公开(公告)号：KR1020090019944A

公开(公告)日：2009-02-26

申请号：KR1020070084256

申请日：2007-08-22

Applicant: 삼성전자주식회사

Inventor： 정준석 ,  김강인 ,  부재필

IPC: H01L21/02 ,  H01L21/304

Abstract: Heat exhaust equipment of platen cover in a wafer polishing device is provided to lower the surface temperature of the polishing pad by discharging the heat due to the rubbing of the polishing pad. A platen shield cover(50) blocks that the slurry runs away to the outside of platen in the polishing work. The heat exhaust part is formed in the platen shield cover and exhausts the frictional heat of the polishing pad to outside in the polishing work. The heat exhaust part includes a plurality of holes(52) which are formed on the top of the platen shield cover; a plurality of hole caps(54) capable of preventing that the slurry and DIW are splashed through the plurality of holes.

Abstract translation: 提供晶片抛光装置中的压板盖的排热设备，通过抛光抛光垫的摩擦而放出热量来降低抛光垫的表面温度。 压板屏蔽罩（50）在抛光工作中阻止浆料流走到压板的外部。 排热部形成在压板保护罩中，并且在抛光工作中将抛光垫的摩擦热排出到外部。 散热部包括形成在压板屏蔽罩的顶部上的多个孔（52） 多个能够防止浆料和DIW通过多个孔溅出的孔盖（54）。

公开(公告)号：KR1020070115435A

公开(公告)日：2007-12-06

申请号：KR1020060049875

申请日：2006-06-02

Applicant: 삼성전자주식회사

Inventor： 김강인 ,  부재필 ,  김익주 ,  조찬우

IPC: H01L21/304

Abstract: A conditioning disk and a CMP apparatus including the same are provided to stabilize an abrasion rate of a polishing pad by preventing excessive abrasion of the polishing pad because of diamond particles. A conditioning disk(100) is composed by a conditioning plate(104), a plurality of diamond particles(108) and a supporting member(106). The conditioning disk is contacted to a polishing pad(150) of a CMP apparatus. The polishing pad surface is grinded using the diamond particles, and also byproducts which block micro holes(152) on the polishing pad are removed by the diamond particles.

Abstract translation: 提供一种调理盘和包括该调理盘的CMP设备，以通过防止由于金刚石颗粒而导致的抛光垫的过度磨损来稳定抛光垫的磨损率。 调理盘（100）由调节板（104），多个金刚石颗粒（108）和支撑构件（106）组成。 调理盘与CMP设备的抛光垫（150）接触。 使用金刚石颗粒研磨抛光垫表面，并且通过金刚石颗粒除去阻挡抛光垫上的微孔（152）的副产物。