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Patent Agency Ranking
公开(公告)号：KR1020050121213A
公开(公告)日：2005-12-26
申请号：KR1020057017871
申请日：2004-04-12
Applicant: 스미토모덴키고교가부시키가이샤
CPC classification number: C22F1/10 , G01R1/06733 , G01R1/0675 , G01R1/06755 , B24B1/00 , C22C19/00
Abstract: A metal structure being reduced in brittleness and excellent in hardness and creep resistance, characterized in that it has been subjected to annealing at a temperature below the temperature at which crystals of the metal material begin to enlarge; a method for producing a metal structure which is less susceptible to embrittlement and is excellent in hardness and creep resistance, characterized in that it comprises a step of annealing the structure at a temperature below the temperature at which crystals of the metal material begin to enlarge. The metal structure may comprise two or more metal materials which have been subjected to annealing at a temperature below the temperature at which crystals of the metal material begin to enlarge. The metal structure can be particularly advantageously used for a fine structure such as a contact probe.
Abstract translation: 金属结构脆性降低，硬度和抗蠕变性优异，其特征在于，在低于金属材料晶体开始放大的温度的温度下进行退火， 一种不易脆化并且硬度和抗蠕变性优异的金属结构体的制造方法，其特征在于，包括在低于金属材料的晶体开始放大的温度的温度下退火该结构的工序。 金属结构可以包括两种或更多种在低于金属材料的晶体开始放大的温度的温度下进行退火的金属材料。 金属结构可以特别有利地用于诸如接触探针的精细结构。
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公开(公告)号：KR1020050039689A
公开(公告)日：2005-04-29
申请号：KR1020047005423
申请日：2002-10-25
Applicant: 스미토모덴키고교가부시키가이샤
IPC: B81C1/00
CPC classification number: B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
Abstract: A method for manufacturing a metal microstructure (1) comprising a resin mold (13). For setting a mild manufacturing condition with little damage of the resin mold (13), and for mass-producing a high- precision metal microstructure (1) by uniform casting, this method is characterized by having the step of forming a resin mold laminate by fixing on a conductive substrate (11) a resin mold (13) having a vacancy penetrating in the thickness direction via a photosensitive polymer (12) the chemical composition of which is varied by an electron ray, ultraviolet ray, or a visible ray, the step of exposing the resin type laminate (2) to the electron ray, ultraviolet ray, or visible ray, the step of removing a photosensitized polymer (12c) present in the vacancy of the resin mold (13), and the step of filling the vacant section of the resin type laminate (2) with a metal (14) by casting.
Abstract translation: 一种用于制造包括树脂模具（13）的金属微结构（1）的方法。 为了设定温和的制造条件，树脂模具（13）几乎没有损坏，并且通过均匀铸造大量生产高精度金属微结构（1），该方法的特征在于具有以下步骤：通过 在导电基板（11）上固定具有通过电子射线，紫外线或可见光线变化的光敏聚合物（12）在空间贯穿厚度方向的树脂模具（13）， 将树脂型层压体（2）暴露于电子射线，紫外线或可见光的步骤，除去存在于树脂模具（13）的空位的光敏聚合物（12c）的步骤，以及填充 通过铸造，用金属（14）将树脂型层叠体（2）的空隙部分。
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公开(公告)号：KR100576900B1
公开(公告)日：2006-05-03
申请号：KR1020057020068
申请日：2002-01-22
Applicant: 스미토모덴키고교가부시키가이샤
CPC classification number: G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
Abstract: 본 발명은, 피검사회로와 접촉하는 접촉 끝을 한끝으로 가지고, 전체가 대략 기둥 모양을 이루는 선단부(11)과 상기 선단부(11)의 접촉 끝과는 반대 쪽의 다른 끝에 대향하고, 또한 틈새를 유지해서 형성된 기초부(12)로 구성 되고, 상기 선단부(11)의 피검사회로(20)에의 압접(押接)에 의해, 상기 선단부(11)과 상기 기초부 (12)가 접촉하고, 또한, 접촉면(14, 15)의 어긋남에 의해서 상기 선단부(11)이 피검 사회 로(20)의 표면과 평행한 방향으로 이동하는 것을 특징으로 하는 콘택트프로브를 제공하는 것이다.
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公开(公告)号：KR100545073B1
公开(公告)日：2006-01-24
申请号：KR1020037009947
申请日：2002-01-22
Applicant: 스미토모덴키고교가부시키가이샤
IPC: H01L21/66
CPC classification number: G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
Abstract: 콘택트프로브의 제조방법은, 기판(521)위에 배치한, 콘택트프로브에 대응하는 형상을 가지는 패턴 테두리로서의 레지스트막(522)을 사용해서, 레지스트 막(522)의 틈을 메우도록 전기도금을 행하여 금속층(526)을 형성하는 전기도금 공정과, 금속층(526)중의, 콘택트프로브의 선단부가 되는 개소를 비스듬하게 제거해서 뾰족하게 하는 선단 가공 공정과, 패턴 테두리로부터 금속층(526)만을 꺼내는 꺼내기 공정을 포함한다.
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公开(公告)号：KR1020050107636A
公开(公告)日：2005-11-14
申请号：KR1020057020068
申请日：2002-01-22
Applicant: 스미토모덴키고교가부시키가이샤
CPC classification number: G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
Abstract: A method of manufacturing a contact probe, comprising an electroforming process for forming a metal layer (526) by performing an electroforming so as to fill clearances in a resist film (522) by using the resist film (522)as a pattern frame having a shape matching the contact probe disposed on a substrate (521), a tip working process for sharpening the area of the metal layer (526) forming the tip end part of the contact probe by diagonally cutting out the area, and a retrieval process for retrieving only the metal layer (526) from the pattern frame.
Abstract translation: 一种制造接触探针的方法，包括通过进行电铸以形成抗蚀剂膜（522）中的间隙来形成金属层（526）的电铸工艺，所述抗蚀剂膜通过使用抗蚀剂膜（522）作为具有 形状匹配布置在基底（521）上的接触探针，尖端加工工艺，用于通过对角切割该区域来锐化形成接触探针的顶端部分的金属层（526）的面积，以及检索过程 仅来自图案框架的金属层（526）。
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