公开(公告)号：EP2008346B1

公开(公告)日：2013-02-13

申请号：EP07775101.4

申请日：2007-04-10

Applicant: ADC GmbH

Inventor： HAMMOND, JR., Bernard ,  MURRAY, David P. ,  GEORGE, Ian R.

IPC: H01R24/00 ,  H05K1/02

CPC classification number: H01R13/6466 ,  H01R4/2429 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

公开(公告)号：EP2413673A2

公开(公告)日：2012-02-01

申请号：EP11175657.3

申请日：2011-07-27

Applicant: IN2TEC LIMITED

Inventor： Lewison, John

IPC: H05K1/02 ,  H01B7/08 ,  H01B11/04

CPC classification number: H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09672

Abstract: A wiring system comprises a flexible substrate and at least one pair of conductors deposited on the substrate, wherein the conductors are each arranged in a pattern defining a respective conductive path, and the paths of the pair of conductors are arranged to cross one another at a plurality of crossover points, and wherein the conductors of the or each pair are arranged on the same side of the substrate.

Abstract translation: 一种布线系统包括柔性衬底和沉积在衬底上的至少一对导体，其中每个导体以限定相应导电路径的图案布置，并且所述一对导体的路径布置成在 多个交叉点，并且其中该对或每一对的导体被布置在衬底的相同侧上。

公开(公告)号：EP1215948B1

公开(公告)日：2011-05-25

申请号：EP01129757.9

申请日：2001-12-13

Applicant: DENSO CORPORATION

Inventor： Kondo, Koji ,  Kamiya, Tetsuaki ,  Harada, Toshikazu ,  Onoda, Ryuichi ,  Kamiya, Yasutaka ,  Masuda, Gentaro ,  Yazaki, Yoshitaro ,  Yokochi, Tomohiro

IPC: H05K3/46

CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

公开(公告)号：EP2317600A1

公开(公告)日：2011-05-04

申请号：EP09174761.8

申请日：2009-11-02

Applicant: NXP B.V.

Inventor： Tesson, Olivier

IPC: H01P1/02 ,  H01P3/04 ,  H01P3/02 ,  H05K1/02

CPC classification number: H01P1/02 ,  H01P3/026 ,  H05K1/0245 ,  H05K1/0248 ,  H05K3/4685 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09272

Abstract: An electronic circuit (100), having multiple transmission lines (152, 102). A first and second transmission line (152,102) have a bend (156) where the transmission lines make an angle. The angles have the same magnitude and the same orientation. The first and second transmission line (152, 102) cross (102), and their electrical lengths are equal. Relative phase between multiple interrelated signals transmitted across the multiple transmission lines is preserved as they traverse the bends.

Abstract translation: 一种具有多个传输线（152,102）的电子电路（100）。 第一和第二传输线（152,102）具有传输线形成一个角度的弯曲部（156）。 角度具有相同的大小和相同的方向。 第一和第二传输线（152,102）交叉（102），并且它们的电长度相等。 跨多个传输线路传输的多个相互关联的信号之间的相对相位在它们经过弯曲时被保留。

公开(公告)号：EP1865757B1

公开(公告)日：2011-03-02

申请号：EP06290932.0

申请日：2006-06-06

Applicant: Alcatel Lucent

Inventor： Fossion, Marc Jean Joseph ,  Fossion, Stéphanie Cécile Marie

IPC: H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/097

公开(公告)号：EP2216855A3

公开(公告)日：2010-08-18

申请号：EP10163786.6

申请日：2007-04-10

Applicant: ADC GmbH

Inventor： Hammond, Bernard Jr. ,  Murray, David P. ,  George, Ian R.

IPC: H01R13/719 ,  H01R24/04 ,  H04B3/32

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

公开(公告)号：EP2008345B1

公开(公告)日：2010-06-23

申请号：EP07755200.8

申请日：2007-04-10

Applicant: ADC GmbH

Inventor： HAMMOND, Bernard, Jr. ,  MURRAY, David, P. ,  GEORGE, Ian, R.

IPC: H01R13/719 ,  H04B3/32 ,  H01R24/04

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

公开(公告)号：EP2178154A1

公开(公告)日：2010-04-21

申请号：EP09172550.7

申请日：2009-10-08

Applicant: Robert Bosch GmbH

Inventor： Wizemann, Thomas ,  Neumeister, Jochen ,  Wetzel, Gerhard ,  Fucker, Frank ,  Brandl, Sonja

IPC: H01P3/08 ,  H01P3/02 ,  H05K1/02

CPC classification number: H01P3/088 ,  H01P3/026 ,  H01P11/001 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0393 ,  H05K3/202 ,  H05K2201/055 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09245

Abstract: Die Erfindung betrifft eine elektrische, insbesondere einer Datenübertragung dienende Leitungsanordnung mit mindestens zwei im Wesentlichen parallel geführten elektrischen Leitern. Es ist vorgesehen, dass die Leiter (2) mindestens eine Überkreuzung (7) besitzen.

Abstract translation: 电导体装置（1）具有两个平行的电导体（2）。 导线包括一个横穿（7）。 交叉点形成在导体的电长度（13）的中间电路中。 交叉点具有单独的电连接的导体元件。 导体形成为导体路径。

公开(公告)号：EP2068391A3

公开(公告)日：2010-01-20

申请号：EP08018960.8

申请日：2008-10-30

Applicant: Rohde & Schwarz GmbH & Co. KG

Inventor： Katzer, Michael ,  Reichel, Thomas ,  Peschke, Martin

IPC: H01P3/02 ,  H05K1/02

CPC classification number: H01P3/02 ,  H05K1/0228 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/097

Abstract: Zur Übertragung von elektrischen Signalen wird eine Einrichtung mit einem Substrat (95) und zumindest zwei Streifenleitungen (96, 97) eingesetzt. Die zumindest zwei Streifenleitungen (96, 97) sind dabei an oder in dem Substrat (95) angebracht und weisen mehrere Überkreuzungen auf. Die Überkreuzungen sind in festgelegten Abständen über die Länge der Streifenleitungen (96, 97) verteilt.

公开(公告)号：EP1956877A3

公开(公告)日：2009-10-28

申请号：EP08101303.9

申请日：2008-02-06

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Tanaka, Koichi c/o Shinko Electric Industries Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/462 ,  H05K1/0289 ,  H05K3/4647 ,  H05K2201/09245 ,  H05K2203/0733 ,  H05K2203/1327 ,  Y10T29/49126

Abstract: A multilayer wiring board (40) includes at least two wiring boards (10, 20) having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps (14, 24) are formed at desired positions on wiring patterns (12a, 22a) on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal (CP). Further, an insulating layer (30) is formed between the wiring boards (10, 20), and protection films (31, 32) are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers (13, 23) of the wiring boards(10, 20).