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公开(公告)号：KR1020090024913A
公开(公告)日：2009-03-10
申请号：KR1020070089879
申请日：2007-09-05
Applicant: 에이디엠티 주식회사 , (주) 알엔투테크놀로지
Abstract: A plasma generation module is provided to generate a plasma easily in humid environment by minimizing influence caused by outer environment factors like humidity. A plasma generation module(100) includes an upper electrode(140) for plasma generation in a dielectric, a lower electrode(160) and a heater(180) to heating up the electrode on a lower side of the lower electrode. The dielectric is LTCC(low temperature co-fired ceramic)(120). The electrode includes Au, Ag, and Cu. The upper electrode includes a plurality of openings. The heater includes one of RuO2, IrO2, Bi2Ru2O7, Pb2Ru2O6, Ag-Pd-PdO, and RuO2. A protective film is formed on the upper electrode.
Abstract translation: 提供等离子体生成模块，通过最小化诸如湿度等外部环境因素的影响，在潮湿环境中容易地产生等离子体。 等离子体产生模块（100）包括用于电介质中等离子体产生的上电极（140），下电极（160）和加热器（180），用于加热下电极下侧的电极。 电介质是LTCC（低温共烧陶瓷）（120）。 电极包括Au，Ag和Cu。 上电极包括多个开口。 加热器包括RuO2，IrO2，Bi2Ru2O7，Pb2Ru2O6，Ag-Pd-PdO和RuO2中的一种。 在上电极上形成保护膜。
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公开(公告)号：KR100789360B1
公开(公告)日：2007-12-28
申请号：KR1020060120680
申请日：2006-12-01
Applicant: (주) 알엔투테크놀로지
Abstract: A ceramic chip antenna is provided to implement miniaturization by inserting a grounding capacitance and a grounding in an inside of the chip antenna. A ceramic chip antenna includes a chip body, a radiation part(200), an input terminal(400), a grounding terminal(500), and a coupling feeding part. The chip body is formed by a dielectric substance having a specific dielectric constant. The radiation part is formed by a conductor of a helical shape in an inside of the chip body. The input terminal is placed at an end of the chip body and receives an external voltage. The grounding terminal is placed at a surface of an end of the chip body and connected with an external ground. The coupling feeding part is connected with the input terminal and the grounding terminal and transmits the external voltage inputted from the input terminal using the capacitance coupling.
Abstract translation: 提供陶瓷芯片天线，通过在芯片天线的内部插入接地电容和接地来实现小型化。 陶瓷芯片天线包括芯片体，辐射部分（200），输入端子（400），接地端子（500）和耦合馈电部分。 芯片体由具有特定介电常数的电介质形成。 辐射部分由芯片体内部的螺旋形导体形成。 输入端子放置在芯片主体的一端并接收外部电压。 接地端子放置在芯片主体的端部的表面并与外部接地连接。 耦合馈电部分与输入端子和接地端子连接，并使用电容耦合传输从输入端子输入的外部电压。
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公开(公告)号：KR100650186B1
公开(公告)日：2006-11-24
申请号：KR1020040029055
申请日：2004-04-27
Applicant: (주) 알엔투테크놀로지
IPC: H03H7/30
Abstract: 본 발명은 멀티 밴드 필터에 관한 것으로, 제1 내지 제3 주파수 대역을 통과시키는 이 멀티 밴드 필터는, 제1 공진 회로를 포함하며 제1 및 제2 주파수 대역을 통과시키는 제1 필터, 제2 공진 회로와 제1 커패시터를 포함하며 제1 주파수 대역을 통과시키는 제2 필터, 제2 커패시터와 제3 공진 회로와 제1 인덕터를 포함하며 제2 주파수 대역을 통과시키는 제3 필터, 그리고 제3 커패시터와 제4 공진 회로와 제2 인덕터를 포함하며 제3 주파수 대역을 통과시키는 제4 필터를 포함한다. 이 멀티 밴드 필터에 의하면 원하는 주파수 대역에서 저손실과 고감쇄 특성을 갖게 할 수 있으며, 노치의 위치를 자유롭게 조절할 수 있어서 통과 주파수 대역에서 특성을 향상시킬 수 있다. 또한 이 멀티 밴드 필터를 하나의 칩 형태로 구현함으로써 실장 비용과 시간을 절감할 수 있고, 크기를 작게 할 수 있다.
멀티 밴드 필터, 인덕터, 커패시터, 노치, 주파수, LTCC, 공진 회로-
公开(公告)号：KR100478127B1
公开(公告)日：2005-03-21
申请号：KR1020020052927
申请日：2002-09-03
Applicant: (주) 알엔투테크놀로지
IPC: C04B35/497 , H01B3/12
Abstract: 본 발명은 ZnO, La
2 O
3 와 Nb
2 O
5 를 주성분으로 하는 유전체 세라믹 조성물, 및 이를 포함하는 유전체 세라믹 적층 부품 및 이의 제조방법에 관한 것으로, 상기 유전체 세라믹은 유전율의 증대, 작은 유전손실, 안정한 공진 주파수 온도계수를 달성할 수 있으며, 소결조제를 추가로 포함함으로써 1000℃ 이하의 낮은 온도에서 저온소결(firing)이 가능하여 온도안정성이 요구되는 부품에 사용할 수 있으며, 우수한 품질계수를 갖기 때문에 마이크로파대역 필터, 오실레이터, 평면안테나, MCM 등의 통신부품에 사용할 수 있다.-
公开(公告)号：KR1020140072570A
公开(公告)日：2014-06-13
申请号：KR1020120140235
申请日：2012-12-05
Applicant: (주) 알엔투테크놀로지
Abstract: Provided in the present invention is a coupler having an asymmetry coupled line improving the properties like the insertion loss, etc. The coupler according to an embodiment of the present invention comprises: a coupler main body separately including port electrodes for the power connection of ground electrodes and the outside on the upper side and the lower side; a first coupled line electrically connected to one part of a port electrode, and positioned inside the coupler main body; a second coupled line electrically connected to the other part of the port electrode, positioned inside the coupler main body, and having an asymmetric shape to the first coupled line; and an internal ground pattern electrically connected to the ground electrodes.
Abstract translation: 本发明提供一种具有改善诸如插入损耗等性质的不对称耦合线的耦合器。根据本发明实施例的耦合器包括：耦合器主体，分别包括用于接地电极的电源连接的端口电极 上侧和下侧的外侧; 电连接到端口电极的一部分并且位于耦合器主体内部的第一耦合线; 电连接到端口电极的另一部分，位于耦合器主体内部并且具有与第一耦合线不对称形状的第二耦合线; 以及电连接到接地电极的内部接地图案。
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Patent Agency Ranking
公开(公告)号：KR101307530B1
公开(公告)日：2013-09-12
申请号：KR1020120052661
申请日：2012-05-17
Applicant: (주) 알엔투테크놀로지
IPC: H01H37/76 , H01H85/046
Abstract: PURPOSE: A ceramic chip fuse including an internal heat generation member simplifies manufacturing process time by printing a screen and firing the screen and green sheets at the same time. CONSTITUTION: A ceramic chip fuse (100) includes a ceramic substrate (110), a fuse member (120), an internal heat generation member, and a fuse receiving member (122). The ceramic substrate includes multiple ceramic sheets integrated by co-firing. The fuse member is placed on the ceramic substrate. The internal heat generation member is embedded in the ceramic substrate, is placed to overlap the fuse member, and fuses the fuse member when a current is applied. The fuse receiving member is placed on the ceramic substrate, is formed by being fired with multiple ceramic sheets at the same, and receives the fuse member until the fuse member is fused. The fuse receiving member is in contact with the fuse member and is interposed between the fuse member and the internal heat generation member.
Abstract translation: 目的：包括内部发热体的陶瓷芯片保险丝通过打印屏幕和同时点燃屏幕和绿化板来简化制造工艺时间。 构成：陶瓷芯片保险丝（100）包括陶瓷基板（110），熔丝部件（120），内部发热部件和熔丝接收部件（122）。 陶瓷基板包括通过共烧制成的多个陶瓷片。 保险丝部件放置在陶瓷基板上。 将内部发热体嵌入陶瓷基板内，放置成与熔丝部件重叠，并在施加电流时对保险丝部件进行熔断。 熔丝接收部件放置在陶瓷基板上，通过在其上被烧制而形成多个陶瓷片，并且接收保险丝部件直到保险丝部件熔合。 保险丝接收构件与保险丝构件接触并且插入在保险丝构件和内部发热构件之间。
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公开(公告)号：KR1020090072461A
公开(公告)日：2009-07-02
申请号：KR1020070140580
申请日：2007-12-28
Applicant: (주) 알엔투테크놀로지
Abstract: A coupler is provided to reduce reflection loss without increase of insertion loss by controlling a size and a shape of an inner ground layer formed between coupled lines. A coupler includes a coupler main body, two micro strip transmitting lines, and a ground layer. The coupler main body is made of ceramic dielectric. A ground electrode and a port electrode pattern are formed on a top surface and a bottom surface of the coupler main body. Two micro strip transmitting lines are formed inside the coupler main body. Two micro strip transmitting lines are broadside-coupled in order to form coupled lines(601,603) and port lines(701,703,705,707). The ground layer is positioned between two micro strip lines. The ground layer is connected to the ground electrode of the top surface and the bottom surface of the coupler main body.
Abstract translation: 提供耦合器以通过控制形成在耦合线之间的内部接地层的尺寸和形状来减少反射损耗而不增加插入损耗。 耦合器包括耦合器主体，两个微带传输线和接地层。 耦合器主体由陶瓷电介质制成。 接地电极和端口电极图案形成在耦合器主体的顶表面和底表面上。 两个微带传输线形成在耦合器主体内部。 两个微带传输线被宽侧耦合以形成耦合线（601,603）和端口线（701,703,705,707）。 接地层位于两条微带线之间。 接地层连接到耦合器主体的顶表面和底表面的接地电极。
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公开(公告)号：KR100650375B1
公开(公告)日：2006-11-27
申请号：KR1020050088717
申请日：2005-09-23
Applicant: (주) 알엔투테크놀로지
IPC: H01Q11/08
Abstract: A helical chip antenna having a stub is provided to decrease a center frequency by increasing the total length of a conductor without reducing a bandwidth. A chip body(110) is formed of one of a ceramic dielectric or a magnetic material. A helical conductor(120) is formed spirally in the inside of the chip body. A stub is formed in a part of the helical conductor. A feeding terminal(130) is formed at one end of the helical conductor, and applies an external voltage to the helical conductor and the stub.
Abstract translation: 提供具有短截线的螺旋形芯片天线以通过在不减小带宽的情况下增加导体的总长度来减小中心频率。 芯片主体（110）由陶瓷电介质或磁性材料中的一种形成。 螺旋导体（120）螺旋地形成在芯片主体的内部。 短截线形成在螺旋导体的一部分中。 馈电端子（130）形成在螺旋导体的一端，并且向螺旋导体和短截线施加外部电压。
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公开(公告)号：KR1020040025177A
公开(公告)日：2004-03-24
申请号：KR1020020057019
申请日：2002-09-18
Applicant: (주) 알엔투테크놀로지
IPC: C04B35/495 , C04B37/04 , H01B3/12
CPC classification number: H01B3/12 , C04B37/04 , H01G4/1209 , H01G4/30
Abstract: PURPOSE: Provided is a low temperature co-firing dielectric ceramic composition, which has a high dielectric constant, low dielectric loss and excellent stability of dielectric constant against temperature so as to reduce the volume of multilayer ceramic module-type electronic components and to improve the characteristic property of the component. CONSTITUTION: The ceramic composition comprises: (a) x(Ba,Sr)O·y(Ti,Zr)O2·z(Nb,Ta)2O5 as a main component, (b) a firing aid, and (b) a bonding modifier, wherein the main component is represented by the formula of x(aBaO,(1-a)SrO)·y(bTiO 2,(1-b)ZrO2)·z(cNb2O5,(1-c)Ta2O5), in which 0.15
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公开(公告)号：KR1020040021319A
公开(公告)日：2004-03-10
申请号：KR1020020052927
申请日：2002-09-03
Applicant: (주) 알엔투테크놀로지
IPC: C04B35/497 , H01B3/12
CPC classification number: H01B3/12 , H01G4/1209 , H01G4/30
Abstract: PURPOSE: Provided is a dielectric ceramic composition of the (1-x)ZnO xLa2O3 Nb2O5 system which has high dielectric constant, low dielectric loss and stable temperature coefficient of resonant frequency. The composition enabling low temperature sintering is applied to multilayer devices such as capacitor, LC filter, duplex, etc. CONSTITUTION: The dielectric ceramic composition comprises (1-x)ZnO xLa2O3 Nb2O5(0.1
Abstract translation: 目的：提供具有高介电常数，低介电损耗和稳定的共振频率温度系数的（1-x）ZnO xLa2O3 Nb2O5系统的介电陶瓷组合物。 能够进行低温烧结的组合物应用于电容器，LC滤光片，双面等多层器件。构成：介电陶瓷组合物包含（1-x）ZnO xLa2O3 Nb2O5（0.1 <= x <= 0.6）作为主要材料， 和B 2 O 3，CuO，V 2 O 5，Bi 2 O 3，Ag 2 O和NiO中的一种或多种的1-7重量份（基于主要材料）作为烧结助剂。 多层陶瓷电介质通过以下步骤制备：通过混合对应于式的电介质陶瓷粉末来制备浆料; 脱胶并形成带状; 在由带有Ag，Au，Pt，Pd及其合金的两种或更多种的糊料形成的带上形成内部电极，在低于1000℃的温度下熔融。 至少分两层压力和热量（40-70度）; 1000℃以下烧结。
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