Abstract:
Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed.
Abstract:
A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a printed wiring board. The dielectric barrel of the stripped cable contacts each of the elongated side and bottom walls of the slot. An exposed portion of center conductor at each end of the cable lays tangent on a corresponding one of connection points (at each end of the slot). The structure reduces loss for long transmission line lengths, and fixes the mounting depth and routing for a consistent transition. Inductive compensation can be provided at the connections point at each end of the slot to mitigate transition discontinuity.
Abstract:
In one embodiment, a tester interface module (10) for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board (150) having center conductor vias (172) with center conductor holes (170) extending through the capture board. Axial cables (110) secured to the capture board have center conductors (160) extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component (200) is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.
Abstract:
A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).
Abstract:
An RF signal transition (90) includes a channelized microstrip transmission structure (80), and a coplanar wave guide structure (150) in electrical communication with the channelized microstrip transmission structure. A caged troughline transitions tructure (100) is in electrical communication with the coplanar wave guide structure. A caged coaxial transmission structure (120) is in electrical communication with the troughline transition structure. The signal transition may be embedded in a flexible printed wiring board structure with a circulator (46) for a conformal antenna structure (10).
Abstract:
A compact via transmission line for printed circuit board and its designing method. A printed circuit board having a preterable characteristic impedance and including a multilayer printed circuit board can be reduced in size and the frequency range of a via transmission line mounted on the printed circuit board can be increased. The compact via transmission line comprises a central conductor (101) forming the boundary of an inner conductor layer of the compact via transmission line and constituting a signal via hole, a plurality of ground via holes (102) arranged around the central conductor and forming the boundary of an outer conductor layer, and a plurality of conductor plates composed of printed circuit board conductor layers. Furthermore, a structure parameter adjusting via hole (103) is provided between the boundary of the inner conductor layer and the boundary of the outer conductor layer in the compact via transmission line, and a signal propagating through the signal via hole is isolated electrically not to crosstalk with another signal in a high frequency signal band.
Abstract:
The invention relates to an electronic system comprising at least first and second printed circuit boards which are assembled such that they are stacked on top of one another and separated using a spacer element. The invention is characterised in that at least one of the spacer elements comprises a coaxial electrical connector which enables the exchange of at least one radio frequency signal between the above-mentioned first and second printed circuit boards.
Abstract:
A concentric 'conductor within a via' RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.
Abstract:
An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.