公开(公告)号：KR1020130082389A

公开(公告)日：2013-07-19

申请号：KR1020120003580

申请日：2012-01-11

Applicant: 도레이첨단소재 주식회사

Inventor： 류연정 ,  서창호

IPC: C09J4/00 ,  C09J4/02 ,  C09J11/04 ,  C09J7/02

CPC classification number: C09J4/00 ,  C09J7/22 ,  C09J7/30 ,  C09J7/385 ,  C09J11/04 ,  C09J2205/10 ,  C09J2205/102

Abstract: PURPOSE: A composition of water based emulsion viscosity material and an adhesive film using the same are provided to aggressively respond to environment regulations, to make use circumstance better and to have excellent heat resistance and shearing force. CONSTITUTION: A composition of water based emulsion viscosity material contains a monomer mixture including one or more monomer among 2- ethylhexylacrylat, N-butyl acrylate methylmethacrylate and acrylic acid monomer, deionized water, surfactant, nano particle (3), sodium hydrogen carbonate and ammonium persulfate. An adhesive film has a base film (1) and water based emulsion viscosity material coated with the composition of water based emulsion viscosity material on the base film.

Abstract translation: 目的：提供水性乳液粘度物质的组合物和使用该组合物的粘合膜，以积极响应环境条件，使环境更好，并具有优异的耐热性和剪切力。 构成：水基乳液粘度材料的组合物含有包括2-乙基己基丙烯酸酯，丙烯酸甲酯丙烯酸甲酯和丙烯酸单体之间的一种或多种单体，去离子水，表面活性剂，纳米颗粒（3），碳酸氢钠和铵的单体混合物 过。 粘合膜具有在基膜上涂覆有基于水​​基乳液粘度材料的组合物的基膜（1）和水基乳液粘度材料。

公开(公告)号：KR1020120110755A

公开(公告)日：2012-10-10

申请号：KR1020110028823

申请日：2011-03-30

Applicant: 도레이첨단소재 주식회사

Inventor： 류연정 ,  서창호

IPC: C09J4/02 ,  C09J133/04 ,  C09J11/02

CPC classification number: C09J11/06 ,  C09J4/00 ,  C09J9/00 ,  C09J11/04 ,  C09J11/08 ,  C09J133/04

Abstract: PURPOSE: An aqueous emulsion adhesive composition is provided to actively cope with environment-friendly regulations and to improve heat resistance by using phase change material. CONSTITUTION: An aqueous emulsion adhesive composition comprises a monomer mixture comprising at least one monomer selected from 2-ethylhexylacrylate, n-butylacrylate, methylmethacrylate and acrylic acid monomer, deionized water, a surfactant, a phase change material, sodium hydrogen carbonate and ammonium persulfate. A content of the phase transition material is 1-10 weight% based on total weight of the aqueous emulsion adhesive composition.

Abstract translation: 目的：提供水性乳液粘合剂组合物，以积极应对环境友好的规定，并通过使用相变材料改善耐热性。 构成：水性乳液粘合剂组合物包含包含至少一种选自丙烯酸2-乙基己酯，丙烯酸正丁酯，甲基丙烯酸甲酯和丙烯酸单体，去离子水，表面活性剂，相变材料，碳酸氢钠和过硫酸铵的单体的单体混合物。 相变材料的含量相对于水乳液粘合剂组合物的总重量为1-10重量％。

公开(公告)号：KR1020090053062A

公开(公告)日：2009-05-27

申请号：KR1020070119697

申请日：2007-11-22

Applicant: 도레이첨단소재 주식회사

Inventor： 전해상 ,  문기정 ,  심창훈 ,  류연정

IPC: C09K19/02 ,  H01L21/52

Abstract: 본 발명은 다이싱·다이본드용 점착테이프에 관한 것으로서, 보다 상세하게는 다이싱테이프가 따로 필요하지 않으며, 접착필름에 페녹시 골격을 함유한 에폭시 수지와 에너지선 중합형 화합물의 첨가로 자외선 경화함에 따라 다이의 픽업성능이 향상되고, 접착특성이 우수한 다이싱·다이본드용 점착테이프에 관한 것이다. 이를 위해 본 발명에 따른 다이싱·다이본드용 점착테이프는 반도체 다이싱 및 다이본딩에 사용되는 다이본드용 점접착테이프에 있어서, 기재와 그 위에 형성된 점접착제층을 포함하되, 상기 점접착제층은 (A)점착성분, (B)에폭시수지, (C)경화제, (D)잠재성 경화촉진제, (E)에너지선 경화형 올리고머 및 (F)광개시제를 포함하며, 상기 (B)에폭시수지는 페녹시 골격을 포함하는 에폭시 수지인 것을 특징으로 한다.
다이싱, 다이본드, 점착테이프, 점접착제층, 에폭시수지, 페녹시 골격

公开(公告)号：KR1020110121195A

公开(公告)日：2011-11-07

申请号：KR1020100040676

申请日：2010-04-30

Applicant: 도레이첨단소재 주식회사

Inventor： 류연정 ,  심창훈 ,  최성환 ,  문기정 ,  김상필

IPC: C09J133/04 ,  C09J4/02 ,  C09J7/02 ,  B32B7/06

CPC classification number: C09J133/04 ,  B32B7/06 ,  C09J4/00 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/606 ,  C09J2203/30 ,  C09J2205/10

Abstract: PURPOSE: A processing film for a film assist mold is provided to avoid the damage from working resistance and impact and a cleaning process for preventing the contamination of a matrix when applied to a mold matrix such as compression molding. CONSTITUTION: A processing film for a film assist mold has a bilayered structure which forms a base film and an adhesive layer having releasability on the base film. The elongation rate of the base film is 150~300%. The one side of the processing film is treated by a primer. The adhesive layer having releasability is coated by an adhesive composition including an acryl-based polymer, UV curable acrylate oligomer, photoinitiator and hardener.

Abstract translation: 目的：提供一种用于胶片辅助模具的加工膜，以避免工作阻力和冲击的损害，以及用于防止当被施加到诸如压缩成型的模具基体时对基体的污染的清洁过程。 构成：用于胶片辅助模具的加工膜具有双层结构，其形成基膜和在基膜上具有剥离性的粘合剂层。 基膜的伸长率为150〜300％。 处理膜的一面用底漆处理。 具有脱模性的粘合剂层通过包含丙烯酸类聚合物，UV固化丙烯酸酯低聚物，光引发剂和硬化剂的粘合剂组合物涂布。

公开(公告)号：KR1020110076388A

公开(公告)日：2011-07-06

申请号：KR1020090133087

申请日：2009-12-29

Applicant: 도레이첨단소재 주식회사

Inventor： 류연정 ,  전해상 ,  문기정 ,  심창훈 ,  최성환

IPC: H01L23/28

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/18165 ,  H01L23/28 ,  H01L21/565 ,  H01L21/78 ,  H01L2224/85 ,  H01L2924/00014

Abstract: PURPOSE: A molding process film for a semiconductor package is provided to maximize the efficiency of a punching process by forming concavo-convexes parts on the molded surface of the semiconductor package to prevent the cracking phenomenon of chip edges in the punching process. CONSTITUTION: One side of a base film(1) is corona-processed. An adhesive layer(2) is arranged on the corona-processed side of the base film using a composition including 100 parts by weight of acrylic polymer, 5 to 100 parts by weight of organic particles, 10 to 200 parts by weight of ultraviolet ray-based hardening acrylate oligomer, 0.6 to 5 parts by weight of a photo initiator, 0.5 to 5 parts by weight of a hardener. The thickness of the adhesive layer is between 2 and 30um.

Abstract translation: 目的：提供一种用于半导体封装的成型工艺膜，以通过在半导体封装的模制表面上形成凹凸部分来最大化冲压加工的效率，以防止冲压加工中的切屑边缘的开裂现象。 构成：基膜（1）的一面被电晕处理。 使用包含100重量份丙烯酸类聚合物，5至100重量份有机颗粒，10至200重量份紫外线照射组合物的组合物在基膜的电晕处理侧上设置粘合剂层（2） 硬化丙烯酸酯低聚物，0.6〜5重量份的光引发剂，0.5〜5重量份的硬化剂。 粘合剂层的厚度在2至30um之间。

公开(公告)号：KR1020100072904A

公开(公告)日：2010-07-01

申请号：KR1020080131450

申请日：2008-12-22

Applicant: 도레이첨단소재 주식회사

Inventor： 류연정 ,  전해상 ,  문기정 ,  심창훈

IPC: H01L23/28

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/18165 ,  H01L21/565 ,  H01L21/324 ,  H01L23/28 ,  H01L2924/00014 ,  H01L2224/85

Abstract: PURPOSE: A mold processing film for a semiconductor package is provided to improve heat resistance and protest a lead and a terminal from a molding resin by closely masking the exposed part of a lead and terminal during a molding process. CONSTITUTION: A mold processing film comprises a base film(1) which has a one side where a corona processing is executed and an adhesive layer(2) which is spread to the corona processed surface of the base film. The adhesive layer is spread to composition including Acryl based polymer and UV curable Acrylate oligomer, photoinitiator, and hardener. The thickness of the adhesive layer is 2um~30um.

Abstract translation: 目的：提供一种用于半导体封装的模具加工膜，以通过在模制过程中紧密掩蔽引线和端子的暴露部分来改善耐热性并且通过模制树脂来抵抗引线和端子。 构成：模具加工膜包括具有执行电晕处理的一侧的基膜（1）和扩散到基膜的电晕处理表面的粘合剂层（2）。 将粘合剂层铺展成包括丙烯酸基聚合物和UV固化丙烯酸酯低聚物，光引发剂和硬化剂的组合物。 粘合剂层的厚度为2um〜30um。