CONNECTION VERIFICATION TECHNIQUE
    181.
    发明申请
    CONNECTION VERIFICATION TECHNIQUE 审中-公开
    连接验证技术

    公开(公告)号:WO2007079006A2

    公开(公告)日:2007-07-12

    申请号:PCT/US2006048891

    申请日:2006-12-21

    Inventor: KINSLEY THOMAS

    Abstract: Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed.

    Abstract translation: 本发明的实施例一般涉及测试存储器件与电路板或其他器件的连接。 在一个实施例中,公开了一种被配置为便于该设备与印刷电路板或其他设备之间的连续性测试的存储器件。 存储器件包括一个基片和两个通过测试路径彼此电耦合的连接焊盘。 还公开了一种用于测试存储器件和电路板或其它器件之间的连接的系统和方法。

    TRANSMISSION LINE WITH STRIPPED SEMI-RIGID CABLE
    182.
    发明申请
    TRANSMISSION LINE WITH STRIPPED SEMI-RIGID CABLE 审中-公开
    传输线与剥离的半刚性电缆

    公开(公告)号:WO2006019593A3

    公开(公告)日:2007-03-15

    申请号:PCT/US2005024112

    申请日:2005-07-07

    Inventor: GREELEY JOHN S

    Abstract: A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a printed wiring board. The dielectric barrel of the stripped cable contacts each of the elongated side and bottom walls of the slot. An exposed portion of center conductor at each end of the cable lays tangent on a corresponding one of connection points (at each end of the slot). The structure reduces loss for long transmission line lengths, and fixes the mounting depth and routing for a consistent transition. Inductive compensation can be provided at the connections point at each end of the slot to mitigate transition discontinuity.

    Abstract translation: 高频同轴传输线结构配置有剥离的半刚性电缆(无屏蔽)。 剥离的电缆被纵向插入形成在印刷电路板中的金属化接地槽中。 剥离的电缆的电介质筒接触槽的细长侧壁和底壁中的每一个。 电缆每端处的中心导体的暴露部分在相应的一个连接点(在插槽的每一端)处切线。 该结构减少了长传输线路长度的损耗,并且固定了安装深度和路由以实现一致的转换。 可以在插槽每端的连接点处提供感应补偿,以减轻过渡不连续性。

    TESTER INTERFACE MODULE
    183.
    发明申请
    TESTER INTERFACE MODULE 审中-公开
    测试仪界面模块

    公开(公告)号:WO2006039653A1

    公开(公告)日:2006-04-13

    申请号:PCT/US2005/035488

    申请日:2005-09-30

    Abstract: In one embodiment, a tester interface module (10) for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board (150) having center conductor vias (172) with center conductor holes (170) extending through the capture board. Axial cables (110) secured to the capture board have center conductors (160) extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component (200) is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.

    Abstract translation: 在一个实施例中,提供了一种用于将多个信号路径从至少一个电子组件连接到至少一个其它电子组件的测试器接口模块(10)。 接口模块包括具有中心导体通孔(172)的捕获板(150),中心导体孔(172)具有延伸穿过捕获板的中心导体孔(170)。 固定到捕获板的轴向电缆(110)具有至少部分延伸穿过中心导体通孔的相应中心导体孔的中心导体(160)。 接口部件(200)与捕获板相邻,导体路径导电地接合到捕获板的导体通孔,以将中心导体电连接到相应的导体路径。 接口部件的导体路径被布置成允许与电子组件的连接。

    HIGH FREQUENCY VIA WITH STRIPPED SEMI-RIGID CABLE
    184.
    发明申请
    HIGH FREQUENCY VIA WITH STRIPPED SEMI-RIGID CABLE 审中-公开
    高频通过分离的半刚性电缆

    公开(公告)号:WO2006019594A2

    公开(公告)日:2006-02-23

    申请号:PCT/US2005/024113

    申请日:2005-07-07

    Abstract: A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).

    Abstract translation: 高频同轴电缆通孔结构配置有剥离的半刚性电缆(无屏蔽)和电感补偿环路,以减轻该通孔结构的中心导体与中心导体所连接的焊盘之间的过渡不连续性。 在这种板的高频(例如,1至12GHz)上的顶部到底部的微波转换的性能得到提高。 配置有周围接地通孔的非金属化通孔实施例为与较大电容(例如耦合到部件的连接焊盘)相关联的连接焊盘提供更大程度的补偿。

    プリント回路基板用コンパクトビア伝送路およびその設計方法
    186.
    发明申请
    プリント回路基板用コンパクトビア伝送路およびその設計方法 审中-公开
    印刷电路板传输线及其设计方法

    公开(公告)号:WO2004107830A1

    公开(公告)日:2004-12-09

    申请号:PCT/JP2004/007915

    申请日:2004-06-01

    Abstract: A compact via transmission line for printed circuit board and its designing method. A printed circuit board having a preterable characteristic impedance and including a multilayer printed circuit board can be reduced in size and the frequency range of a via transmission line mounted on the printed circuit board can be increased. The compact via transmission line comprises a central conductor (101) forming the boundary of an inner conductor layer of the compact via transmission line and constituting a signal via hole, a plurality of ground via holes (102) arranged around the central conductor and forming the boundary of an outer conductor layer, and a plurality of conductor plates composed of printed circuit board conductor layers. Furthermore, a structure parameter adjusting via hole (103) is provided between the boundary of the inner conductor layer and the boundary of the outer conductor layer in the compact via transmission line, and a signal propagating through the signal via hole is isolated electrically not to crosstalk with another signal in a high frequency signal band.

    Abstract translation: 一种用于印刷电路板的紧凑型传输线及其设计方法。 可以减小具有可预测特性阻抗并且包括多层印刷电路板的印刷电路板的尺寸,并且可以增加安装在印刷电路板上的通孔传输线的频率范围。 通过传输线的紧凑件包括形成通过传输线并且构成信号通孔的小型内导体层的边界的中心导体(101),围绕中心导体布置的多个接地通孔(102),并形成 外导体层的边界,以及由印刷电路板导体层构成的多个导体板。 此外,通过传输线,在内导体层的边界和小外形的导体层的边界之间设置调整通孔(103)的结构参数,并且通过信号通孔传播的信号被电隔离而不是 与高频信号频带中的另一信号串扰。

    光モジュール及び光送受信装置
    189.
    发明申请
    光モジュール及び光送受信装置 审中-公开
    光学模块和光传输/接收设备

    公开(公告)号:WO2004079876A1

    公开(公告)日:2004-09-16

    申请号:PCT/JP2004/002870

    申请日:2004-03-05

    Abstract: 光モジュールを構成する光素子の光ファイバ円周方向の角度に影響を受けることなく、光素子の電極を配線基板に実装する際の自由度を高める技術が開示され、その技術によれば複数の電極61~64が突出した光素子5と、複数の電極の各々とを接続するための複数の電気配線10が略同心円状に形成された配線基板7を備え、複数の電極の各先端と光素子の中心との距離が異なるように電極の各先端をそれぞれ複数の電気配線の各々に接続する。

    Abstract translation: 一种增加在印刷电路板上安装光学元件的电极的自由度的技术。 这可以在不受构成光学模块的光学元件的光纤的圆周方向的角度的影响的情况下实现。 该技术的光学模块具有投射电极(61-64)的光学元件(5)和用于使各个电极之间连接的电线(10)基本上同心地布置在其上的电路板(7) 圆形 电极的每个端部连接到每根电线,使得电极的每个端部与光学元件的中心之间的距离变化。

Patent Agency Ranking