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公开(公告)号：KR101150406B1
公开(公告)日：2012-06-01
申请号：KR1020090104122
申请日：2009-10-30
Applicant: 전자부품연구원
Abstract: 본발명은산화물전극소재및 이를구비한적층세라믹전자부품에관한것으로, 적층세라믹전자부품의내부전극을구성하는데사용되는기존의귀금속메탈(Ag, Au, Pt, Pd) 또는고온에서용융이안 되는고융점메탈(W, Mo, Ni, Cu) 소재를대체하여, 저렴하면서고온(800℃~1600℃정도)의열처리(소결)온도에서전기전도성이유지되며, 소결후 완성제품에서도내부전극의역할을유지할수 있는산화물전극소재를제공하고, 이산화물전극소재를채용한적층세라믹전자부품을제공한다.
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公开(公告)号：KR1020120025277A
公开(公告)日：2012-03-15
申请号：KR1020100087572
申请日：2010-09-07
Applicant: 전자부품연구원
IPC: C09J163/00 , C09J7/02 , C09J11/00 , H01L21/58
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/00 , C09J2201/61 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A composite material composition and a substrate using thereof are provided to improve thermal resistance and lower dielectric property by including high thermal resistant epoxy resin and hardener. CONSTITUTION: A composite material composition comprises 14-34 weight% of inorganic filler including hollow glass microsphere which concurrently controls low dielectric property and high thermal resistance property, 31-51 weight% of epoxy based adhesive which controls adhesive force and high thermal resistance property of the tape, 23-43 weight% of acid anhydride based hardener which controls the high thermal resistance property through curing reaction with the adhesive of acid anhydride, and 0.1-0.3 weight% of curing accelerator which controls the thermal characteristic and curing reaction of the tape.
Abstract translation: 目的：提供一种复合材料组合物及其使用的基材，以通过包括高耐热性环氧树脂和硬化剂来改善耐热性和降低介电性能。 构成：复合材料组合物包含14-34重量％的无机填料，其包括同时控制低介电性和高耐热性的中空玻璃微球，31-51重量％的环氧基粘合剂，其控制粘合力和高耐热性 胶带，23-43重量％的酸酐类硬化剂，其通过与酸酐的粘合剂进行固化反应来控制高耐热性，和0.1-0.3重量％的固化促进剂，其控制带的热特性和固化反应 。
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公开(公告)号：KR1020110125071A
公开(公告)日：2011-11-18
申请号：KR1020100044610
申请日：2010-05-12
Applicant: 전자부품연구원
IPC: C09J163/00 , C08L63/00 , C08K3/24 , C08J5/18
Abstract: PURPOSE: A composition for a bonding film and a substrate using the bonding film are provided to ensure excellent adhesive force and high thermal resistance by comprising epoxy- and phenoxy-based adhesives, acid anhydride-based hardeners. CONSTITUTION: A composition for a bonding film for forming micro circuit patterns comprises: an epoxy-based adhesive for controlling the adhesive force and high thermal resistance of the bonding film; a phenoxy-based adhesive capable of embodying adhesive force, high thermal resistance, and micro circuit patterns by forming roughness on the surface of the bonding film; an anhydride-based hardener for controlling high thermal resistance through a curing reaction with the first adhesive; and other additives controlling thermal properties and the curing reaction of the bonding film.
Abstract translation: 目的：提供一种用于接合膜的组合物和使用该接合膜的基底，以通过包含环氧基和苯氧基基粘合剂，酸酐类固化剂来确保优异的粘合力和高耐热性。 构成：用于形成微电路图形的接合膜的组合物包括：用于控制接合膜的粘合力和高热阻的环氧基粘合剂; 通过在接合膜的表面上形成粗糙度的能够体现粘合力，高热阻和微电路图案的苯氧基类粘合剂; 用于通过与第一粘合剂的固化反应来控制高热阻的基于酸酐的硬化剂; 以及控制粘合膜的热性能和固化反应的其他添加剂。
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公开(公告)号：KR1020100127936A
公开(公告)日：2010-12-07
申请号：KR1020090046291
申请日：2009-05-27
Applicant: 전자부품연구원
Abstract: PURPOSE: A via paste composition is provided to offer a thermosetting paste for forming a heat conductive via with the excellent thermal conductivity. CONSTITUTION: A via paste composition is formed with a thermo-conductive material and a thermosetting resin. The thermo-conductive material contains silver powder with the average particle diameter of 100~300 nanometers, and silver-coated copper powder with the average particle diameter of 3~10 microns. The thermosetting resin contains an epoxy resin including either phenol novolak based epoxy or cresol novolak based epoxy.
Abstract translation: 目的：提供通孔糊组合物以提供用于形成具有优异导热性的导热通孔的热固性糊剂。 构成：用导热材料和热固性树脂形成通孔糊组合物。 导热材料含有平均粒径为100〜300纳米的银粉，平均粒径为3〜10微米的镀银铜粉。 热固性树脂含有包括苯酚酚醛清漆型环氧树脂或甲酚酚醛清漆型环氧树脂的环氧树脂。
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公开(公告)号：KR1020100126991A
公开(公告)日：2010-12-03
申请号：KR1020090045457
申请日：2009-05-25
Applicant: 전자부품연구원
IPC: H05K1/18
Abstract: PURPOSE: A flexible PCB embedding active elements and passive elements and a manufacturing method thereof are provided to perform a flexible packaging process in even state by using a metal support layer. CONSTITUTION: A first circuit pattern(115) is formed on a support layer. The support layer is arranged of one of aluminum, gold, and silver. An active circuit element(120) and/or a passive device, and a semiconductor chip(130) are mounted in the first circuit pattern. The flexible layer is formed on the support layer in order to surround the first circuit pattern, the active circuit element and/or the passive device, and semiconductor chip. A second circuit pattern(150) is formed on the flexible layer. A heat plate(111) is formed by selectively eliminating a part of the support layer.
Abstract translation: 目的：提供一种嵌入有源元件和无源元件的柔性PCB及其制造方法，以通过使用金属支撑层来均匀地执行柔性封装处理。 构成：第一电路图案（115）形成在支撑层上。 支撑层布置为铝，金和银之一。 在第一电路图案中安装有源电路元件（120）和/或无源器件以及半导体芯片（130）。 为了包围第一电路图案，有源电路元件和/或无源器件以及半导体芯片，在支撑层上形成柔性层。 第二电路图案（150）形成在柔性层上。 通过选择性地去除支撑层的一部分来形成加热板（111）。
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Patent Agency Ranking
公开(公告)号：KR100979111B1
公开(公告)日：2010-08-31
申请号：KR1020080058427
申请日：2008-06-20
Applicant: 전자부품연구원
Abstract: 본 발명은 액상의 변성 에폭시 수지를 사용함으로써 경화 후에도 유연한 특성을 가지게 되며, 카본 종류와 나노 은을 병행 사용하여 페이스트를 제조함으로써 후막 특성을 유지함과 동시에 면저항을 효과적으로 낮출 수 있는, 플렉서블 기판에 형성 또는 내장할 수 있는 저저항 열경화형 후막 저항체용 페이스트를 제공한다.
후막 저항체 페이스트, 저저항-
公开(公告)号：KR1020090132251A
公开(公告)日：2009-12-30
申请号：KR1020080058427
申请日：2008-06-20
Applicant: 전자부품연구원
Abstract: PURPOSE: Paste for low resistance thermosetting type thick film resistor is provided to keep thick film property by making the paste with a kind of carbon and nano-silver, which are used as conductive filter, at the same time. CONSTITUTION: A thermosetting resin is a liquid state in room temperature. Hardener cures the thermosetting resin. The thermosetting resin is a urethane-modified epoxy resin. Carbon black, graphite, or nano-silver is used as conductive filler.
Abstract translation: 目的：提供低电阻热固型厚膜电阻器的粘贴，以同时使用用作导电过滤器的碳和纳米银制成糊状物来保持厚膜性能。 构成：热固性树脂在室温下为液态。 固化剂固化了热固性树脂。 热固性树脂是氨基甲酸酯改性的环氧树脂。 炭黑，石墨或纳米银用作导电填料。
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公开(公告)号：KR1020090012682A
公开(公告)日：2009-02-04
申请号：KR1020070076705
申请日：2007-07-31
Applicant: 전자부품연구원
IPC: H01L21/027
CPC classification number: H01L21/0274 , G03F7/2022
Abstract: A formation method of the polymer thick layer resistor is provided to reduce the deviation of the resistance value and simplify the manufacturing process. A formation method of the polymer thick layer resistor comprises a step for forming conductivity cattails(111,112); a step for coating the paste(120) for the photosensitivity resistance; a step for forming a resistor pattern; and a step for forming the protective layer. The conductivity cattail is formed on a supporting part(100). The supporting part is a substrate or the electric component. The resistor pattern is formed by exposing and developing the paste for the photosensitivity resistance.
Abstract translation: 提供聚合物厚层电阻器的形成方法以减少电阻值的偏差并简化制造过程。 聚合物厚层电阻器的形成方法包括形成电导率电极的步骤（111,112）; 用于涂覆所述糊剂（120）以获得耐光敏性的步骤; 形成电阻图案的步骤; 以及形成保护层的步骤。 在支撑部分（100）上形成导电性的尾巴。 支撑部件是基板或电气部件。 电阻图案通过曝光和显影用于耐光敏性的浆料而形成。
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公开(公告)号：KR100832803B1
公开(公告)日：2008-05-27
申请号：KR1020060076775
申请日：2006-08-14
Applicant: 전자부품연구원
Abstract: 본 발명은 프린트 배선용 기판에 사용되는 저유전율 저손실의 열경화성 복합 수지 조성물에 관한 것으로, 특히 폴리페닐렌옥사이드(PPO)와 폴리스티렌(PS)이 6:4 내지 8:2 의 중량비율로 혼합된 모수지; 상기 모수지에 대하여 1:9 내지 3:7의 중량비율에 해당하는 양의 가교제; 상기 모수지에 대하여 1:10 내지 1:5의 중량비율에 해당하는 양의 첨가제; 및 상기 가교제에 대하여 1:20 내지 1:5의 중량비율에 해당하는 양의 개시제가 포함된 저유전율 저손실의 열경화성 복합 수지 조성물인 것을 특징으로 한다. 이러한 본 발명은 고주파 영역에서 우수한 전기적 특성을 가지는 폴리페닐렌옥사이드 수지를 포함하여 프린트 배선용 기판, 프리프레그, 시트, 필름, 테이프, 적층판 또는 회로용 적층재 등을 제조하는데 이용됨으로써, 상기 프린트 배선용 기판 등이 종래의 복합 수지 조성물에 의하는 것보다 작은 유전율 및 유전손실을 가지게 할 수 있는 효과가 있다.
프린트 배선용 기판, 프리프레그, 폴리페닐렌옥사이드-
公开(公告)号：KR100795571B1
公开(公告)日：2008-01-21
申请号：KR1020060094096
申请日：2006-09-27
Applicant: 전자부품연구원
IPC: H01C17/065 , H01C17/075
Abstract: A paste for a thick-film resistor, a manufacturing method thereof, and a thick-film resistor are provided to maintain a high electric conductivity and reduce a TcR(Temperature coefficient of Resistance) value of the resistor remarkably at the same time. A method for manufacturing a paste for a thick-film resistor includes the steps of: preparing an organic resin by distributing an organic composition and an inorganic based cross-linking agent in an organic solvent(S210); administrating an alloy powder to the prepared organic resin and first-mixing them(S220); administrating a carbon black to the first-mixed organic resin and second-mixing them(S230); and performing 3-roll milling after removing bubble and filtering to the second-mixed organic resin(S240).
Abstract translation: 提供一种用于厚膜电阻器的糊剂，其制造方法和厚膜电阻器以保持高导电性并同时显着降低电阻器的TcR（电阻值）。 一种制造用于厚膜电阻器的糊剂的方法包括以下步骤：通过在有机溶剂中分配有机组合物和无机基交联剂来制备有机树脂（S210）; 向合成的有机树脂中施加合金粉末并首先混合（S220）; 向第一混合有机树脂施用炭黑并进行二次混合（S230）; 在除去气泡并过滤到第二混合有机树脂之后进行3辊研磨（S240）。
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