公开(公告)号：WO9839732A3

公开(公告)日：1998-12-17

申请号：PCT/DE9800602

申请日：1998-03-02

Applicant: SIEMENS AG ,  MUNDIGL JOSEF ,  HOUDEAU DETLEF ,  STAMPKA PETER ,  HUBER MICHAEL ,  PUESCHNER FRANK

Inventor： MUNDIGL JOSEF ,  HOUDEAU DETLEF ,  STAMPKA PETER ,  HUBER MICHAEL ,  PUESCHNER FRANK

IPC: G06K19/077 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  G06K19/07

CPC classification number: G06K19/07745 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/112 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The invention concerns a chip card module (1) which comprises a chip carrier (2), electrically conductive contact surfaces (3) and a semiconductor chip which is disposed in an SMT housing (4), contact with the contact surfaces (3) being established via the connection legs (5) which are guided outwards out of the housing (4). The chip card modules according to the invention can be easily produced and have a low component height. In addition, the semiconductor chip is well protected against mechanical damage. The invention also concerns a chip card (7) comprising the claimed chip card module (1).

公开(公告)号：WO1998016900A1

公开(公告)日：1998-04-23

申请号：PCT/DE1997001919

申请日：1997-09-02

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  JANCZEK, Thies ,  STAMPKA, Peter

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: G06K19/077

CPC classification number: G06K19/07743 ,  Y10T428/31504

Abstract: The invention concerns a chip card with a contact zone in the region of which an electrically conductive and possibly tinted varnish is applied. In this way, the contact zone itself can also be used as a data carrier if the conductive varnish reproduces the logo of the chip card manufacturer, for example. The disadvantage of chip cards of the type in question is that the varnishing of the contact zones is subject to a high degree of wear owing to friction. In addition, the electrically conductive particles frequently oxidize, and so the resistance when the contact zone is accessed increases such that satisfactory functioning of the chip card is no longer ensured. The object of the invention is therefore to produce a chip card of the type in question which functions reliably for a long time, and propose a method of producing the same. To that end, the varnish is based on an intrinsically conductive plastics material.

Abstract translation: 本发明涉及一种具有其中的导电漆涂敷的区域的接触区域中的芯片卡，所述涂层也可以被着色。 这本身可以作为一种信息载体，接触区域，例如，如果智能卡的生产厂家，标识与导电漆转载。 上述通用的智能卡具有的缺点是在接触区域的涂层经受高摩擦磨损。 此外，经常发生的是，导电颗粒氧化，从而在访问该接触面积增大，使得智能卡的正常工作不再保证电阻。 因此，本发明的一个目的是提供一种在长时间内通用智能卡可靠地发挥功能，并且提供其生产方法。 这个目的是根据其特征在于该漆的固有导电性塑料的基础上做出本发明来实现的。

公开(公告)号：WO1998013872A1

公开(公告)日：1998-04-02

申请号：PCT/DE1997002039

申请日：1997-09-11

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  FRIES, Manfred ,  STAMPKA, Peter ,  HUBER, Michael

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L23/58

CPC classification number: H01L23/576 ,  G06F21/86 ,  H01L2924/0002 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention concerns a system for protecting a semiconductor chip (1) with a covering (4) against copying, the system comprising an oscillating circuit which is capable of resonance and whose elements are located on the chip surface (3) and inside the covering (4), and an evaluation circuit connected thereto. The circuit deactivates the semiconductor chip when the oscillating circuit is brought out of resonance. This off-resonance adjustment of the oscillating circuit occurs when the covering (4), which acts as a dielectric of the capacitor, is removed. It is impossible to operate the semiconductor chip (1) for copying or analysis purposes once its covering (4) has been removed.

Abstract translation: 带罩（4）的半导体芯片（1）一种复制保护包括谐振槽电路，它在芯片表面（3）和（4）位于所述盖内，并且在相关联的评估电路元件。 该电路使用的半导体芯片进行操作时，当谐振电路谐振出来的引起的。 作用，当作为电容器盖（4）的电介质被移除时所述谐振电路的失谐此。 因此，它是不可能取半导体芯片（1）用于复制或分析（4）在操作除去盖。

公开(公告)号：WO1998007191A1

公开(公告)日：1998-02-19

申请号：PCT/DE1997001496

申请日：1997-07-15

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  STAMPKA, Peter ,  FRIES, Manfred ,  HUBER, Michael ,  HEITZER, Josef

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L23/498

CPC classification number: G06K19/07769 ,  G06K19/07743 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention concerns a combination chip module for transmission of electrical signals or data with or without contact to an external read-write station with an elongation-resistant, electrically insulated substrate (2), on or in which one or more integrated semiconductor circuits are arranged. The circuits are connected, via connecting terminals (6), a) to one or more couplers of an interface circuit which is either separate orin integrated form and provided in the chip module (1), which interface circuit enables contactless bidirectional data communication between the chip module (1) and the external read-write station, and b) to electrically conducting contact surfaces (8) provided on one side of the substrate (2), which contact surfaces (8) enable bidirectional data communication with contact, between the chip module (1) and the external read-write station. The one or more couplers have metal printed conductors which are also formed on the side of the substrate (2) facing the contact surfaces (8).

Abstract translation: 本发明涉及一种用于两个接触和电气信号或数据到一个外部读写台的接触型传送组合芯片模块中，具有抗拉伸的，电绝缘性的载体（2），上或在一个或多个集成 布置半导体电路中，经由连接端子（6）上，一方面与一种或多种Kopelelementen单独或在芯片模块上集成的形式（1）提供了一种用于接口电路，这使得芯片模块（1）与外部读写站之间的非接触的双向数据通信 ，并提供给另一个与载体的一侧（2）导电接触表面（8），其允许所述芯片模块（1）与外部读写站之间的接触型的双向数据通信，被连接。 该一个或多个耦合元件包括金属导体轨迹，它们同样形成所分配的接触表面（8）所述支撑件（2）的一侧。

公开(公告)号：WO1998007114A1

公开(公告)日：1998-02-19

申请号：PCT/DE1997001503

申请日：1997-07-16

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  STAMPKA, Peter ,  HOUDEAU, Detlef

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: G06K19/077

CPC classification number: G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention concerns a data medium for transmission of electrical signals to a read or write station with a data medium body (2) in which a semiconductor chip (3) is constructed with an integrated electronic circuit. The data medium (2) has two cardboard or paper layers (6, 7), between which a stiffening element (8) is inserted which at least partly surrounds the semiconductor chip (3).

Abstract translation: 本发明涉及一种数据载体用于传输电信号的读和写站，具有数据载体本体（2），其中，一个半导体芯片（3）的具有集成电子电路形成的。 数据载体本体（2）包括两个纸板或纸层（6,7）在其之间的半导体芯片（3）至少部分地包围（8）被引入加强元件。

公开(公告)号：WO9719463A3

公开(公告)日：1997-08-14

申请号：PCT/DE9602194

申请日：1996-11-18

Applicant: SIEMENS AG ,  HOUDEAU DETLEF ,  STAMPKA PETER

Inventor： HOUDEAU DETLEF ,  STAMPKA PETER

IPC: G06K19/077 ,  H01L23/498 ,  H01L

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The invention concerns a chip module having a contact layer (2) produced from an electrically conductive material and having a plurality of contact elements (4) and a semiconductor chip (7) with chip connections which are disposed on the main surface (5) of the semiconductor chip (7) and are each electrically connected to a contact element (4) of the contact layer (2). Furthermore, provided on the surface of the electrically conductive contact layer (2) facing the semiconductor chip (7) is a thin insulation film (10) of electrically insulating material which has an adhesive or bonding function both on its front face facing the contact layer (2) and on its rear face (8) remote from the contact layer (2).

Abstract translation: 本发明涉及一种具有由导电材料制成并具有多个接触元件（4）和芯片连接的半导体芯片（7）的接触层（2）的芯片模块，该芯片连接件设置在主表面（5）上 半导体芯片（7）并且各自电连接到接触层（2）的接触元件（4）。 此外，设置在面向半导体芯片（7）的导电接触层（2）的表面上是电绝缘材料的薄绝缘膜（10），其在其面向接触层的前面具有粘合或粘合功能 （2）和远离接触层（2）的后表面（8）上。

公开(公告)号：WO9716846A2

公开(公告)日：1997-05-09

申请号：PCT/DE9602050

申请日：1996-10-28

Applicant: SIEMENS AG ,  HUBER MICHAEL ,  STAMPKA PETER

Inventor： HUBER MICHAEL ,  STAMPKA PETER

IPC: H01L23/12 ,  G06K19/077 ,  H01L23/13 ,  H01L23/498 ,  H01L

CPC classification number: H01L23/13 ,  G06K19/07745 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/00

Abstract: The invention relates to a chip module (1) comprising: a contact layer (2) made from an electrically conducting material and provided with a plurality of contact elements (4) which have contact faces (3) on the front side; and a semiconductor chip (7) with chip connections arranged on the principal face (5) of the semiconductor chip (7) and electrically connected via bonding wires (6) of maximum assembly length to the rear side of the contact element (4) assigned to the chip connection. In addition, a thin insulating film (10) of electrically insulating material with a plurality of bonding holes (9) is provided between the electrically conducting contact layer (2) and semiconductor chip (7). The arrangement, shape and number of the holes and their allocation to a particular contact element (4) of the contact layer is such that with any position and surface content of the secured semiconductor chip (7), contact can be ensured between the chip contacts via the bonding wires (6) with an appropriate contact element (4) of the contact layer (2).

Abstract translation: 本发明涉及一种芯片模块（1）与设置有接触元件（4）具有与由导电材料制成的接触层的与接触表面（3）的前部的多个（2）和所述主表面上的半导体芯片（7）（ 半导体芯片的布置5）（7）芯片端子，接合线的拥有一个最大长度的安装（6）与该端子接触元件相关联的芯片的背面（4）电连接。 此外，一个具有多个键合孔的导电接触层（2）和半导体芯片（7）之间设置（9），电绝缘材料提供的薄绝缘膜（10），其中，所述接合孔（9）相对于它们的布置， 形状，数量和分配给特定接触元件（4）的接触层（2）是这样的，在附接半导体芯片（7）的任何位置和区域具有与所述芯片端子与相应的相关联的接触元件的接触通过接合线（6）的装置 （4）（2）的接触层是不成。

公开(公告)号：WO2002073375A2

公开(公告)日：2002-09-19

申请号：PCT/DE2002/000845

申请日：2002-03-11

Applicant: INFINEON TECHNOLOGIES AG ,  FISCHBACH, Reinhard ,  SPOETTL, Thomas ,  MENSCH, Hans-Georg ,  STAMPKA, Peter

Inventor： FISCHBACH, Reinhard ,  SPOETTL, Thomas ,  MENSCH, Hans-Georg ,  STAMPKA, Peter

IPC: G06F1/00

CPC classification number: G06F21/32 ,  G06F21/34

Abstract: Es wird ein biometrischer Sensor, z. B. ein Fingerabdrucksensor FiTiKey, mit einem standardisierten Medium kombiniert. Der Standard der MultiMediaCard® (1) mit den entsprechenden Lesegeräten und mit den standardisierten Slots (Steckerleiste) ist ein bevorzugtes Ausführungsbeispiel, das in der Kombination dieses bestehenden Standards für Speicheranwendungen (MultiMediaCard® mit der entsprechenden Systemperipherie) mit dem personenbezogenen, mobilen Authentisierungs- und/oder Identifizierungsschlüssel FiTiKey (2) und ggf. weiteren Chips (3) besteht.

Abstract translation: 它是一种生物传感器等。 指纹传感器FiTiKey与标准介质结合。 MultiMediaCard®（1）的具有适当阅读器和与所述标准化槽（连接器条带）的标准是一个优选实施例，在用于存储器应用此现有标准（MultiMediaCard®与相应的系统外设）发送给个人，移动认证的组合和 /或识别密钥FiTiKey（2）和任选的另外的芯片（3）。

公开(公告)号：WO1998013870A1

公开(公告)日：1998-04-02

申请号：PCT/DE1997001805

申请日：1997-08-21

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  FISCHER, Jürgen ,  HEITZER, Josef ,  HUBER, Michael ,  PÜSCHNER, Frank ,  STAMPKA, Peter

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L23/498

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49146 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The present invention pertains to a chip module presenting on its inner surface (2) a contact area (3) consisting of a plurality of electroconductive contact units (4) isolated from each other, substantially flat and including at least one semiconductor wafer (6) with one or more integrated semiconductor circuits, joined through electrical connections (8) to the units in the contact area (3). The contact units (4) in the chip module (1) consist of prefabricated mounts intended for supporting the lead frame or at least one semiconductor wafer (6), and, located on one or more opposing faces of the chip module, two or more connections turned outwards, aligned close to each other (8) and intended for the surface assembly of said chip module (1) either on the components side (9) of an external printed circuit board or on the surface of an external board substrate (10).

Abstract translation: 本发明涉及一种具有在其外侧上的芯片模块（2）设置（3）具有多个分离的接触场彼此，基本上是平的接触元件（4）的导电材料，以及至少一个半导体芯片（6）配有一个或多个集成 经由连接端子（8）与所述接触垫（3）的接触元件（4）的半导体电路电连接或是。 芯片模块（1）的接触元件（4）的特征在于后停在户外的预制引线框架（20）（“引线框架”），用于支撑所述至少一个半导体芯片（6）和行中的芯片模块（1）的至少两个相对的侧面彼此相邻 出端子（8），形成有用于在安装表面上的芯片模块（1）的表面安装的外部印刷电路板或外部电路板基板（10）（9）。

公开(公告)号：WO1998010628A1

公开(公告)日：1998-03-12

申请号：PCT/DE1997001687

申请日：1997-08-08

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  HOUDEAU, Detlef ,  STAMPKA, Peter ,  HEINEMANN, Erik ,  PÜSCHNER, Frank ,  JANCZEK, Thies

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H05K03/38

CPC classification number: H01L23/538 ,  H01L21/4839 ,  H01L23/49861 ,  H01L23/5388 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/384 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2924/00

Abstract: The carrier element (1) presents an electrically isolating foil (3) and a laminated electrically conductive foil on top, the binding of the two foils (3, 4) being obtained without adhesive by pressing them together.

Abstract translation: 载体元件（1）具有电绝缘膜（3）和一层压在其上的导电箔片（4），其中，所述两个膜之间的连接（3,4）是由压在一起无粘合剂的。