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11.发明申请CURABLE EPOXY COMPOSITION WITH QUATERNARY AMMONIUM BICARBONATE CURING CATALYST 审中-公开季戊四醇固化催化剂可固化环氧组合物公开(公告)号：US20130158166A1
公开(公告)日：2013-06-20
申请号：US13327792
申请日：2011-12-16
Applicant: Pui-Yan Lin
Inventor： Pui-Yan Lin
IPC: C08L63/02 , C08K5/07 , C09J163/02 , C08K5/05
CPC classification number: C08G59/621 , C08G59/686 , C08L63/00 , C09D163/00
Abstract: Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate.
Abstract translation: 季铵碳酸氢盐适用于可固化环氧组合物中的催化剂。 用其制备的可固化组合物用于制备涂覆的基材，并制备保形密封的印刷线路板和柔性电路。 还提供了制备和固化的方法。 特别有用的是包含苄基三甲基碳酸氢铵的组合物。
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公开(公告)号：US20120178260A1
公开(公告)日：2012-07-12
申请号：US13427184
申请日：2012-03-22
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rejendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rejendran , George Elias Zahr
IPC: H01L21/31
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.
Abstract translation: 提供了制造包含不对称交联聚合物电介质膜的多层芯片载体的方法。
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公开(公告)号：US07658988B2
公开(公告)日：2010-02-09
申请号：US11732344
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
IPC: B32B9/00
CPC classification number: H05K1/0373 , H01L23/145 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2924/10253 , H05K3/4661 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/252 , H01L2924/00
Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。
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公开(公告)号：US20070231469A1
公开(公告)日：2007-10-04
申请号：US11732344
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H05K1/0373 , H01L23/145 , H01L23/49894 , H01L2224/16225 , H01L2224/16227 , H01L2924/10253 , H05K3/4661 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/252 , H01L2924/00
Abstract: Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
Abstract translation: 提供了由环氧组合物制备印刷电路的组合物和方法。 环氧组合物在未固化状态下表现出低粘度，并且在固化状态下表现出低的热膨胀系数。 本发明的低介电常数组合物非常适用于多层印刷电路板。
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15.发明授权Apparatus and process for stacking sheets of half-cell structure to make a honeycomb core 失效用于堆叠半电池结构的片材以制造蜂窝芯的装置和方法
公开(公告)号：US5340429A
公开(公告)日：1994-08-23
申请号：US797329
申请日：1991-11-25
Applicant: Joseph J. Duffy , Birol Kirayoglu , Pui-Yan Lin , Robert A. Marin , Robert J. Santucci
Inventor： Joseph J. Duffy , Birol Kirayoglu , Pui-Yan Lin , Robert A. Marin , Robert J. Santucci
CPC classification number: B31D3/0223 , B31F1/305 , B32B37/10 , Y10T156/1749 , Y10T428/24165
Abstract: The present invention relates to an apparatus and a process for a half-cell structure to make a hexagonal-cell honeycomb core. The structure has a plurality of peaks and valleys and a diagonal surface between each consecutive peak and valley. The apparatus comprises a stack holder for stacking the structure so that as one sheet is placed on top of a stack comprising at least one sheet, the peaks of one sheet contact the peaks of an adjacent sheet. The apparatus also comprises an air blower disposed beneath the top of the stack for reducing the air pressure surrounding the stack to a pressure below the air pressure on the top of the stack, thereby pressing the layers together to form the core.
Abstract translation: 本发明涉及一种用于制造六边形蜂窝状蜂窝芯的半单元结构的装置和方法。 该结构具有多个峰和谷以及每个连续的峰谷之间的对角线表面。 该装置包括用于堆叠结构的堆叠保持器，使得当一个片材被放置在包括至少一个片材的堆叠的顶部时，一个片材的峰部接触相邻片材的峰部。 该设备还包括设置在堆叠顶部下方的鼓风机，用于将堆叠周围的空气压力降低到低于堆叠顶部的空气压力的压力，从而将层压在一起形成芯体。
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Patent Agency Ranking
公开(公告)号：US5137768A
公开(公告)日：1992-08-11
申请号：US552553
申请日：1990-07-16
Applicant: Pui-Yan Lin
Inventor： Pui-Yan Lin
CPC classification number: D21H17/52 , D21H13/26 , D21H17/48 , Y10S428/902 , Y10S493/966 , Y10T428/24149 , Y10T428/24165
Abstract: A light weight honeycomb structure is disclosed made from aramid fibers and exhibiting extremely high shear modulus.
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17.发明授权Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles 失效由包含聚合物和表面改性的六方氮化硼颗粒的铸塑组合物制备的膜公开(公告)号：US08784980B2
公开(公告)日：2014-07-22
申请号：US12465090
申请日：2009-05-13
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: C08K9/04 , B32B5/147 , B32B7/12 , B32B15/08 , B32B15/092 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2264/10 , B32B2307/206 , B32B2307/302 , B32B2307/538 , B32B2379/00 , B32B2457/08 , C08J5/18 , C08J2363/00 , C08J2379/08 , H05K1/0373 , H05K1/0393 , H05K2201/0245
Abstract: Provided is a film having a thickness of less than 500 μm comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.
Abstract translation: 提供具有小于500μm的厚度的膜，其包含聚合物和分散在其中的多个表面改性的六方氮化硼颗粒。 聚合物可以是聚酰亚胺或环氧树脂。 提供了一种通过铸造制备薄膜的方法。
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18.发明申请METHOD FOR PREPARING CONSOLIDATED MULTI-LAYER ARTICLE USING CURABLE EPOXY COMPOSITION WITH QUATERNARY AMMONIUM BICARBONATE CURING CATALYST 有权使用可固化环氧组合物与季戊四醇二氧化碳固化催化剂制备合成多层材料的方法公开(公告)号：US20130153143A1
公开(公告)日：2013-06-20
申请号：US13327795
申请日：2011-12-16
Applicant: Pui-Yan Lin
Inventor： Pui-Yan Lin
IPC: B32B37/12
CPC classification number: B32B37/00 , B32B2038/0076 , B32B2305/34 , B32B2363/00 , B32B2379/08 , B32B2457/08 , C08G59/621 , C08G59/686 , C09D163/00 , H05K3/281 , H05K2201/0154
Abstract: Quaternary ammonium bicarbonates are suitable for use as catalysts in curable epoxy compositions. The curable compositions prepared therewith are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Methods for preparation and curing are also provided. Of particular utility are compositions comprising benzytrimethyl ammonium bicarbonate. The curable composition is coated onto a first film or sheet, including a polyimide film or sheet. The coated sheet is then contacted to the surface of second film or sheet, where preferably there are discrete metallic conductive pathways disposed thereupon.
Abstract translation: 季铵碳酸氢盐适用于可固化环氧组合物中的催化剂。 用其制备的可固化组合物用于制备涂覆的基材，并制备保形密封的印刷线路板和柔性电路。 还提供了制备和固化的方法。 特别有用的是包含苄基三甲基碳酸氢铵的组合物。 将可固化组合物涂布在包括聚酰亚胺膜或片材的第一膜或片上。 然后将涂覆的片材接触第二膜或片的表面，其中优选地在其上设置离散的金属导电通路。
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19.发明授权公开(公告)号：US08288466B2
公开(公告)日：2012-10-16
申请号：US12465059
申请日：2009-05-13
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: C09C1/00 , C01P2002/77 , C01P2004/04 , C01P2006/12 , C08K3/38 , C08K9/04 , Y10T428/25
Abstract: Provided is a composite comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. Suitable polymers include polyimide and epoxy. A process is also provided. The surface modified hexagonal boron nitride particles comprise surface-bonded substituted phenyl radicals.
Abstract translation: 提供了包含聚合物和分散在其中的多个表面改性的六方氮化硼颗粒的复合材料。 合适的聚合物包括聚酰亚胺和环氧树脂。 还提供了一个过程。 表面改性的六方氮化硼颗粒包括表面键合的取代的苯基。
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公开(公告)号：US20070232727A1
公开(公告)日：2007-10-04
申请号：US11732253
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H05K3/4661 , B82Y30/00 , C08G59/621 , C08J5/005 , C08J2363/00 , C08L63/00 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31511 , C08L2666/54
Abstract: Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.
Abstract translation: 提供在未固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 还提供了制备环氧组合物的方法。 低介电常数组合物非常适用于多层印刷电路板。 期望的性能通过在环氧组合物中使用纳米级填料的双峰分布来实现。
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