公开(公告)号：KR1020090071830A

公开(公告)日：2009-07-02

申请号：KR1020070139741

申请日：2007-12-28

Applicant: 제일모직주식회사

Inventor： 이경주 ,  정창범 ,  최승집 ,  하경진 ,  김준숙

IPC: C09J133/08 ,  C09J133/00 ,  C09J7/02

CPC classification number: C09J133/08 ,  C09J7/35 ,  C09J2203/326

Abstract: An adhesive composition is provided to avoid damages of a chip due to excellent adhesion with a substrate before photocuring, and to lower strippability and increase pick-up property after photocuring. An adhesive composition comprises a photocurable acrylic copolymer containing an epoxy ring, a thermosetting copolymer containing a carboxyl group, a photoinitiator and a thermosetting material. The composition includes a thermosetting copolymer containing a carboxyl group of 1-10 parts by weight based on the solid portion of the whole binder resin. The photocurable acrylic copolymer containing an epoxy ring and the thermosetting copolymer containing a carboxyl group are hardened by the same thermosetting material.

Abstract translation: 提供粘合剂组合物以避免在光固化之前由于与基材的优异粘附性而损坏芯片，并且降低剥离性并且增加光固化后的拾取性能。 粘合剂组合物包含含有环氧环的光固化丙烯酸共聚物，含羧基的热固性共聚物，光引发剂和热固性材料。 该组合物包含基于整个粘合剂树脂的固体部分含有1-10重量份的羧基的热固性共聚物。 含有环氧环的光固化丙烯酸共聚物和含有羧基的热固性共聚物通过相同的热固性材料硬化。

公开(公告)号：KR100885793B1

公开(公告)日：2009-02-26

申请号：KR1020060136216

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 김준숙 ,  황용하 ,  하경진 ,  조재현 ,  서만석 ,  송규석 ,  기희연 ,  정창범

IPC: C09J133/10 ,  C09J133/08 ,  C09J133/06

Abstract: 본 발명은 조성물의 성분이 비닐기를 함유한 아크릴계 점착수지 조성물, 이를 포함하는 광경화형 점착조성물 및 이를 포함하는 점착테이프에 관한 것으로, 본 발명에 의한 광경화형 점착조성물은 우수한 박리력을 갖는 아크릴계 점착수지 조성물을 포함하고 있어, 초기 점착력이 우수하고, 낮은 자외선 에너지에서도 광경화 후 우수한 박리성을 가짐으로써, 낮은 박리력이 요구되는 다이싱용 또는 다이싱 다이본딩용 점착 테이프에 유용하게 사용할 수 있다.
아크릴계 점착수지, 아크릴산, 메타크릴레이트, 부가중합, 광경화형 점착조성물, 점착 테이프

公开(公告)号：KR1020080061198A

公开(公告)日：2008-07-02

申请号：KR1020060136222

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 하경진 ,  황용하 ,  김준숙 ,  조재현 ,  송규석

IPC: C09J175/06 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J167/00 ,  C09J7/38 ,  C09J167/02

Abstract: An unsaturated polyester adhesive resin is provided to realize excellent adhesion to a substrate film, excellent peel force and low tackiness after photocuring, and to obtain an adhesive tape useful for dicing or dicing die bonding. An unsaturated polyester adhesive resin comprises an unsaturated acid, a saturated acid and glycol, and has a vinyl group-containing binder portion. The unsaturated acid is used in an amount of 5-50 mol% based on the combined molar weight of the unsaturated acid and saturated acid. The adhesive resin preferably comprises 2-22 wt% of the unsaturated acid, 32-55 wt% of the saturated acid and 42-57 wt% of glycol. The adhesive resin has a weight average molecular weight of 100,000-400,000.

Abstract translation: 提供了一种不饱和聚酯粘合树脂，以实现对基底膜的优异的粘附性，优异的剥离力和光固化后的低粘合性，并且获得用于切割或切割模片接合的粘合带。 不饱和聚酯粘合剂树脂包含不饱和酸，饱和酸和二醇，并且具有含乙烯基的粘合剂部分。 基于不饱和酸和饱和酸的组合摩尔浓度，不饱和酸的用量为5-50mol％。 粘合树脂优选包含2-22重量％的不饱和酸，32-55重量％的饱和酸和42-57重量％的二醇。 粘合树脂的重均分子量为100,000-400,000。

公开(公告)号：KR100815383B1

公开(公告)日：2008-03-20

申请号：KR1020060136203

申请日：2006-12-28

Applicant: 제일모직주식회사

Inventor： 조재현 ,  황용하 ,  송규석 ,  김준숙 ,  기희연 ,  정창범

IPC: C08L101/00 ,  C08J5/18 ,  C08F290/06

CPC classification number: H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A photocurable composition for forming an adhesive film is provided to realize excellent pick-up property by virtue of a sufficient drop in the adhesion after UV curing, and to facilitate die bonding on a PCB or lead frame by fixing chips during dicing and easily removing the chips during pick-up. A photocurable composition for forming an adhesive film comprises: (A) 100 parts by weight of a polymer binder resin; 20-150 parts by weight of a UV-curable urethane acrylate oligomer; (C) 5-50 parts by weight of a UV-curable acrylate present in a solid phase at room temperature; (D) 0.1-10 parts by weight of a heat curing agent; and (E) 0.1-5 parts by weight of a photopolymerization initiator based on 100 parts by weight of the UV curable acrylates (B)+(C). The binder polymer resin is at least one resin selected from acrylic, polyester, urethane, silicone and natural rubber resins.

Abstract translation: 提供了一种用于形成粘合剂膜的可光固化组合物，以便通过UV固化后的粘附力充分降低来实现优异的拾取性能，并且通过在切割期间固定芯片便于PCB或引线框架上的裸片接合，并且容易地除去 拾取期间的芯片。 用于形成粘合剂膜的光固化组合物包括：（A）100重量份的聚合物粘合剂树脂; 20-150重量份的可UV固化的氨基甲酸酯丙烯酸酯低聚物; （C）5-50重量份在室温下固相中存在的可UV固化的丙烯酸酯; （D）0.1-10重量份的热固化剂; 和（E）基于100重量份的UV固化丙烯酸酯（B）+（C），0.1-5重量份的光聚合引发剂。 粘合剂聚合物树脂是选自丙烯酸，聚酯，聚氨酯，硅酮和天然橡胶树脂中的至少一种树脂。

公开(公告)号：KR1020110020058A

公开(公告)日：2011-03-02

申请号：KR1020090077746

申请日：2009-08-21

Applicant: 제일모직주식회사

Inventor： 이성재 ,  김태호 ,  김준숙 ,  이진영 ,  류강 ,  최상준

IPC: G03F7/027 ,  G03F7/004 ,  C07D493/02 ,  C07D495/02

CPC classification number: C07D307/93 ,  C07D493/08 ,  C07D495/08 ,  C08F220/18 ,  C08F220/28 ,  G03F7/0397 ,  C07D493/02 ,  C07D495/02 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/027

Abstract: PURPOSE: A (meth)acrylate compound is provided to excellent sensitivity, resolution, and etching resistance and to enable application to the manufacture of a photosensitive polymer. CONSTITUTION: A (meth)acrylate compound has a lactone group of chemical formula 1. In chemical formula 1, R_1 is hydrogen, methyl group or CH_2CO_2R_5; R_2 is hydrogen, methyl group or CO_2R_5; R_3 is hydrogen or linear, branched or ringed substituted or unsubstituted alkyl groups; R_4 is hydroxy or CO_2R_5; X is (CH_2)_n, O or S; R_5 is linear, branched or ringed substituted or unsubstituted alkyl groups; and A is linear, branched or ringed substituted or unsubstituted alkyl groups; R_4 is hydroxy or CO_2R_5; X is (CH_2)_n, O or S; R_5 is linear, branched or ringed substituted or unsubstituted alkylene groups.

Abstract translation: 目的：提供（甲基）丙烯酸酯化合物以具有优异的灵敏度，分辨率和耐蚀刻性，并且能够应用于光敏聚合物的制造。 构成：（甲基）丙烯酸酯化合物具有化学式1的内酯基。在化学式1中，R 1是氢，甲基或CH 2 CO 2 R 5; R 2是氢，甲基或CO 2 R 5; R 3是氢或直链，支链或环状的取代或未取代的烷基; R 4是羟基或CO 2 R 5; X是（CH 2）_n，O或S; R 5是直链，支链或环状的取代或未取代的烷基; 且A为直链，支链或环状取代或未取代的烷基; R 4是羟基或CO 2 R 5; X是（CH 2）_n，O或S; R 5是直链，支链或环状的取代或未取代的亚烷基。

公开(公告)号：KR100942363B1

公开(公告)日：2010-02-12

申请号：KR1020070124378

申请日：2007-12-03

Applicant: 제일모직주식회사

Inventor： 최승집 ,  하경진 ,  김준숙 ,  이경주 ,  정창범

IPC: C09J127/12 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J133/16 ,  C08L2312/06

Abstract: 본 발명은 아크릴계 점착 바인더, 열경화제 및 광개시제를 포함하는 광경화형 점착 조성물 및 이에 의한 점착필름에 관한 것으로서, 상기 아크릴계 점착 바인더가 플루오르기를 포함함에 따라 본 발명에 의한 점착테이프가 광경화 후에 슬립성을 나타내고, 웨이퍼 또는 다이접착용 접착필름과 쉽게 박리된다.
따라서, 본 발명에 의한 상기 점착 테이프는 다이 접착용 접착필름과의 속도별 박리력에서 우수하므로 다이싱 점착 테이프에 유용하게 사용된다.
아크릴계 점착 바인더, 플루오르, 에폭시기, 속도별 박리력, 점착 테이프

公开(公告)号：KR1020090057687A

公开(公告)日：2009-06-08

申请号：KR1020070124378

申请日：2007-12-03

Applicant: 제일모직주식회사

Inventor： 최승집 ,  하경진 ,  김준숙 ,  이경주 ,  정창범

IPC: C09J127/12 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J133/16 ,  C08L2312/06 ,  C09J7/385 ,  C09J2203/326

Abstract: A UV curable PSA(pressure-sensitive adhesive) composition is provided to ensure excellent pick-up property after UV curing and to improve tackiness, adhesive force with a base film and mechanical strength. A UV curable PSA(pressure-sensitive adhesive) composition comprises acrylic adhesive binder 100.0 parts by weight, a thermosetting material 0.5~10.0 parts by weight, and a photoinitiator 0.001~0.05 parts by weight. The acrylic adhesive binder includes a fluorine group. The acrylic adhesive binder is prepared by: mixing an acrylic monomer, an acrylate monomer having a hydroxyl group, an acrylate monomer having an epoxy group, an acrylate monomer having a fluorine group, then performing polymerization; and performing urethane addition of a hydroxyl group of a polymer base and an isocyanate group of a monomer having a vinyl group.

Abstract translation: 提供UV固化型PSA（压敏粘合剂）组合物，以确保UV固化后的优异的吸收性，并且改善粘合性，用基膜的粘合力和机械强度。 UV可固化PSA（压敏粘合剂）组合物包含丙烯酸粘合剂粘合剂100.0重量份，热固性材料0.5〜10.0重量份，光引发剂0.001〜0.05重量份。 丙烯酸类粘合剂粘合剂包括氟基。 丙烯酸粘合剂粘合剂通过以下方法制备：将丙烯酸单体，具有羟基的丙烯酸酯单体，具有环氧基的丙烯酸酯单体，具有氟基的丙烯酸酯单体混合，然后进行聚合; 并且进行聚合物基团的羟基和具有乙烯基的单体的异氰酸酯基团的氨基甲酸酯加成。