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公开(公告)号：KR1020100024183A
公开(公告)日：2010-03-05
申请号：KR1020080082926
申请日：2008-08-25
Applicant: 전자부품연구원
IPC: H01L33/64
CPC classification number: H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting diode module is provided to efficiently emit heat generated from the light emitting diode by mounting a plurality of light emitting diode packages on the upper side of a heat-sink and shortening a thermal path. CONSTITUTION: A plurality of through holes are formed in a printed circuit board(PCB)(130). Lenses(111, 121) are formed on a plurality of light emitting diode packages. The light emitting diode packages are mounted on the lower side of the PCB. The light emitting diode packages are projected over the upper side of the PCB. A heat-sink(160) is mounted on the lower side of the light emitting diode packages. Pads are formed on the lower side of the PCB adjacent to each through hole.
Abstract translation: 目的：提供一种发光二极管模块，用于通过在散热器的上侧安装多个发光二极管封装并缩短热路径来有效地发射由发光二极管产生的热量。 构成：在印刷电路板（PCB）（130）中形成多个通孔。 透镜（111,121）形成在多个发光二极管封装上。 发光二极管封装安装在PCB的下侧。 发光二极管封装突出在PCB的上侧。 散热器（160）安装在发光二极管封装的下侧。 在邻近每个通孔的PCB的下侧形成有垫。
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公开(公告)号：KR1020090129168A
公开(公告)日：2009-12-16
申请号：KR1020080055297
申请日：2008-06-12
Applicant: 전자부품연구원
CPC classification number: H05K3/0064 , H01G4/30 , H05K1/0271 , H05K1/0366 , H05K1/185 , H05K3/30 , H05K3/4038
Abstract: PURPOSE: A condenser embedded substrate and a manufacturing method thereof are provided to distribute the stress applied to the metal substrate by uniformly distributing the polymer dielectric and the ceramic dielectric to the metal substrate. CONSTITUTION: A mask film is formed on a metal substrate(100). A plurality of penetration holes are formed by selectively removing the mask film. A ceramic dielectric material is deposited in the plurality of penetration holes by the aerosol deposition. A plurality of ceramic dielectric films(120) are formed on the metal substrate and have a cylindrical shape. A copper foil(130) is formed on the ceramic dielectric films. A polymer dielectric(150) is filled between the metal substrate and the copper foil.
Abstract translation: 目的：提供一种电容器嵌入式基板及其制造方法，通过将聚合物电介质和陶瓷电介质均匀地分配到金属基板来分布施加到金属基板上的应力。 构成：在金属基板（100）上形成掩模膜。 通过选择性地去除掩模膜形成多个穿透孔。 陶瓷电介质材料通过气溶胶沉积沉积在多个穿透孔中。 在金属基板上形成多个陶瓷电介质膜（120），并具有圆筒形状。 在陶瓷电介质膜上形成铜箔（130）。 聚合物电介质（150）填充在金属基板和铜箔之间。
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公开(公告)号：KR100800509B1
公开(公告)日：2008-02-04
申请号：KR1020060129245
申请日：2006-12-18
Applicant: 전자부품연구원
Abstract: A conductive paste, and a multilayered ceramic substrate prepared by using the paste are provided to reduce the pore at the circumference of a via hole generated during the constrained sintering process of low temperature cofired ceramic(LTCC). A conductive paste comprises 80-95 wt% of silver(Ag) particles having an average particle size of 5 micrometers or more, and is filled into the via hole of a multilayered ceramic substrate so as to be sintered. Preferably the silver particles are spherical. Preferably the conductive paste comprises further 3-18.9 wt% of an organic binder; 0.1-1 wt% of a dispersant and 1-10 wt% of a solvent; and/or a combination particle of silver and palladium(Pd).
Abstract translation: 提供使用该糊料制备的导电浆料和多层陶瓷基材，以减少在低温共烧陶瓷（LTCC）的约束烧结过程中产生的通孔周围的孔。 导电性糊料包含80-95重量％的平均粒径为5微米以上的银（Ag）颗粒，并且填充到多层陶瓷基板的通孔中以进行烧结。 银颗粒最好是球形的。 优选地，导电糊还包含3-18.9重量％的有机粘合剂; 0.1-1重量％的分散剂和1-10重量％的溶剂; 和/或银和钯（Pd）的组合颗粒。
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公开(公告)号：KR100784411B1
公开(公告)日：2007-12-11
申请号：KR1020060118752
申请日：2006-11-29
Applicant: 전자부품연구원
CPC classification number: H04B1/0057 , H01P1/213 , H04W88/02
Abstract: A front end module in a dual band terminal is provided to obtain a high Q value at a low inductance value by forming a serial/parallel resonator at a high pass filter, which filters signals of the second band, so that the serial/parallel resonator can work as a parallel resonator for a higher frequency than signals of the second band and a serial resonator for signals of the second band. A front end module in a dual band terminal is comprised of a low pass filter(310), a high pass filter(320), and a filter(330) for the second band. The low pass filter(310) passes signals of the first band among the signals received through an antenna(300). The high pass filter(320), in which a serial/parallel resonator is embedded, passes signals of the second band among the signals received through the antenna. The filter(330) filters signals of the second band, which passes through the high pass filter(320). The serial/parallel resonator comprises a parallel resonator and a capacitor connected with the parallel resonator. The parallel resonator is resonated at a frequency higher than signals of the second band. For signals of the second band, the parallel resonator works as an inductor.
Abstract translation: 提供双带终端中的前端模块以通过在高通滤波器处形成串联/并联谐振器来获得低电感值的高Q值，该高通滤波器对第二频带的信号进行滤波，使得串/并联谐振器 可以作为与第二频带的信号相比更高的频率的并联谐振器和用于第二频带的信号的串行谐振器。 双频带终端中的前端模块包括用于第二频带的低通滤波器（310），高通滤波器（320）和滤波器（330）。 低通滤波器（310）通过天线（300）接收的信号中的第一频带的信号通过。 串联/并联谐振器嵌入的高通滤波器（320）通过天线接收的信号中的第二频带的信号通过。 滤波器（330）对通过高通滤波器（320）的第二频带的信号进行滤波。 串联/并联谐振器包括并联谐振器和与并联谐振器连接的电容器。 并联谐振器以比第二频带的信号高的频率谐振。 对于第二频带的信号，并联谐振器用作电感器。
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公开(公告)号：KR100681259B1
公开(公告)日：2007-02-09
申请号：KR1020050101119
申请日：2005-10-26
Applicant: 전자부품연구원
Abstract: A multi-layered front-end module for a dual-band terminal is provided to minimize the size by patterning components of a diplexer and a matching unit for matching a transmitting stage with a receiving stage of a SAW duplexer on a dielectric substrate, instead of mounting them on a substrate, in order to arrange them three-dimensionally. A multi-layered front-end module for a dual-band terminal is comprised of the first dielectric layer and the second dielectric layer. At the first dielectric layer, a SAW duplexer(130) and a SAW filter(120), connected with a diplexer(110), respectively, are mounted in a chip type. Also, a plurality of ports which will be wire-bonded are formed at the first dielectric layer. The second dielectric layer is laminated on a bottom of the first dielectric layer. Electrode patterns for a plurality of components forming the diplexer are formed on the second dielectric layer. The first dielectric layer and the second dielectric layer are electrically connected with each other through a via hole.
Abstract translation: 提供用于双频带终端的多层前端模块以通过图案化双工器的组件以及用于匹配发射级与SAW双工器的接收级在电介质衬底上的匹配单元来最小化尺寸，而不是 将它们安装在基板上，以便三维地布置它们。 用于双频带终端的多层前端模块由第一电介质层和第二电介质层组成。 在第一介电层处，分别与双工器（110）连接的SAW双工器（130）和SAW滤波器（120）以芯片类型安装。 而且，将在第一电介质层上形成将被引线键合的多个端口。 第二介电层层压在第一介电层的底部上。 用于形成双工器的多个部件的电极图案形成在第二介电层上。 第一介电层和第二介电层通过通孔彼此电连接。
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Patent Agency Ranking
公开(公告)号：KR1020030068815A
公开(公告)日：2003-08-25
申请号：KR1020020008453
申请日：2002-02-18
Applicant: 전자부품연구원
CPC classification number: H04B3/46 , G01R31/2896
Abstract: PURPOSE: An apparatus and a method for measuring a characteristic of an RF(Radio Frequency) signal transmission line are provided to accurately measure the transmission line of an RF signal inputted in a distributed feedback laser diode chip by measuring the characteristic of the RF signal in a package module. CONSTITUTION: A package module, having a transmission line in which an RF signal is inputted, is safely received in a PCB(Printed Circuit Board)(140). A microstrip line(120) is formed at one side of an upper surface of the PCB(140), and is electrically connected with a lead connected to one side of the transmission line of the package module. A connector(110) is connected with the microstrip line(120) by a conductor(111). A coaxial cable(130) is electrically connected with the other side of the transmission line by a conductor(131). A network analyzer(200) is connected with the coaxial cable(130) at the its first port, and is connected with a coaxial cable(150) connected with the connector(110), at the its second port, for measuring the RF signal.
Abstract translation: 目的：提供一种用于测量RF（射频）信号传输线的特性的装置和方法，以通过测量RF分量反馈激光二极管芯片中的RF信号的特性来精确测量输入到分布反馈激光二极管芯片中的RF信号的传输线 一个封装模块。 构成：具有输入RF信号的传输线的封装模块被安全地接收在PCB（印刷电路板）（140）中。 微带线（120）形成在PCB（140）的上表面的一侧，并且与连接到封装模块的传输线的一侧的引线电连接。 连接器（110）通过导体（111）与微带线（120）连接。 同轴电缆（130）通过导体（131）与传输线的另一侧电连接。 网络分析器（200）在其第一端口处与同轴电缆（130）连接，并且在其第二端口处与与连接器（110）连接的同轴电缆（150）连接，用于测量RF信号 。
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公开(公告)号：KR1020000028350A
公开(公告)日：2000-05-25
申请号：KR1019980046548
申请日：1998-10-31
Applicant: 전자부품연구원
IPC: H03H9/64
CPC classification number: H03H9/64 , H03H9/0576 , H03H9/145 , H03H9/6416 , H03H9/725
Abstract: PURPOSE: A surface elastic wave duplexer package is to prevent the formation of parasitic capacitance due to the length difference between strip lines respectively connected to a filter chip of the transmitting terminal and a filter chip of the receiving terminal. CONSTITUTION: A surface elastic wave duplexer package comprises: a transmitting filter chip(10); a receiving filter chip(20); and a phase matching strip line(30) all of which are formed on a ground layer. Each of the filter chips is connected to a ground terminal(40) and a signal terminal through a wire. The signal terminal consists of a first signal terminal(50) for receiving a signal applied from an external transmission circuit, a second signal terminal(60) for outputting an input signal to an antenna, a third signal terminal(70) for receiving a signal input through the antenna, and a fourth signal terminal(80) for outputting a received signal to an external receiving circuit. The phase matching strip line is formed on a substrate on which two filter chips are mounted and whose one end is connected to the second signal terminal and the other end is connected to the third signal terminal.
Abstract translation: 目的：表面弹性波双工器封装是为了防止由于分别连接到发射端子的滤波器芯片和接收端子的滤波器芯片的带状线之间的长度差而形成寄生电容。 构成：表面弹性波双工器封装包括：发射滤波器芯片（10）; 接收滤波器芯片（20）; 和相位匹配带状线（30），它们都形成在接地层上。 每个滤波器芯片通过导线连接到接地端子（40）和信号端子。 信号端子包括用于接收从外部发送电路施加的信号的第一信号端子（50），用于向天线输出输入信号的第二信号端子（60），用于接收信号的信号 通过天线输入，以及用于将接收信号输出到外部接收电路的第四信号端子（80）。 相位匹配带状线形成在其上安装有两个滤波器芯片的基板上，并且其一端连接到第二信号端子，另一端连接到第三信号端子。
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公开(公告)号：KR1020000019703A
公开(公告)日：2000-04-15
申请号：KR1019980037941
申请日：1998-09-15
Applicant: 전자부품연구원
IPC: H03H9/64
Abstract: PURPOSE: A surface acoustic wave(SAW) filter is provided to improve surface acoustic wave speed of a single crystal substrate and to directly mount the surface acoustic wave filter on a printed circuit board without mounting on a package. CONSTITUTION: A piezoelectric single crystal substrate(100) converts an electric signal into a mechanical surface acoustic wave and converts the surface acoustic wave into the electric signal. An input converter is formed on one side of the piezoelectric single crystal substrate(100) and transmits the electric signal to the piezoelectric single crystal substrate(100). An output converter is formed on the other side of the piezoelectric single crystal substrate(100) and transmits the electric signal converted at the piezoelectric single crystal substrate(100) to the outside. A carbon thin film of diamond nature or diamond thin film(300) is formed on the input and the output converter to expose the top of the piezoelectric single crystal substrate(100) and a part of the input and the output converter, and increases speed of the surface acoustic wave.
Abstract translation: 目的：提供表面声波（SAW）滤波器，以提高单晶基板的表面声波速度，并将表面声波滤波器直接安装在印刷电路板上，而无需安装在封装上。 构成：压电单晶基板（100）将电信号转换为机械声表面波，并将表面声波转换为电信号。 输入转换器形成在压电单晶衬底（100）的一侧，并将电信号传输到压电单晶衬底（100）。 输出转换器形成在压电单晶衬底（100）的另一侧，并将在压电单晶衬底（100）处转换的电信号传输到外部。 在输入和输出转换器上形成金刚石性质的碳薄膜或金刚石薄膜（300），以暴露压电单晶衬底（100）的顶部和输入和输出转换器的一部分，并且增加速度 的表面声波。
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公开(公告)号：KR101757584B1
公开(公告)日：2017-07-12
申请号：KR1020160031402
申请日：2016-03-16
Applicant: 전자부품연구원
CPC classification number: C08J5/18 , C08G18/44 , C08G73/12 , C08G2261/46 , C08K3/00 , C08L75/04 , C08L79/08
Abstract: 재작업성및 재제조성이우수한재제조성방열필름용조성물및 그의제조방법이제안된다. 본발명에따른재제조성방열필름용조성물은방열필러및 퓨란관능기및 말레이미드관능기중 적어도하나를포함하며, 퓨란관능기및 말레이미드관능기중 적어도하나의딜스-알더반응(Diels-alder reaction)에의해열가역적가교결합이형성되는고분자화합물을포함한다.
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公开(公告)号：KR1020150087518A
公开(公告)日：2015-07-30
申请号：KR1020140007574
申请日：2014-01-22
Applicant: 전자부품연구원
IPC: C04B35/581 , C04B35/64
CPC classification number: B32B18/00 , C04B35/581 , C04B2235/75
Abstract: 세라믹기판및 이의제조방법이제공되고, 본발명의일 구현예에따른세라믹기판은알루미늄을포함하고, 서로마주보는상부표면(upper surface) 및하부표면(lower surface)을갖는질화물층을포함하고, 질화물층의내부에서상부표면에가까워질수록질소농도가낮아지고, 질화물층 내부에서상부표면에가까워질수록산소원자, 수소원자, 또는염소원자의농도가높아지는것일수 있다.
Abstract translation: 本发明提供一种陶瓷基板及其制造方法。 根据本发明的实施例，陶瓷基板包括铝和包括上表面和下表面的氮化物层。从氮化物层的内部到氮化物层的上表面，氮浓度降低 而氧原子，氢原子和氯原子的浓度增加。
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