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公开(公告)号：KR1020130001923A
公开(公告)日：2013-01-07
申请号：KR1020110062850
申请日：2011-06-28
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper clad laminate film for semi-additive and a method for preparing the same are provided to remove a space for generating migration. CONSTITUTION: A polyimide film is treated with plasma in a vacuum condition. The adhesive force between a polyimide film and a metal film and a polyimide film and a potting device is guaranteed through the improvement of surface chemical activity, surface cleaning, and roughness. A tie layer and a seed layer are successively evaporated on the non-conductive polyimide film surface. A polyimide film is deposited while maintaining the concentration of an anteed reagent and an additive.
Abstract translation: 目的：提供一种用于半添加剂的柔性覆铜层压膜及其制备方法，以去除用于产生迁移的空间。 构成：在真空条件下用等离子体处理聚酰亚胺膜。 通过提高表面化学活性，表面清洁度和粗糙度，可以保证聚酰亚胺膜与金属膜，聚酰亚胺膜和灌封装置之间的粘合力。 在非导电聚酰亚胺膜表面上依次蒸发连接层和种子层。 在保持浓度的前体试剂和添加剂的同时沉积聚酰亚胺膜。
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Patent Agency Ranking
公开(公告)号：KR1020140015870A
公开(公告)日：2014-02-07
申请号：KR1020120081699
申请日：2012-07-26
Applicant: 도레이첨단소재 주식회사
CPC classification number: C23C14/34 , C23C14/021 , C23C14/20 , C23C14/24
Abstract: The present invention relates to a manufacturing method of a double side soft metal lamination film manufactured by a double sputtering method and the soft metal lamination film manufactured thereby and more specifically, to a double side soft metal lamination film manufacture by forming a metallic oxide layer after sputtering in vacuum status as a constituent material of a double side soft circuit exclusive to a microcircuit, and performing a roll to roll coiling pressure, without causing blocking phenomenon on the metal surface, to form a vacuum deposition on both sides of the film.
Abstract translation: 本发明涉及通过双溅射法制造的双面软金属层压膜及其制造的软金属层压膜的制造方法，更具体地说，涉及通过以下方式形成金属氧化物层的双面软金属层压膜制造方法 在真空状态下溅射作为微电路专用的双面软电路的构成材料，并且在不引起金属表面的阻塞现象的情况下进行卷绕卷取压力，以在膜的两侧形成真空沉积。
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公开(公告)号：KR101348837B1
公开(公告)日：2014-01-10
申请号：KR1020120046856
申请日：2012-05-03
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 높은 치수안정성의 확보가 가능한 연성 구리박막 적층필름의 처리 방법 및 이에 의해 얻어진 연성 구리박막 적층필름에 대한 것으로, 상기한 본 발명의 높은 치수안정성의 확보가 가능한 연성 구리박막 적층필름의 처리 방법은 연성 구리박막 적층필름의 제조 공정에 있어서, 연성 및 내열성이 뛰어난 고분자인 폴리이미드 필름 위에 타이(Tie) 층, 시드(Seed) 층을 스퍼터링(Sputtering) 법을 이용하여 순차적으로 증착하고 도금법을 이용하여 구리층을 적층한 후, 제조된 연성 구리박막 적층필름을 10
-4 내지 10
-1 Torr 범위의 감압상태의 진공 탱크(Tank)에서 IR(Infrared) 소스(source)로 40 내지 100℃로 열처리를 행하며 1시간 이상 진공 열처리하는 단계를 포함함을 특징으로 한다.
상기와 같이 구성되는 본 발명의 높은 치수안정성의 확보가 가능한 연성 구리박막 적층필름의 처리 방법은 특정한 조건에서 진공 열처리를 수행하므로 종래의 패터닝 및 접합 불량을 발생시키는 문제를 해결하고 진공 상태에서 산화물 형성을 방지하고 변화 응력의 최소화로 접착력을 향상시켜 우수한 밀착력 및 에칭성을 가질 수 있게 한다.-
公开(公告)号：KR1020130123603A
公开(公告)日：2013-11-13
申请号：KR1020120046856
申请日：2012-05-03
Applicant: 도레이첨단소재 주식회사
CPC classification number: B32B15/08 , B32B15/20 , B32B27/281 , C23C28/02
Abstract: The present invention relates to a flexible copper thin film laminated film treating method, which is capable of securing high dimensional stability, and a flexible copper thin film laminated film obtained by using the same. The flexible copper thin film laminated film treating method, which is capable of securing high dimensional stability in a manufacturing process of flexible copper thin film laminated films, of the present invention comprises the following steps of: successively depositing a tie layer and a seed layer on a high polymer polyamide film with excellent flexibility and thermal resistance by using a sputtering method; laminating a copper layer thereon by using a plating method; heat-treating the manufactured flexible copper thin film laminated films at 40-100 in a vacuum tank in a decompressed state within the range of 10-4 or 10-1 Torr by using an infrared (IR) source; and vacuum-heat-treating the manufactured flexible copper thin film laminated films for more than one hour. The flexible copper thin film laminated film treating method, which is capable of securing the high dimensional stability in the manufacturing process of flexible copper thin film laminated films, of the present invention solves problems which generate the defections of old patterning and bonding by performing heat-treatment under specific conditions; prevents the formation of oxides in a vacuum state; and has excellent bonding power and etching properties by improving adhesive force by minimizing changing stress.
Abstract translation: 本发明涉及一种能够确保高尺寸稳定性的柔性铜薄膜层叠膜处理方法和使用该柔性铜薄膜层压膜。 本发明的柔性铜薄膜层叠膜的制造工序中能够确保高尺寸稳定性的柔性铜薄膜层叠膜处理方法包括以下步骤：将连接层和种子层依次沉积在 通过使用溅射法具有优异的柔性和耐热性的高分子聚酰胺薄膜; 使用电镀法在其上层叠铜层; 使用红外（IR）光源，在10-4或10-1乇的减压状态的真空槽中，在40-100℃下热处理制造的柔性铜薄膜叠层膜; 对所制造的柔性铜薄膜层叠膜进行1小时以上的真空热处理。 本发明的柔性铜薄膜层叠膜的制造工序中能够确保高尺寸稳定性的柔性铜薄膜层叠膜处理方法，通过进行热处理，可以解决产生旧的图案化和结合的缺陷的问题， 在特定条件下治疗; 防止在真空状态下形成氧化物; 并且通过使改变的应力最小化来提高粘合力，具有良好的接合力和蚀刻性能。
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公开(公告)号：KR1020130020242A
公开(公告)日：2013-02-27
申请号：KR1020110082749
申请日：2011-08-19
Applicant: 도레이첨단소재 주식회사
CPC classification number: C08J5/18 , B29B13/023 , B29D7/01 , C08J3/00 , C08L79/08
Abstract: PURPOSE: A drying method of a polyimide film is provided to reduce the generation of unnecessary compounds and oxides in a sputtering process and to provide a polyimide film with improved adhesion and insulation. CONSTITUTION: A drying method of a polyimide film comprises a step of vacuum and dry treating the polyimide film for 40 hours or more in a vacuum tank(1) of 10^(-4) - 10^(-2) torr to manufacture a COF(Chip On Film) with adhesion and insulation. The polyimide film is winded around a core in a roll state and is dried by being fixed by a supporting plate, which is connectable to a core, to prevent the contact to the inner side of the vacuum tank.
Abstract translation: 目的：提供一种聚酰亚胺薄膜的干燥方法，以减少在溅射过程中不需要的化合物和氧化物的产生，并提供具有改善的粘附性和绝缘性的聚酰亚胺薄膜。 构成：聚酰亚胺膜的干燥方法包括在10 ^（ - 4）-10 ^（ - 2）托的真空槽（1）中真空干燥处理聚酰亚胺膜40小时以上的步骤，制造 COF（贴片胶片）具有附着力和绝缘性。 聚酰亚胺薄膜以卷状卷绕在芯上，并通过可连接到芯的支撑板固定而干燥，以防止与真空罐的内侧接触。
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公开(公告)号：KR1020130016851A
公开(公告)日：2013-02-19
申请号：KR1020110079014
申请日：2011-08-09
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper foil laminated film and a manufacturing method thereof capable of an etching ability modulation are provided to secure a fine and stable pattern by controlling a form of pattern according to an affinity to etching inhibitor of the etchant. CONSTITUTION: A polyimide film is plasma processed under vacuum condition. The plasma processing uses Ar, O2 and N2 gas as input gas. The polyimide film's adhesive strength of the metal and the affinity to etching the inhibitor are controlled. A tie layer and a seed layer are successively vacuum evaporated on the polyimide film using a sputtering method. An additive and a correcting agent are electrodeposited to the polyimide film.
Abstract translation: 目的：提供一种柔性铜箔层叠膜及其能够进行蚀刻能力调制的制造方法，以通过根据与蚀刻剂的蚀刻抑制剂的亲和性控制图案的形式来确保细微且稳定的图案。 构成：聚酰亚胺膜在真空条件下进行等离子体处理。 等离子体处理使用Ar，O2和N2气体作为输入气体。 控制聚酰亚胺膜对金属的粘合强度和蚀刻抑制剂的亲和力。 使用溅射法在聚酰亚胺膜上连续地真空蒸发连接层和籽晶层。 将添加剂和校正剂电沉积到聚酰亚胺膜上。
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