公开(公告)号：US20070240310A1

公开(公告)日：2007-10-18

申请号：US11247113

申请日：2005-10-11

Applicant: Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

Inventor： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

IPC: B21D53/02

CPC classification number: B32B27/06 ,  B32B5/14 ,  B32B7/02 ,  B32B27/08 ,  B32B27/20 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/706 ,  H05K7/20481 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/49885 ,  Y10T428/269

Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.

Abstract translation: 提供一种制造热界面结构的方法。 该方法可以包括在树脂层上设置热传输层以形成层叠结构，并且将层叠结构切片以形成在切片的第一表面上具有热传输层的第一暴露部分的横截面切片，以及 所述热传输层在所述切片的第二表面上的第二暴露部分。

公开(公告)号：US20070231560A1

公开(公告)日：2007-10-04

申请号：US11247114

申请日：2005-10-11

Applicant: Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

Inventor： Jian Zhang ,  Sandeep Tonapi ,  Ryan Mills ,  Arun Gowda

IPC: B32B5/16

CPC classification number: F28F13/00 ,  F28F2013/005 ,  H01L23/3733 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00

Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

Abstract translation: 提供具有热传输层和树脂层的热传输结构。 热传输层可以包括第一表面和第二表面，并且具有设置在热传输层中的导热材料，其中导热材料沿预定方向取向以便于相对于预定方向的热传导。 此外，树脂层固定到热传输层第二表面，其中树脂层的导热性比热传输层相对较少。

公开(公告)号：US20070131912A1

公开(公告)日：2007-06-14

申请号：US11177901

申请日：2005-07-08

Applicant: Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

Inventor： Davide Simone ,  Thomas Angeliu ,  Sandeep Tonapi ,  David Gibson ,  Jian Zhang

IPC: H01B1/12

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C08K3/08 ,  C08K2201/011 ,  C08L83/00 ,  C08L2666/54 ,  C09J9/02 ,  C09J11/04 ,  C09J183/04 ,  C09J2483/00 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Abstract translation: 本发明提供一种导电粘合剂组合物，其具有固化的低模量弹性体和冶金结合的微米级金属颗粒和纳米尺寸的金属颗粒。 低弹性弹性体通过减轻产生的应力来提供机械坚固性和可靠性; 并且冶金结合的微米级金属颗粒和纳米级金属颗粒提供具有最小界面电阻的连续导电路径。 纳米尺寸金属颗粒的添加降低了熔化温度，并允许在可控温度下进行冶金结合。

公开(公告)号：US20060293172A1

公开(公告)日：2006-12-28

申请号：US11167847

申请日：2005-06-23

Applicant: Slawomir Rubinsztajn ,  John Campbell ,  Ryan Mills ,  Sandeep Tonapi ,  Ananth Prabhakumar

Inventor： Slawomir Rubinsztajn ,  John Campbell ,  Ryan Mills ,  Sandeep Tonapi ,  Ananth Prabhakumar

IPC: B01J31/00

CPC classification number: H01L23/293 ,  B01J31/0237 ,  B01J31/0244 ,  B01J31/146 ,  C08G59/68 ,  C08G59/70 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract translation: 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可包括固化催化剂。 电子设备可以包括可固化组合物。 还提供与前述相关的方法。

公开(公告)号：US20050148721A1

公开(公告)日：2005-07-07

申请号：US11062040

申请日：2005-02-18

Applicant: Sandeep Tonapi ,  Hong Zhong ,  Florian Schattenmann ,  Jennifer David ,  Kimberly Saville ,  Arun Gowda ,  David Esler ,  Ananth Prabhakumar

Inventor： Sandeep Tonapi ,  Hong Zhong ,  Florian Schattenmann ,  Jennifer David ,  Kimberly Saville ,  Arun Gowda ,  David Esler ,  Ananth Prabhakumar

IPC: C08L83/04 ,  C09J183/04 ,  H01L23/373 ,  H01L23/42 ,  C08K3/34

CPC classification number: C09J183/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K2201/005 ,  C08L83/04 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/12044 ,  H01L2924/3011 ,  C08L83/00 ,  H01L2924/00

Abstract: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.

公开(公告)号：US20050049352A1

公开(公告)日：2005-03-03

申请号：US10737943

申请日：2003-12-16

Applicant: Slawomir Rubinsztajn ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar ,  Ryan Mills

Inventor： Slawomir Rubinsztajn ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar ,  Ryan Mills

IPC: C08K9/06 ,  C08L63/00 ,  C09C1/30 ,  H01L21/56 ,  H01L23/29 ,  C08K3/34

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

Abstract translation: 提供了用作底部填充材料的溶剂改性树脂组合物。 所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。 溶剂改性树脂组合物可用于制备透明的B阶树脂膜。 本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。

公开(公告)号：US20070241303A1

公开(公告)日：2007-10-18

申请号：US11207865

申请日：2005-08-19

Applicant: Hong Zhong ,  Sara Paisner ,  Arun Gowda ,  David Esler ,  Sandeep Tonapi ,  Jennifer David ,  Paulo Meneghetti ,  Laurence Maniccia ,  Paul Hans ,  Robert Fortuna ,  Gregory Strosaker ,  Gregory Shaffer ,  Hollister Victor ,  Ajit Sane

Inventor： Hong Zhong ,  Sara Paisner ,  Arun Gowda ,  David Esler ,  Sandeep Tonapi ,  Jennifer David ,  Paulo Meneghetti ,  Laurence Maniccia ,  Paul Hans ,  Robert Fortuna ,  Gregory Strosaker ,  Gregory Shaffer ,  Hollister Victor ,  Ajit Sane

IPC: H01L29/12

CPC classification number: C08K3/38 ,  C08K9/04 ,  C08K2003/385 ,  C08K2201/001 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Thermally conductive compositions containing spherical boron nitride filler particles having an average aspect ration of less than 2.0 in a polymer matrix.

Abstract translation: 在聚合物基质中含有平均长宽比小于2.0的球形氮化硼填料颗粒的导热组合物。

公开(公告)号：US20060065387A1

公开(公告)日：2006-03-30

申请号：US10950554

申请日：2004-09-28

Applicant: Sandeep Tonapi ,  Arun Gowda ,  Kevin Durocher ,  David Esler ,  Hong Zhong ,  Ananth Prabhakumar

Inventor： Sandeep Tonapi ,  Arun Gowda ,  Kevin Durocher ,  David Esler ,  Hong Zhong ,  Ananth Prabhakumar

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L21/4878 ,  H01L21/563 ,  H01L23/367 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic assembly having at least a heat dissipating unit and a heat generating unit is provided. At least one of the heat dissipating unit and the heat generating unit has at least one deliberately modified surface.

Abstract translation: 提供具有至少散热单元和发热单元的电子组件。 散热单元和发热单元中的至少一个具有至少一个故意改变的表面。

公开(公告)号：US20050266263A1

公开(公告)日：2005-12-01

申请号：US11155990

申请日：2005-06-17

Applicant: John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

Inventor： John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

IPC: B32B15/00

CPC classification number: H01L23/293 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/22 ,  C08G59/3218 ,  C08G59/68 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  C09C3/12 ,  C09J163/00 ,  H01L24/81 ,  H01L2224/274 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12812 ,  H01L2924/00

Abstract: A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.

Abstract translation: 提供细碎的耐火固体和相关方法。 该固体可具有大于约5平方米/克的表面积。 固体可以具有每平方毫米表面积的活性表面终止位置的密度足够低，使得包含小于约99重量％的固体的可固化树脂的可固化组合物在a以后的稳定比小于约3 期间约两周。 此外，提供了包含固化层的固化性组合物，固化层和电子器件。

公开(公告)号：US20050129956A1

公开(公告)日：2005-06-16

申请号：US10737453

申请日：2003-12-16

Applicant: Slawomir Rubinsztajn ,  John Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

Inventor： Slawomir Rubinsztajn ,  John Campbell ,  Ananth Prabhakumar ,  Sandeep Tonapi

IPC: C08G59/42 ,  C08G77/14 ,  C08G77/38 ,  B32B27/38 ,  C08L63/00 ,  C08L83/00

CPC classification number: C08G59/423 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31663

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract translation: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。