-
公开(公告)号：KR1020090006303A
公开(公告)日：2009-01-15
申请号：KR1020070069501
申请日：2007-07-11
Applicant: 삼성전자주식회사
IPC: G03G15/00
CPC classification number: B41J13/0027 , G03G2215/00409
Abstract: A kicking unit and an image forming apparatus including the same are provided to simplify a driving structure of a kicker by using a kicker driving member. An image forming unit(10) is moved in an intersection direction intersecting a transfer direction of a print medium. The image forming unit forms an image on the print medium. A key(40) transfers the print medium by associating with the movement of the image forming unit. A kicker comprises a kicker main body(42) and a kicker arm(41). The kicker arm is extended in a radial direction from the kicker main body. The kicker arm kicks the print medium passed through the image forming unit and transfers the print medium in the transfer direction.
Abstract translation: 提供一种踢脚单元和包括该踢脚单元的图像形成装置，以通过使用踢球者驱动构件来简化踢球者的驾驶结构。 图像形成单元（10）在与打印介质的传送方向相交的交叉方向上移动。 图像形成单元在打印介质上形成图像。 键（40）通过与图像形成单元的移动相关联来传送打印介质。 踢球者包括踢球者主体（42）和踢球臂（41）。 推杆臂从踢球主体沿径向方向延伸。 踢球臂踢通过图像形成单元的打印介质，并在传送方向上传送打印介质。
-
公开(公告)号：KR1020080005740A
公开(公告)日：2008-01-15
申请号：KR1020060064471
申请日：2006-07-10
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15331 , H01L2924/00012
Abstract: A semiconductor package including a PCB(Printed Circuit Board) having a flexible region and a semiconductor module having the package are provided to absorb variation occurring due to a difference in thermal expansion coefficient between the PCB and a semiconductor chip. A semiconductor package includes a first printed circuit board(101), a first semiconductor chip(151), and a plurality of solder balls. The first printed circuit board is provided with a flexible region(F) and rigid regions(R1,R2). The first semiconductor chip is provided on one surface of the first printed circuit board. The first semiconductor chip is installed in a center portion of the first printed circuit board. The solder balls are formed on both outside portions of the first printed circuit board. The both outside portions are the rigid regions. The flexible region is positioned adjacent to the both outside portions. The center portion is the rigid region. The flexible region is provided between the center portion and the both outside portions.
Abstract translation: 提供了包括具有柔性区域的PCB（印刷电路板）和具有封装的半导体模块的半导体封装，以吸收由于PCB和半导体芯片之间的热膨胀系数的差异而发生的变化。 半导体封装包括第一印刷电路板（101），第一半导体芯片（151）和多个焊球。 第一印刷电路板设置有柔性区域（F）和刚性区域（R1，R2）。 第一半导体芯片设置在第一印刷电路板的一个表面上。 第一半导体芯片安装在第一印刷电路板的中心部分。 焊球形成在第一印刷电路板的两个外侧部分上。 两个外部部分是刚性区域。 柔性区域邻近两个外侧部分定位。 中心部分是刚性区域。 柔性区域设置在中心部分和两个外部部分之间。
-
公开(公告)号：KR1020070077413A
公开(公告)日：2007-07-26
申请号：KR1020060007023
申请日：2006-01-23
Applicant: 삼성전자주식회사
IPC: H05K5/02
CPC classification number: H05K5/0239
Abstract: An office apparatus is provided to suppress insertion of contaminant in a combination groove and a combination hole and to prevent loss of an opening/shutting member to be inserted into the combination groove and the combination hole. A combination groove(122) is formed at a lower surface of a case(100). A combination member is combined with the combination groove. A guide groove(125) of a long hole type is formed around the combination groove. An opening/shutting member(130) is inserted into the combination groove in order to close the combination groove. The opening/shutting member is moved along the guide groove when the opening/shutting member is separated from the combination groove.
Abstract translation: 提供了一种办公装置，以抑制杂质在组合槽和组合孔中的插入，并且防止插入组合槽和组合孔中的打开/关闭构件的损失。 组合槽（122）形成在壳体（100）的下表面。 组合构件与组合凹槽组合。 在组合槽周围形成有长孔型的引导槽（125）。 打开/关闭构件（130）被插入到组合凹槽中以关闭组合凹槽。 当打开/关闭构件与组合槽分离时，打开/关闭构件沿着引导槽移动。
-
-
公开(公告)号：KR1020170092866A
公开(公告)日：2017-08-14
申请号：KR1020160014081
申请日：2016-02-04
Applicant: 삼성전자주식회사
IPC: H01L23/552 , H01L23/04 , H01L23/42 , H01L23/495 , H01L23/60
CPC classification number: H01L23/552 , H01L23/3121 , H01L24/08 , H01L24/16 , H01L25/0655 , H01L2224/16227 , H01L2924/15311 , H01L2924/18161 , H01L2924/3025
Abstract: 본발명에서는반도체패키지및 반도체장치가개시된다. 본발명의일 실시예에따른반도체패키지는반도체칩; 상기반도체칩이실장되는패키지기판; 및상기반도체칩의상면및 측면을둘러싸는형태로형성되는전자파차단부재를포함하고, 상기전자파차단부재는상기전자파차단부재의측면의하단부를구부려변형된걸림부를가지며, 상기걸림부는상기전자파차단부재가고정되도록상기반도체칩 및상기패키지기판사이의이격된공간에위치하는것을특징으로한다.
Abstract translation: 本发明公开了一种半导体封装和半导体器件。 根据本发明实施例的半导体封装包括：半导体芯片; 半导体芯片被复原的封装基板; 和电磁波屏蔽构件，包括电磁波屏蔽形成在包围所述半导体管芯的上表面和侧表面的形状构件已部分接合所述电磁屏蔽的bujaeui表面的下端的弯曲变形，其中所述保持部分的电磁波屏蔽构件 半导体芯片和封装衬底彼此间隔开。
-
Patent Agency Ranking
公开(公告)号：KR1020160148303A
公开(公告)日：2016-12-26
申请号：KR1020150085146
申请日：2015-06-16
Applicant: 삼성전자주식회사
IPC: H01L23/48 , H01L23/482
CPC classification number: H01L23/49838 , H01L23/13 , H01L23/49811 , H01L23/49827 , H01L2224/16 , H01L2924/181 , H01L2924/00012
Abstract: 본발명의기술적사상의일 실시예에의한패키지기판은바디층; 및상기바디층의일면상에형성되는패턴층;을포함하고, 상기패턴층은, 배선패턴, 및상기배선패턴의일단에연결되는솔더패드를포함하며, 상기배선패턴과상기솔더패드의경계선에인접하여상기패턴층을수직으로관통하는관통홀을가지는것을특징으로한다.
Abstract translation: 封装基板包括：主体层; 以及形成在所述主体层的表面上的图案层。 图案层包括：线图案; 连接到导线图案的焊盘; 以及与导线图案和焊盘之间的边界相邻并且垂直穿透图案层的通孔。 公开了半导体封装和电子器件。
-
公开(公告)号：KR101673520B1
公开(公告)日：2016-11-08
申请号：KR1020100019566
申请日：2010-03-04
Applicant: 삼성전자주식회사
CPC classification number: H05K7/00
Abstract: 반도체모듈은, 다수의절연층들과다수의금속층들이교대로적층된구조를가진인쇄회로기판과, 인쇄회로기판에탑재된반도체소자를구비한다. 상기인쇄회로기판은, 상기인쇄회로기판의양 표면에배치된외측절연층들과, 상기외측절연층들각각의내측에배치된그라운드금속층들과, 상기그라운드금속층들사이에교대로배치된신호선용금속층들과내측절연층들을포함하고, 상기인쇄회로기판의양 표면의길이방향양단부에서상기외측절연층들이소정폭만큼제거되어, 상기그라운드금속층들이상기폭만큼외부로노출된다.반도체모듈용소켓은, 베이스부재와래치부재를포함한다. 베이스부재는, 인쇄회로기판의하단부가삽입되는슬롯이형성된내측몸체와, 그길이방향양단부에마련된결합부를포함하는외측몸체와, 결합부에형성되며인쇄회로기판의길이방향양단부의아랫부분이삽입되는하부홈을포함한다. 래치부재는, 결합부에피봇결합되는래치몸체와, 래치몸체에형성되며인쇄회로기판의길이방향양단부의윗 부분이삽입되는상부홈을포함한다.
Abstract translation: 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。
-
公开(公告)号：KR101301498B1
公开(公告)日：2013-08-29
申请号：KR1020080027810
申请日：2008-03-26
Applicant: 삼성전자주식회사
IPC: G03G15/00
CPC classification number: H04N1/0057 , H04N1/00591 , H04N1/00631 , H04N2201/0081
Abstract: 소형화에 유리한 구조를 가지면서도 원고를 신뢰성있게 배출할 수 있는 화상독취장치와 복합기를 개시한다. 본 발명의 화상독취장치는 원고유입구와 원고배출구를 가지는 원고이송경로와, 원고이송경로에서 이송되는 원고의 화상을 독취하는 독취유닛과, 독취유닛의 하류측에 배치되어 독취된 원고의 후단부의 일부분에 컬을 발생시키는 가이드부재를 구비한다. 가이드부재는 그 일단부가 상기 원고이송경로상으로 돌출되는 적어도 하나의 가이드리브로 구성될 수 있다.
-
-
公开(公告)号：KR1020090102391A
公开(公告)日：2009-09-30
申请号：KR1020080027810
申请日：2008-03-26
Applicant: 삼성전자주식회사
IPC: G03G15/00
CPC classification number: H04N1/0057 , H04N1/00591 , H04N1/00631 , H04N2201/0081
Abstract: PURPOSE: An image reading device, multi function machine and a document discharging method including a guide member are provided to minimize the multi functional machine size by reliably discharging the document. CONSTITUTION: An image reading device includes a document transfer path, a reading unit(110) and a guide member(130). The manuscript transfer path has the manuscript inlet port and manuscript vent. The read unit reads the image of the manuscript transferred from the manuscript transfer path. The guide member is arranged to the downstream side of the read unit. The guide member generates a curl in a portion of the back-end of the read manuscript.
Abstract translation: 目的：提供一种包括引导部件的图像读取装置，多功能机器和文件排出方法，以通过可靠地排出文件来最小化多功能机器尺寸。 构成：图像读取装置包括文件传送路径，读取单元（110）和引导构件（130）。 手稿传送路径有原稿入口和手稿通风口。 读取单元读取从手稿传送路径传送的原稿的图像。 引导构件设置在读取单元的下游侧。 引导构件在读取原稿的后端的一部分中产生卷曲。
-
-
-
-
-
-
-
-
-
Search Results
51
records
(took 0.026 seconds)
