typing based on an agglutination reaction at any place becomes possible.

Abstract translation: 本发明涉及一种基于凝集反应的微流体生物芯片，其通过实现样品入口，试剂入口，分离微通道，转移微通道，混沌微混合器，反应微室，经常用于诊断医学领域的定性分型 ，微型过滤器，被动微型阀和塑料微芯片上的出口。 特别地，本发明的生物芯片的特征在于其便携性优异，并且使用每个样本和试剂的少量（约1ul）。 此外，本发明的生物芯片可以通过常规的光刻，电镀，注射成型和粘合来廉价制造。 因此，通过利用根据本发明的用于血型分离的微流体生物芯片，可以在任何地方进行基于凝集反应进行血液分型的护理点诊断。

公开(公告)号：US07169314B2

公开(公告)日：2007-01-30

申请号：US10150895

申请日：2002-05-15

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: B81B5/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US07114361B2

公开(公告)日：2006-10-03

申请号：US10660926

申请日：2003-09-12

Applicant: Wen Jin Meng

Inventor： Wen Jin Meng

IPC: B21D22/00

CPC classification number: B81C99/009 ,  B81C1/00619 ,  B81C2201/034

Abstract: An inexpensive method of rapidly fabricating reactive metal (Zn, Al, Al-alloy, etc.) microscale structures including high-aspect-ratio microscale structures is disclosed. A high precision process uses conformal bond inhibitor coating and high temperature compression molding techniques to produce high quality, high aspect ratio metal structures. In one embodiment, following fabrication of an initial metallic microscale mold insert, an adhesion-promoting metal precursor layer and a ceramic bond inhibitor coating are conformally deposited onto the microscale mold insert. The microscale mold insert and a preselected reactive metal are then heated to an optimum temperature and compressed together. The mold insert is then extracted from the molded metal to produce a reverse image of the mold insert.

Abstract translation: 公开了一种快速制造包括高纵横比微结构的反应性金属（Zn，Al，Al-合金等）微结构的廉价方法。 高精度工艺使用保形键合抑制剂涂层和高温压缩成型技术来生产高质量，高纵横比的金属结构。 在一个实施例中，在制造初始金属微量模具插入件之后，将粘附促进金属前体层和陶瓷粘结抑制剂涂层共形沉积到微型模具插入件上。 然后将微型模具插件和预选的活性金属加热至最佳温度并压缩。 然后从模制金属中提取模具插件以产生模具插入件的反向图像。

公开(公告)号：US20060214330A1

公开(公告)日：2006-09-28

申请号：US11436833

申请日：2006-05-18

Applicant: Jarrett Dumond ,  Hong Low

Inventor： Jarrett Dumond ,  Hong Low

IPC: B29C59/02

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: An imprint lithographic method for making a polymeric structure comprising the steps of: (a) providing a mold having a shape forming a mold pattern; (b) providing a substrate having a higher surface energy relative to said mold; (c) providing a polymer film on said mold, said polymer film having a selected thickness, wherein the selected thickness of the polymer film on the mold pattern is capable of forming at least one frangible region in the polymer film having a thickness that is less than the remainder of the polymer film; (d) pressing the mold and the substrate relatively toward each other to form said frangible region; and (e) releasing at least one of said mold and said substrate from the other, wherein after said releasing, said frangible region remains substantially attached to said mold while the remainder of said polymer film forms the polymeric structure attached to said substrate.

Abstract translation: 一种用于制造聚合物结构的压印光刻方法，包括以下步骤：（a）提供具有形成模具图案的形状的模具; （b）提供相对于所述模具具有更高表面能的基底; （c）在所述模具上提供聚合物膜，所述聚合物膜具有选定的厚度，其中模具图案上的聚合物膜的选定厚度能够在聚合物膜中形成至少一个具有较小厚度的易碎区域 比其余的聚合物膜; （d）相对于彼此挤压模具和基板以形成所述易碎区域; 和（e）将所述模具和所述基材中的至少一个从另一个释放，其中在所述释放之后，所述易碎区保持基本上附着到所述模具，而所述聚合物膜的其余部分形成附着到所述基底的聚合物结构。

公开(公告)号：US20060130527A1

公开(公告)日：2006-06-22

申请号：US10557843

申请日：2004-03-22

Applicant: Shuji Tanaka ,  Masayoshi Esashi

Inventor： Shuji Tanaka ,  Masayoshi Esashi

IPC: C03B11/08 ,  B28B7/38 ,  B05D1/36

CPC classification number: B32B18/00 ,  B81C99/009 ,  B81C2201/034 ,  C03B11/082 ,  C03B11/086 ,  C03B2215/22 ,  C03B2215/32 ,  C03B2215/412 ,  C04B35/565 ,  C04B37/001 ,  C04B37/006 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/123 ,  C04B2237/365 ,  C04B2237/568 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708

Abstract: A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.

Abstract translation: 一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。 在这种制造玻璃压模的方法中，通过插入金属薄膜，可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

公开(公告)号：US20050239228A1

公开(公告)日：2005-10-27

申请号：US11172892

申请日：2005-07-05

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Schulz

IPC: G02B3/00 ,  C03B11/00 ,  C03B11/08 ,  C03B23/02 ,  C03B23/025 ,  C03B23/203 ,  C03C19/00 ,  H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将半导体基板与玻璃型基板接合，半导体基板的结构化表面以至少部分重叠的关系连接到玻璃类型表面的表面，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。

公开(公告)号：US06951119B1

公开(公告)日：2005-10-04

申请号：US09889956

申请日：2000-11-23

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

IPC: G02B3/00 ,  C03B11/00 ,  C03B11/08 ,  C03B23/02 ,  C03B23/025 ,  C03B23/203 ,  C03C19/00 ,  C03B23/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type substrate in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将所述半导体基板接合到所述玻璃型基板，所述半导体基板的结构化表面以至少部分重叠的关系与所述玻璃基板的表面接合，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。