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公开(公告)号：KR1020140015870A
公开(公告)日：2014-02-07
申请号：KR1020120081699
申请日：2012-07-26
Applicant: 도레이첨단소재 주식회사
CPC classification number: C23C14/34 , C23C14/021 , C23C14/20 , C23C14/24
Abstract: The present invention relates to a manufacturing method of a double side soft metal lamination film manufactured by a double sputtering method and the soft metal lamination film manufactured thereby and more specifically, to a double side soft metal lamination film manufacture by forming a metallic oxide layer after sputtering in vacuum status as a constituent material of a double side soft circuit exclusive to a microcircuit, and performing a roll to roll coiling pressure, without causing blocking phenomenon on the metal surface, to form a vacuum deposition on both sides of the film.
Abstract translation: 本发明涉及通过双溅射法制造的双面软金属层压膜及其制造的软金属层压膜的制造方法，更具体地说，涉及通过以下方式形成金属氧化物层的双面软金属层压膜制造方法 在真空状态下溅射作为微电路专用的双面软电路的构成材料，并且在不引起金属表面的阻塞现象的情况下进行卷绕卷取压力，以在膜的两侧形成真空沉积。
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公开(公告)号：KR1020160096738A
公开(公告)日：2016-08-17
申请号：KR1020150017736
申请日：2015-02-05
Applicant: 도레이첨단소재 주식회사
CPC classification number: B32B15/08 , B32B15/20 , H05K9/0088
Abstract: 본발명에서는기재필름의제1면에전자파차폐용구리박막필름이적층되고, 제2면에회로형성용구리박막필름이적층된서브트랙티브공정용양면연성구리박막적층필름의제조방법으로서, 기재필름의제1면에플라즈마처리를수행하는제1단계; 상기플라즈마처리된제1면상에 Ni/Cr-타이층과 Cu-시드층을순차적으로적층하는제2단계; 상기기재필름의제2면에플라즈마처리를수행하는제3단계; 상기플라즈마처리된제2면상에 Ni/Cr-타이층과 Cu-시드층을순차적으로적층하는제4단계; 및상기제1면과제2면의 Cu-시드층상에전착을수행하여도금층을형성하는제5단계;를포함하는양면연성구리박막적층필름의제조방법을제공한다. 본발명의제조방법에따르면, 회로형성면의핀홀개수가가로 156mm×세로 300mm인면을기준으로 20개이하이고; 전자파차폐면의박리강도가 0.30kg/cm 이상인구리박막적층필름을제조할수 있다.
Abstract translation: 本发明涉及一种用于制造用于减薄方法的双面柔性覆铜层叠膜的方法，其中用于屏蔽电磁波的覆铜层压膜被放置在基膜的第一表面上，并且用于电路的铜包覆层压膜 形成位于基膜的第二表面上。 本发明提供了制造双面柔性覆铜层叠膜的方法，包括：等离子体处理基膜的第一表面的第一步骤; 在等离子体处理的第一表面上连续放置Ni / Cr结合层和Cu籽晶层的第二步骤; 对基膜的第二表面进行等离子体处理的第三步骤; 在等离子体处理的第二表面上连续放置Ni / Cr结合层和Cu籽晶层的第四步骤; 以及通过电沉积在第一和第二表面的Cu种子层上形成涂层的第五步骤。 根据本发明，其中形成在电路形成表面上的针孔数目为宽度为156mm，长度为300mm的表面为20个以下的覆铜层叠膜以及电磁波的剥离强度 屏蔽面为0.30kg / cm以上。
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公开(公告)号：KR1020140072409A
公开(公告)日：2014-06-13
申请号：KR1020120139462
申请日：2012-12-04
Applicant: 도레이첨단소재 주식회사
Abstract: The present invention relates to a semi-additive flexible copper clad laminated film and a method for manufacturing the same. The method for manufacturing the semi-additive flexible copper clad laminated film of the present invention capable of minimizing the generation of a pin hole includes: a step of increasing surface chemical active, surface cleaning, and roughness by performing a plasma process on a polyimide film in a vacuum atmosphere in order to ensure adhesive between the polyimide film and a metal; and a step of depositing a seed layer (Cu) on a tie layer (Ni-Cr alloy) functioning as a conductive layer deposited on a surface of a plasma processed nonconductive polyimide film at a thickness of 500Å to 1500Å using a sputtering method, which is a physical vapor deposition (PVD) method. The method for manufacturing a semi-additive flexible copper clad laminated film capable of minimizing the generation of a pin hole significantly reduces the number of generated pin hole and prevents failures in a shape and a pattern by setting the thickness of a seed layer to a specific condition by depositing a tie layer functioning as a conductive layer on a surface of plasma processed nonconductive polyimide film using a sputtering method, which is the physical vapor deposition method so as to form a super fine circuit of the semi-additive flexible copper clad laminated film of a super fine pattern, thereby solving the conventional problem caused by the generation of the pin hole.
Abstract translation: 本发明涉及一种半添加弹性铜包层叠膜及其制造方法。 能够最小化针孔产生的本发明的半附加弹性铜包层叠膜的制造方法包括：通过在聚酰亚胺膜上进行等离子体处理来增加表面化学活性，表面清洁和粗糙度的步骤 在真空气氛中，以确保聚酰亚胺膜和金属之间的粘合剂; 以及使用溅射法在作为等离子体处理的非导电性聚酰亚胺膜的表面上沉积作为导电层的接合层（Ni-Cr合金）上沉积种子层（Cu）的步骤，所述等离子体处理的非导电聚酰亚胺膜的厚度为500〜 是物理气相沉积（PVD）方法。 制造能够最小化针孔产生的半附加弹性铜包覆层压膜的方法通过将种子层的厚度设定为特定的尺寸来显着地减少产生的销孔的数量并防止形状和图案的失效 通过使用溅射法在等离子体处理的非导电聚酰亚胺膜的表面上沉积用作导电层的连接层的条件，该溅射法是物理气相沉积法，以形成半添加的柔性铜包层叠膜的超细电路 从而解决了由于销孔产生而引起的常规问题。
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公开(公告)号：KR1020120083032A
公开(公告)日：2012-07-25
申请号：KR1020110004456
申请日：2011-01-17
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper clad laminate for a semi-additive and a producing method thereof are provided to prevent the generation of sunken portions on a pattern when copper plating. CONSTITUTION: A producing method of a flexible copper clad laminate for a semi-additive comprises the following steps: processing the surface of polyimide using active gas of oxygen and nitrogen; vacuum-evaporating a copper seed layer and tie layer Ni-Cr on the surface of the polyimide as a conductive layer using a DC magnetron sputtering method; and applying a plating solution containing a copper sulfate solution and a carrier on the polyimide with the copper conductive layer, to obtain copper using an electroplating method. The plating solution contains chlorine in the concentration of 1-60mg/L, and a brighter in the concentration of 5-17mg/L.
Abstract translation: 目的：提供一种用于半添加剂的柔性覆铜层压板及其制造方法，以防止在镀铜时在图案上产生凹陷部分。 构成：用于半添加剂的柔性覆铜层压板的制造方法包括以下步骤：使用氧和氮的活性气体处理聚酰亚胺的表面; 使用直流磁控溅射法在聚酰亚胺的表面上真空蒸发铜籽晶层和粘结层Ni-Cr作为导电层; 并将含有硫酸铜溶液和载体的电镀液与铜导电层一起涂覆在聚酰亚胺上，使用电镀法得到铜。 电镀溶液含有浓度为1-60mg / L的氯，浓度为5-17mg / L时更亮。
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