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公开(公告)号:KR1020080067817A
公开(公告)日:2008-07-22
申请号:KR1020070005201
申请日:2007-01-17
Applicant: 삼성전자주식회사
CPC classification number: H01L51/0048 , B82Y10/00 , B82Y20/00 , B82Y30/00 , G02F1/13439 , H01L51/5203 , H01L2251/5369 , Y02E10/549 , Y10S977/734 , Y10S977/742 , Y10S977/75 , Y10S977/902 , Y10S977/932 , Y10T428/249953 , Y10T428/249962 , Y10T428/249964 , Y10T428/249978 , Y10T428/249986 , Y10T428/249987 , Y10T428/254 , Y10T428/30 , Y10T428/31507 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855 , Y10T428/31935 , H01B5/14 , C01B2202/02
Abstract: A carbon nano tube transparent electrode and a manufacturing method thereof are provided to increase transparency and electrical conductivity of the transparent electrode by forming a CNT film in a net-like shape. A carbon nano tube transparent electrode includes a transparent substrate(10) and a net-like CNT(Carbon Nano Tube) film layer(20). The net-like CNT film layer is formed on the transparent substrate. The net-like CNT film layer contains metal particles and nano particles. The CNT is selected from the group consisting of a single-wall CNT, a double-wall CNT, a multi-wall CNT, and a poly-CNT.
Abstract translation: 提供碳纳米管透明电极及其制造方法,以通过形成网状形状的CNT膜来提高透明电极的透明度和导电性。 碳纳米管透明电极包括透明基板(10)和网状CNT(碳纳米管)薄膜层(20)。 网状CNT膜层形成在透明基板上。 网状CNT膜层含有金属粒子和纳米粒子。 CNT选自单壁CNT,双壁CNT,多壁CNT和聚碳纳米管。
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公开(公告)号:KR1019940005449B1
公开(公告)日:1994-06-18
申请号:KR1019910004718
申请日:1991-03-25
Applicant: 삼성전자주식회사
IPC: H01L29/70
Abstract: The method of fabricating bipolar transistor comprises the steps of forming an N-type polysilicon and nitride pattern on an active region, forming a sidewall on the sides of the pattern, selectively growing epitaxial layer between the sidewall and the field oxide, highly doping the epitaxial layer with P-type, performing heat treatment to the polysilicon layer and highly doped epitaxial layer to form emitter and base region, depositing a metal and then heat treating it to form salicide layer, and selectively removing the salicide layer. The method simplifies formation of electrode and improves the transistor performance.
Abstract translation: 制造双极晶体管的方法包括以下步骤:在有源区上形成N型多晶硅和氮化物图案,在图案的侧面上形成侧壁,在侧壁和场氧化物之间选择性地生长外延层,高度掺杂外延层 具有P型的层,对多晶硅层和高度掺杂的外延层进行热处理以形成发射极和基极区,沉积金属,然后热处理以形成自对准硅化物层,并选择性地除去自对准硅化物层。 该方法简化了电极的形成,提高了晶体管的性能。
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公开(公告)号:KR1019940008216B1
公开(公告)日:1994-09-08
申请号:KR1019910009857
申请日:1991-06-14
Applicant: 삼성전자주식회사
IPC: H01L29/72
Abstract: The method improves reliability of a bipolar transistor by extending the distance between the emitter and the extrinsic base. The method comprises (A) growing n- epitaxial layer (2) on the Si substrate and forming a buried layer and an isolated layer; (B) depositing a polysilicon layer (3) on the epitaxial layer (2) and implanting boron ion; (C) removing the isolated layer by using photolithography and oxidizing the exposed n- epitaxial layer; (D) forming side wall (14) after depositing oxide and nitride layers; (E) heating bases (5,6); (F) masking the nitride side wall and etching the oxide layer; (G) heating the polysilicon layer and forming electrodes by photolithography.
Abstract translation: 该方法通过扩展发射极和外部基极之间的距离来提高双极晶体管的可靠性。 该方法包括:(A)在Si衬底上生长n-外延层(2)并形成掩埋层和隔离层; (B)在外延层(2)上沉积多晶硅层(3)并注入硼离子; (C)通过使用光刻法去除所述隔离层并氧化所述暴露的n-外延层; (D)在沉积氧化物和氮化物层之后形成侧壁(14); (E)加热基(5,6); (F)掩蔽氮化物侧壁并蚀刻氧化物层; (G)加热多晶硅层并通过光刻形成电极。
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公开(公告)号:KR1019940007466B1
公开(公告)日:1994-08-18
申请号:KR1019910020269
申请日:1991-11-14
Applicant: 삼성전자주식회사
IPC: H01L27/06
CPC classification number: H01L21/8249 , Y10S148/009
Abstract: The method manufactures a BiCMOS device having a bipolar transistor of which emitter and base are self aligned. The intrinsic base of a vertical type PNP transistor is formed by using an n+ polysilicon layer as a mask and the extrinsic base of a vertical type PNP transistor is formed by using the n+ polysilicon as a diffusion source. The self-aligned emitter of a vertical type PNP transistor is formed by using a side wall oxide layer for creating a lightly doped drain of a CMOS transistor.
Abstract translation: 该方法制造BiCMOS器件,其具有发射极和基极自对准的双极晶体管。 通过使用n +多晶硅层作为掩模来形成垂直型PNP晶体管的本征基极,并且通过使用n +多晶硅作为扩散源形成垂直型PNP晶体管的非本征基极。 通过使用用于产生CMOS晶体管的轻掺杂漏极的侧壁氧化物层来形成垂直型PNP晶体管的自对准发射极。
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公开(公告)号:KR1019940005731B1
公开(公告)日:1994-06-23
申请号:KR1019910011373
申请日:1991-07-05
Applicant: 삼성전자주식회사
IPC: H01L29/73
Abstract: The method adjusts a diffusion velocity of impurity by time delay with a width of CVD oxidation layer, increases a current driving force of device, and maintains a performance of bipolar device by preventing a formation of trap in an oxidation layer. The method includes a process which forms a base area by heating, a process which reduces a specified area of a 1st nitrogen layer (15) and a 2nd oxidation layer (14), a process which forms a spacer (17) of a nitrogen layer, a process which etches a 1st oxidation layer, and a process which diffuses an emitter area (19) by heating procedure.
Abstract translation: 该方法通过具有CVD氧化层的宽度的时间延迟来调整杂质的扩散速度,增加器件的电流驱动力,并且通过防止在氧化层中形成陷阱来保持双极器件的性能。 该方法包括通过加热形成基底区域的方法,减少第一氮层(15)和第二氧化层(14)的指定面积的过程,形成氮层的间隔物(17)的工艺 蚀刻第一氧化层的工艺,以及通过加热步骤扩散发射极区域(19)的工艺。
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公开(公告)号:KR1019930000294B1
公开(公告)日:1993-01-15
申请号:KR1019890005930
申请日:1989-05-02
Applicant: 삼성전자주식회사
Abstract: The method for integrating a bipolar NPN transistor and a lateral PNP transistor comprises forming a buried layer (2) on a substrate (1), forming an epitaxial layer (3) on the buried layer, forming a base region at one side of the epitaxial layer (3), dry-etching the other side of the layer (2) to form a inclined epitaxial surface (2) to form openings into the layer (2), implanting high concentration of impurity ions into the openings to form a diffusion layer (7), forming a polysilicon layer (10) having a low concentration of impurity thereon, to fill the openings with the polysilicon and diffusing the impurity of the polysilicon layer (10) into the epitaxial layer to form a low concentration of diffusion layer in self-alignment, thereby improving the current gain.
Abstract translation: 用于积分双极NPN晶体管和横向PNP晶体管的方法包括在衬底(1)上形成掩埋层(2),在掩埋层上形成外延层(3),在外延层的一侧形成基极区域 层(3),干蚀刻层(2)的另一侧以形成倾斜的外延表面(2)以在层(2)中形成开口,将高浓度的杂质离子注入到开口中以形成扩散层 (7),在其上形成具有低浓度杂质的多晶硅层(10),以用多晶硅填充开口,并将多晶硅层(10)的杂质扩散到外延层中以形成低浓度的扩散层 自对准,从而提高电流增益。
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