Abstract:
A first and second capacitor plate are provided (101 and 102). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed (103) in one of these openings as is at least a second electrically conductive path interface (104).
Abstract:
A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (> 1000 pf/mm²).
Abstract translation:电介质电路板箔(400,600)包括导电金属箔层(210,660),邻近导电金属箔层的第一表面设置的结晶介电氧化物层(405,655),镍酸镧层(414) ,664)和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层(415,665)。 箔(400,600)可以粘附到印刷电路板子结构(700)上,并用于经济地制造多个嵌入式电容器,包括具有大电容密度(> 1000pf / mm 2)的隔离电容器。
Abstract:
A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.
Abstract:
A printed circuit polymer thick film (PTF) resistor (410, 420) includes tolerance control material (425, 426, 440) that substantially surrounds the resistor body (423) and significantly improves the linearity of resistance vs. resistor length, and significantly reduces resistor-to-resistor and board-to-board fabrication variances. In one embodiment (420), the tolerance control material is the same metallic material as the printed circuit conductors (430), and is formed in two finger patterns on each side of the resistor body, each finger pattern connected to one terminal pad (435) of the resistor. A layout cell (700) is used for fabricating the PTF resistor. A method is used for fabricating the PTF resistor.
Abstract:
High capacitance value capacitors are formed using bimetal foils (120, 130) of an aluminum layer (124, 134) attached to a copper layer (122, 132). The copper side of a bimetallic copper/aluminum foil or a monometallic aluminum foil is temporarily protected using aluminum or other materials, to form a sandwich. The exposed aluminum is treated to increase the surface area of the aluminum by at least one order of magnitude, while not attacking any portion of the protected metal. When the sandwich is separated, the treated bimetal foil (120 or 130) is formed into a capacitor, where the copper layer (122 or 132) is one electrode of the capacitor and the treated aluminum layer (124 and 324 or 134 and 334) is in intimate contact with a dielectric layer (540) of the capacitor.
Abstract:
A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.
Abstract:
One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm
Abstract translation:嵌入印刷电路结构中的多个电容器之一包括覆盖印刷电路结构的第一衬底层(505)的第一电极(415),覆盖第一电极的结晶化电介质氧化物芯(405),第二电极 615),以及设置在结晶的电介质氧化物芯和第一和第二电极中的至少一个之间并与其接触的高温抗氧化剂层(220)。 结晶的电介质氧化物芯的厚度小于1微米,电容密度大于1000pF / mm
Abstract:
A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).
Abstract:
A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.
Abstract:
A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).