公开(公告)号：KR1020120070290A

公开(公告)日：2012-06-29

申请号：KR1020100131789

申请日：2010-12-21

Applicant: 삼성전자주식회사

Inventor： 박태상 ,  문영준 ,  홍순민 ,  신효영 ,  장경운

IPC: H05K3/46 ,  H05K1/18

Abstract: PURPOSE: A printed circuit board assembly is provided to stably combine a first circuit board with a second circuit board by forming protrusions in all junctions of a second circuit board and an upper layer of a first circuit board. CONSTITUTION: A second circuit board(32) is laminated on a first circuit board(31). An interposer(33) is located between the first circuit board and the second circuit board. The interposer includes a through via(330) inside. A first junction unit(351a) connects the first circuit board to the interposer. A second junction unit(351b) connects the second circuit board to the interposer.

Abstract translation: 目的：提供一种印刷电路板组件，用于通过在第二电路板和第一电路板的上层的所有接合处形成突起来稳定地组合第一电路板与第二电路板。 构成：在第一电路板（31）上层压第二电路板（32）。 插入件（33）位于第一电路板和第二电路板之间。 插入器包括内部的通孔（330）。 第一接合单元（351a）将第一电路板连接到插入器。 第二接合单元（351b）将第二电路板连接到插入器。

公开(公告)号：KR1020090055673A

公开(公告)日：2009-06-03

申请号：KR1020070122418

申请日：2007-11-29

Applicant: 삼성전자주식회사

Inventor： 신효영 ,  정승부 ,  문영준 ,  홍순민 ,  이창용 ,  구자명 ,  김현태 ,  이종범 ,  한현주

IPC: H05K1/02

CPC classification number: H05K3/361 ,  H05K3/328 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/09881 ,  H05K2201/0989 ,  H05K2203/0285 ,  H05K2203/167 ,  Y10T29/49126

Abstract: A printed circuit board assembly and a manufacturing method for the same are provided to prevent the increase of resistance by maximizing a junction area of a first electrode terminal and a second electrode terminal. A printed circuit board assembly comprises a first printed circuit board(10), a second printed circuit board(20), and a separation preventing member(12). A plurality of first electrode terminals(11) are formed on the first printed circuit board, and a plurality of second electrode terminals(21) are formed on the second printed circuit board. A separation preventing member prevents the separation of the first and a second electrode terminal from a right position in ultrasonic welding.

Abstract translation: 提供一种印刷电路板组件及其制造方法，以通过最大化第一电极端子和第二电极端子的接合面积来防止电阻的增加。 印刷电路板组件包括第一印刷电路板（10），第二印刷电路板（20）和防分离部件（12）。 多个第一电极端子（11）形成在第一印刷电路板上，并且多个第二电极端子（21）形成在第二印刷电路板上。 分离防止部件防止第一和第二电极端子从超声波焊接中的正确位置分离。