公开(公告)号：KR1020110065310A

公开(公告)日：2011-06-15

申请号：KR1020100101606

申请日：2010-10-19

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 오오따요시하루 ,  모또다기미오 ,  야히로슌이찌 ,  가와우찌다꾸오

IPC: G02F1/13 ,  H01L21/02

CPC classification number: G02F1/1303 ,  H01L21/67034 ,  H01L21/6715 ,  H01L21/67703

Abstract: PURPOSE: A substrate processing device, a substrate processing method, and program for executing the substrate processing method are provided not to increase a device cost and to prevent occurrence of an evenness of film thickness of a spraying film which is formed by a dry processing. CONSTITUTION: A substrate processing device includes as follows. A carrier way carries the substrate to one direction in one state which processed surface of the substrate to be faced up. A flotation stage(110) dry processes the substrate. A first supply source supplies the gas to the discharge hole.

Abstract translation: 目的：提供一种用于执行基板处理方法的基板处理装置，基板处理方法和程序，其不会增加装置成本，并且防止通过干式加工形成的喷涂膜的膜厚的均匀性。 构成：基板处理装置包括如下。 承载方式将衬底沿一个方向运送到一个状态，该状态处理衬底面朝上的表面。 漂浮阶段（110）干燥处理基材。 第一供应源将气体供应到排放孔。