Abstract:
PURPOSE: A developing device and a developing method are provided to reduce non-uniformity in a developing process by setting a transfer speed of a substrate with a discharge timing of developers from a second development nozzle. CONSTITUTION: A first development nozzle coats developers from the front to the rear of a substrate transferred on a transfer path. A substrate information obtaining unit(20) obtains information about a substrate process. A second development nozzle(13) moves along the transfer path of the lower side of the first development nozzle. A nozzle moving unit moves the second development nozzle. A control unit(25) controls the driving of the nozzle moving unit and the second development nozzle.
Abstract:
A reduced-pressure drying apparatus is provided to inhibit the production of the transfer traces of a substrate contact portion at a coating layer on a substrate minimally. A chamber(106) of a reduced-pressure drying unit(46) is formed by a comparatively flat rectangular body. A space is formed at the inside of the chamber so that a substrate(G) is received. In the carry-in and out direction of the chamber, inlet(110) and outlet(112) with a slit shape are formed at a pair of opposite sidewalls of the chamber. The substrate passes through the inlet and outlet horizontally and narrowly. Gate members(114,116) are attached at the outer wall of the chamber and open and close the inlet and outlet. The upper portion or upper cover of the chamber is removable. Each gate member includes a cover for closing tightly the inlet and outlet with a slit shape.
Abstract:
PURPOSE: A thermal processing device, a thermal processing method, and a recording medium are provided to suppress a change of a thermal processing temperature and make the line width of a wiring pattern between substrates uniform. CONSTITUTION: A substrate returning path(2) transfers a substrate(G) in X direction. The substrate returning path includes a cylindrical roller(20) which is expanded in Y direction. A chamber(8) forms a thermal processing space. The chamber includes a first chamber for forming a thermal processing space of a pre-heating unit(4) and a second chamber for forming a thermal processing space of a main heater unit. An outlet has a slit shape. The outlet is placed on the rear wall of the chamber.
Abstract:
PURPOSE: A substrate processing device, a substrate processing method, and program for executing the substrate processing method are provided not to increase a device cost and to prevent occurrence of an evenness of film thickness of a spraying film which is formed by a dry processing. CONSTITUTION: A substrate processing device includes as follows. A carrier way carries the substrate to one direction in one state which processed surface of the substrate to be faced up. A flotation stage(110) dry processes the substrate. A first supply source supplies the gas to the discharge hole.
Abstract:
An apparatus for treating a substrate is provided to effectively perform a cleaning process and to realize the cost reduction by preventing attachment of impurities to the substrate. An apparatus for treating a substrate includes a conveying means(111) and a cleaning nozzle(116). A substrate(G) to be processed is loaded on a convey passage(32). The conveying means conveys a substrate to be processed to a predetermined direction through the convey passage. The cleaning nozzle supplies cleaning solution to an upper surface of the substrate to be processed. The convey passage includes a horizontal portion conveying the substrate to be process in a horizontal state and an oblique portion forms an upward slope of a predetermined angle from the horizontal portion. The cleaning nozzle is disposed in an upward direction of the oblique portion.