Abstract:
PURPOSE: A micro-optical component which is built in a substrate and a method for manufacturing thereof, and a micro-optical component array and a method for manufacturing thereof are provided to reduce a time and a trouble required for a post-processing through an etching process of a main substrate and a glass heat reflow process. CONSTITUTION: A micro-optical component which is built in a substrate and a method for manufacturing thereof, and a micro-optical component array and a method for manufacturing thereof comprise the following steps: a micro-optical component etches built-in main substrates (10, 20, 30, 50) according to an etch mask pattern, and forms more than one cavity (11, 21, 31, 51); glass substrates (12, 22, 32, 35, 52) are welded to an upper part of the main substrate in which the cavity is formed; a primary glass heat reflow process is performed so that a glass of the glass substrate fills up more than one cavity; an upper part and a lower part of the main substrate in which the glass is filled are etched, and more than one micro-optical component which is built in the main substrate is manufactured; and when the micro-optical component is micro glass lenses (14, 34), the more than one cavity forming step aims to etch the main substrate perpendicularity in order to form a cavity of a concave pillar type. [Reference numerals] (a) Vertically edge a main substrate; (b) Make the heat of glass flow again; (c) Manufacture a glass pole; (d) Manufacture a glass lens
Abstract:
PURPOSE: A method for manufacturing a vertically penetrated metal electrode including an insulating glass part is provided to plate or deposit metal on the circumference of a low resistive silicon pillar, thereby lowering the resistance of a penetration resistor under an existing via resistance. CONSTITUTION: A protection pattern for forming a low resistance silicon pillar is formed on one side of a low resistance silicon wafer(S100). The low resistance silicon wafer is etched to form a low resistance silicon pillar(S200). Metal is plated or deposited on the low resistance silicon wafer(S300). The low resistance silicon wafer is bonded with a glass wafer(S400). The bonded glass wafer is dissolved(S500). The bonded low resistance silicon wafer and both sides of the glass wafer are processed(S600).
Abstract:
PURPOSE: An acceleration varying inertia switch using a micro electro mechanical system is provided to prevent the abuse of resources by varying the acceleration of the inertia switch by varying an elastic member constant value. CONSTITUTION: A first driver(100) is secured to the bottom of a stator. A second driver(200) is separated from the bottom of the first driver by a predetermined length. A contact unit(300) is switched with a gap of the transmission line through vertical feeding and horizontal feeding. An elastic member(400) supports the driver.