公开(公告)号：KR101132346B1

公开(公告)日：2012-04-05

申请号：KR1020100008320

申请日：2010-01-29

Applicant: 도레이첨단소재 주식회사

Inventor： 전경연 ,  전해상 ,  문기정 ,  심창훈 ,  최성환

IPC: C09J133/08 ,  C09J4/02 ,  C09J7/02 ,  H01L21/30

Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.

公开(公告)号：KR1020110119013A

公开(公告)日：2011-11-02

申请号：KR1020100038470

申请日：2010-04-26

Applicant: 도레이첨단소재 주식회사

Inventor： 전경연 ,  김상필 ,  문기정 ,  심창훈 ,  최성환

IPC: H01L21/50

Abstract: PURPOSE: A method for manufacturing a fan out type wafer level package is provided to secure dimensional stability by forming an adhesive layer which is robust against shear stress. CONSTITUTION: An auxiliary device(1) laminates and fixes an adhesive tape. A carrier(2) supporting the adhesive tape is located under the auxiliary device. The adhesive tape includes a single structure with a die bonding surface adhesive layer(3) on a base film(4) or a double sided structure with the die bonding surface adhesive layer and a carrier surface adhesive layer(5) on both sides of the base film. The inner diameter of the auxiliary device is larger than the outer diameter of the carrier.

Abstract translation: 目的：提供一种用于制造扇出型晶片级封装的方法，以通过形成对剪切应力鲁棒的粘合剂层来确保尺寸稳定性。 构成：辅助装置（1）层叠并固定胶带。 支撑粘合带的载体（2）位于辅助装置下方。 胶带包括在基膜（4）上具有芯片接合表面粘合剂层（3）的单一结构或具有芯片粘合表面粘合剂层的双面结构和在两个侧面上的载体表面粘合剂层（5） 底片 辅助装置的内径大于载体的外径。

公开(公告)号：KR1020110088698A

公开(公告)日：2011-08-04

申请号：KR1020100008320

申请日：2010-01-29

Applicant: 도레이첨단소재 주식회사

Inventor： 전경연 ,  전해상 ,  문기정 ,  심창훈 ,  최성환

IPC: C09J133/08 ,  C09J4/02 ,  C09J7/02 ,  H01L21/30

CPC classification number: C09J133/08 ,  C09J4/00 ,  C09J7/22 ,  C09J7/30 ,  C09J7/35 ,  C09J7/385 ,  C09J7/40 ,  C09J2203/326 ,  H01L21/30

Abstract: PURPOSE: An adhesive composition is provided to prevent the deformation of an adhesive layer with no interaction with a resin sealant and to avoid dishift and moldflash by the resin sealing temperature and pressure. CONSTITUTION: An adhesive composition for a fan-out wafer level package comprises 100.0 parts by weight of acrylic copolymers, 0.1~20 parts by weight of thermosetting materials, 0.2-10 parts by weight of energy beam-curable acrylic oligomer, and 0.05-15 parts by weight of photoinitiators. The molecular weight of the acrylic copolymer is 400,000~4,000,000 g/mol. The photoinitiator is one or more selected from the group consisting of phenyl glyoxylate- and acyl phosphine oxide-based photoinitiators.

Abstract translation: 目的：提供粘合剂组合物，以防止与树脂密封剂无相互作用的粘合剂层的变形，并且通过树脂密封温度和压力避免冷却和吹塑。 构成：用于扇出晶片级封装的粘合剂组合物包含100.0重量份的丙烯酸共聚物，0.1〜20重量份的热固性材料，0.2-10重量份的能量束固化的丙烯酸低聚物和0.05-15 重量份的光引发剂。 丙烯酸共聚物的分子量为400,000〜4,000,000g / mol。 光引发剂是选自苯基乙醛酸酯化物和酰基氧化膦类光引发剂中的一种或多种。