Abstract:
본 발명은 아크릴공중합체, 열경화제 및 광개시제를 포함하는 광경화형 점착테이프용 조성물에 관한 것으로서, 상기 조성물은 광경화 후 다이 접착용 접착필름보다 낮은 표면에너지를 갖고, 또한 자외선 경화 전 후 표면에너지 차이가 매우 커서 픽업성이 우수한 접착필름을 제공할 수 있는 아크릴공중합체, 열경화제 및 광개시제를 포함하는 광경화형 점착테이프용 조성물에 관한 것이다. 상기 접착필름은 다이 접착용 접착필름과의 속도별 박리력에서 우수한 다이싱 점착 테이프에 유용하게 사용할 수 있다. 아크릴계 점착 바인더, 표면에너지, 에폭시기, 속도별 박리력, 광경화형 점착 조성물, 점착 테이프
Abstract:
A photo-curable adhesive composition is provided to excellent adhesive force to a ring frame, wafer or adhesive film for die bonding, and to ensure excellent curability and releasability. A photo-curable adhesive composition comprise (A) photo-curable acrylic adhesion binder 90~97 parts by weight containing a vinyl group, (B) photoinitiator 0.5~1 parts by weight and (C) thermosetting material 3~7 parts by weight. The photo-curable acrylic adhesion binder containing a vinyl group comprises an epoxy group 2~5 mole % and has the hydroxyl value of 15~30 and the acid value of 1 or less.
Abstract:
A photocurable composition for forming an adhesive film is provided to ensure excellent pick-up property due to the reduction of adhesion strength after UV curing and to obtain a dicing die bonding film with one dicing process and die bonding process of a supporting member. A photocurable composition for forming an adhesive film comprises (A) binder resin having adhesion property 100.0 parts by weight, (B) UV-curable urethane acrylate oligomer 20-150 parts by weight, (C) trimethylolpropane-tri(meth)acrylate UV-curable acrylate 3-50 parts by weight and (D) thermosetting agent 0.1-10 parts by weight. The photopolymerization initiator(C) is included in the amount of 0.1-5 parts by weight per UV-curable acrylate(B+C) 100 parts by weight. The polymer binder resin is acrylic resin and comprises a polar functional group selected from the group consisting of -OH, epoxy group and amine group.
Abstract:
PURPOSE: A (meth)acrylate compound, photosensitive polymer, and resist composition are provided to control acid diffusion and to improve side wall roughness. CONSTITUTION: A (meth)acrylate compound with cyclo group contains a nitrogen of chemical formula 1. A photosensitive polymer comprises a repeat unit induced by compounds of chemical formulas 1, 2, 3, and 4. A resist polymer comprises the photosensitive polymer, photoacid generator, and solvent. The photosensitive polymer is contained in 5-15 weight parts based on 100 weight parts of resist composition. The photoacid generator is triarylsulfonium salts, diaryliodonium salts, sulfonates, or mixture thereof.
Abstract:
A photo-curable adhesive composition is provided to excellent adhesive force to a ring frame, wafer or adhesive film for die bonding, and to ensure excellent curability and releasability. A photo-curable adhesive composition comprise (A) photo-curable acrylic adhesion binder 90~97 parts by weight containing a vinyl group, (B) photoinitiator 0.5~1 parts by weight and (C) thermosetting material 3~7 parts by weight. The photo-curable acrylic adhesion binder containing a vinyl group comprises an epoxy group 2~5 mole % and has the hydroxyl value of 15~30 and the acid value of 1 or less.
Abstract:
본 발명은 아크릴공중합체, 열경화제 및 광개시제를 포함하는 광경화형 점착테이프용 조성물에 관한 것으로서, 상기 조성물은 광경화 후 다이 접착용 접착필름보다 낮은 표면에너지를 갖고, 또한 자외선 경화 전 후 표면에너지 차이가 매우 커서 픽업성이 우수한 접착필름을 제공할 수 있는 아크릴공중합체, 열경화제 및 광개시제를 포함하는 광경화형 점착테이프용 조성물에 관한 것이다. 상기 접착필름은 다이 접착용 접착필름과의 속도별 박리력에서 우수한 다이싱 점착 테이프에 유용하게 사용할 수 있다. 아크릴계 점착 바인더, 표면에너지, 에폭시기, 속도별 박리력, 광경화형 점착 조성물, 점착 테이프
Abstract:
PURPOSE: A (meth)acrylate compound, photosensitive polymer, and resist composition are provided to improve adhesion property and pattern side wall roughness. CONSTITUTION: A (meth)acrylate contains an imide group of chemical formula 1. In chemical formula, R1 is hydrogen or methyl group and R2 is hydrogen, substituted or non-substituted alkyl group or cycloalkyl group. A photosensictive polymer contains a repeat unit induced from compounds of chemical formulas 1 and 2. The photosensitive polymer further contains a repeat unit induced from chemical formula 3 and/or 4. A resist composition contains the photosensitive polymer, photoacid generator, and solvent. The photoacid generator is triarylsulfonium salts, diaryliodonium salts, sulfonates, or mixture thereof.
Abstract:
A vinyl group-containing acrylic adhesive resin composition is provided to realize high initial adhesion and excellent photocurable effect and peel force after photocuring, and to obtain an adhesive tape useful for dicing or dicing die bonding. A vinyl group-containing acrylic adhesive resin composition comprises: 100 parts by weight of an adhesive acrylic binder resin comprising 20-30 parts by weight of methyl methacrylate, 10-20 parts by weight of butyl acrylate, 40-60 parts by weight of 2-ethylhexyl acrylate, 10-20 parts by weight of 2-hydroxymethyl acrylate, and 10-20 parts by weight of glycidyl methacrylate; and 3-20 parts by weight of acrylic acid or methacrylic acid. The acrylate or methacrylate is addition polymerized to the glycidyl methacrylate of the adhesive acrylic binder resin.
Abstract:
본 발명은 점착특성을 갖는 고분자 바인더 수지, UV 경화형 우레탄 아크릴레이트 올리고머, 트리메틸롤프로판-트리(메타)아크릴레이트계 UV경화형 아크릴레이트, 열경화제, 광중합 개시제를 포함하는 점착필름 형성용 광경화성 조성물 및 이를 이용하여 형성된 점착층을 포함하는 다이싱 다이본딩 필름에 관한 것으로, 본 발명에 의한 다이싱 다이본딩 필름은 상기 점착필름 형성용 광경화성 조성물을 함유하고 있어 다이싱 공정과 다이본딩 공정을 지지부재에 대하여 한번의 공정으로 수행할 수 있는 장점이 있다. 반도체, 점착 테이프, 광경화성 점착조성물, UV 경화형 우레탄 아크릴레이트 올리고머, UV 경화형 아크릴레이트, 해도구조, 다이싱, 다이 본딩, 픽업
Abstract:
본 발명은 다이싱 테이프 또는 다이싱 다이 본딩 테이프의 점착층에 이용되는 광경화형 점착제 조성물 및 이를 이용한 점착 테이프에 관한 것으로, 본 발명의 구현예들에 의한 점착제 조성물은 바인더 수지로서 에폭시링을 함유한 광경화형 아크릴계 공중합체 및 카르복시기를 함유한 열경화성 공중합체를 각각 따로 포함하는 것을 특징으로 한다. 에폭시 함유 공중합체, 카르복시기 함유 공중합체, 점착층, 다이싱 테이프