-
公开(公告)号：KR100996349B1
公开(公告)日：2010-11-23
申请号：KR1020070078527
申请日：2007-08-06
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
Abstract: 본 발명은 페녹시수지; 수산기, 에폭시기를 함유하는 엘라스토머 수지; 에폭시계 수지; 페놀형 에폭시 수지 경화제 또는 방향족 아민계 경화제; 잠재성 촉매형 경화제 및 경화촉매로 이루어진 군으로부터 선택된 1종 이상의 물질; 실란 커플링제;및 충진제를 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물에 관한 것으로서, 본 발명의 반도체 조립용 접착 필름 조성물은 페녹시 수지를 함유함으로써 웨이퍼와 웨이퍼 혹은 PCB와의 부착력이 우수하고, 인장 모듈러스 향상으로 점착층과의 픽업성을 유리하게 하고, 열가소성 성질로 인하여 다이 어태치 공정시 발생하는 기포를 최소화할 뿐만 아니라 PCB 기판과 같은 거친 표면을 메우는 효과가 우수하기 때문에높은 신뢰성을 확보할 수 있는 반도체 조립용 접착 필름을 제공할 수 있다.
반도체 조립용 접착 필름, 에폭시기 함유형 엘라스토머 수지, 에폭시계 수지, 페놀계 혹은 아민형 경화제, 이미다졸계 경화촉매, 실란 커플링제.-
公开(公告)号：KR100956721B1
公开(公告)日：2010-05-06
申请号：KR1020070136593
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: C09J133/00 , C09J163/00 , C09J183/04 , C09J7/02
Abstract: 본 발명은 아크릴계 고분자, 에폭시 수지, 페놀형 경화수지, 경화촉매, 실란 커플링제 및 충진제를 포함하는 반도체 조립용 접착필름 조성물로 구성되는 반도체 조립용 접착 필름으로서, 25℃, 10 내지 1000 mm/min의 인장 조건에 대하여 1000 mm/min의 인장 속도에서 측정된 파단신율 E
1000 이 50 내지 150%의 범위이며, 상기 파단신율 E
1000 은 10 mm/min의 인장 속도에서 측정된 파단신율 E
10 과 함께 ( E
10 - E
1000 ) / (log
10 10 - log
10 1000) ≤ -200의 수식을 만족시키는 것을 특징으로 하는 반도체 조립용 접착 필름 및 이를 포함하는 다이싱 다이 본딩 필름에 관한 것으로서, 본 발명에 의한 접착필름은 다이싱(Dicing) 공정 중 접착 필름이 변형되어 발생하는 버(Burr)가 없고 후속 본딩(Bonding) 공정에서도 우수한 픽업(Pick-Up) 특성을 제공한다.
버, 픽업, 파단신율, 인장속도, 가교성 관능기, 반도체 조립용 접착 필름, 다이 접착(Die Attach)-
公开(公告)号：KR100942363B1
公开(公告)日：2010-02-12
申请号：KR1020070124378
申请日：2007-12-03
Applicant: 제일모직주식회사
IPC: C09J127/12 , C09J7/02 , C09J7/00
CPC classification number: C09J133/16 , C08L2312/06
Abstract: 본 발명은 아크릴계 점착 바인더, 열경화제 및 광개시제를 포함하는 광경화형 점착 조성물 및 이에 의한 점착필름에 관한 것으로서, 상기 아크릴계 점착 바인더가 플루오르기를 포함함에 따라 본 발명에 의한 점착테이프가 광경화 후에 슬립성을 나타내고, 웨이퍼 또는 다이접착용 접착필름과 쉽게 박리된다.
따라서, 본 발명에 의한 상기 점착 테이프는 다이 접착용 접착필름과의 속도별 박리력에서 우수하므로 다이싱 점착 테이프에 유용하게 사용된다.
아크릴계 점착 바인더, 플루오르, 에폭시기, 속도별 박리력, 점착 테이프-
公开(公告)号：KR1020090081103A
公开(公告)日：2009-07-28
申请号：KR1020080006993
申请日：2008-01-23
Applicant: 제일모직주식회사
IPC: C09J133/08 , H01L21/48 , H01L21/50
CPC classification number: C09J9/00 , C09J2203/326 , C09J2427/006 , H01L21/48 , H01L21/50
Abstract: A dicing tape for the semiconductor packaging is provided to inhibit the migration of a plasticizer and an additive of a PVC film, thereby improving the pick-up in the semiconductor packing process, room temperature stability and durability. A dicing tape(1) for the semiconductor packaging comprises a base film(5), an adhesive layer(3) and a release film(2), wherein a curing resin layer(4) having a storage modulus of 4.0x10^4 dyne/cm^2 or more is formed between the base film and the adhesive layer. The base film is a poly(vinyl chloride) film. The curing resin layer is formed by curing a curing resin layer composition with UV rays, heat or radioactive rays.
Abstract translation: 提供了用于半导体封装的切割胶带，以抑制增塑剂和PVC膜的添加剂的迁移，从而改善半导体填充过程中的拾取，室温稳定性和耐久性。 用于半导体封装的切割胶带（1）包括基膜（5），粘合剂层（3）和脱模膜（2），其中具有4.0×10 ^ 4达因的储能模量的固化树脂层（4） / cm 2以上形成在基膜和粘合剂层之间。 基膜是聚（氯乙烯）膜。 固化树脂层通过固化具有紫外线，热或放射线的固化树脂层组合物而形成。
-
公开(公告)号：KR1020090057697A
公开(公告)日：2009-06-08
申请号：KR1020070124393
申请日：2007-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J163/00 , C09J183/04 , C09J2203/326
Abstract: A bonding film composition for a semiconductor assembly is provided to prevent separation or curling of an adhesive film caused by frictional heat generating in a dicing process of a semiconductor. A bonding film composition for a semiconductor assembly comprises, based on whole solid 100.0 parts by weight of the composition, an elastomer resin -60 parts by weight containing a hydroxyl group, carboxyl group or epoxy group; a film-forming resin 5-60 parts by weight; an epoxy resin 5-40 parts by weight; a phenol type epoxy hardener 10-30 parts by weight; a curing catalyst 0.01-10 parts by weight; a silane coupling agent 0.01-10 parts by weight; filler 3-60 parts by weight; and thermal stabilizer 0.01-5 parts by weight.
Abstract translation: 提供了一种用于半导体组件的接合膜组合物，用于防止在半导体的切割工艺中由摩擦发热引起的粘合膜的分离或卷曲。 用于半导体组合物的粘合膜组合物包含基于100.0重量份组合物的全固体，含有羟基，羧基或环氧基的-60重量份弹性体树脂; 5-60重量份的成膜树脂; 环氧树脂5-40重量份; 酚类环氧固化剂10-30重量份; 固化催化剂0.01-10重量份; 硅烷偶联剂0.01-10重量份; 填料3-60重量份; 和热稳定剂0.01-5重量份。
-
Patent Agency Ranking
公开(公告)号：KR1020090057687A
公开(公告)日：2009-06-08
申请号：KR1020070124378
申请日：2007-12-03
Applicant: 제일모직주식회사
IPC: C09J127/12 , C09J7/02 , C09J7/00
CPC classification number: C09J133/16 , C08L2312/06 , C09J7/385 , C09J2203/326
Abstract: A UV curable PSA(pressure-sensitive adhesive) composition is provided to ensure excellent pick-up property after UV curing and to improve tackiness, adhesive force with a base film and mechanical strength. A UV curable PSA(pressure-sensitive adhesive) composition comprises acrylic adhesive binder 100.0 parts by weight, a thermosetting material 0.5~10.0 parts by weight, and a photoinitiator 0.001~0.05 parts by weight. The acrylic adhesive binder includes a fluorine group. The acrylic adhesive binder is prepared by: mixing an acrylic monomer, an acrylate monomer having a hydroxyl group, an acrylate monomer having an epoxy group, an acrylate monomer having a fluorine group, then performing polymerization; and performing urethane addition of a hydroxyl group of a polymer base and an isocyanate group of a monomer having a vinyl group.
Abstract translation: 提供UV固化型PSA（压敏粘合剂）组合物，以确保UV固化后的优异的吸收性，并且改善粘合性，用基膜的粘合力和机械强度。 UV可固化PSA（压敏粘合剂）组合物包含丙烯酸粘合剂粘合剂100.0重量份，热固性材料0.5〜10.0重量份，光引发剂0.001〜0.05重量份。 丙烯酸类粘合剂粘合剂包括氟基。 丙烯酸粘合剂粘合剂通过以下方法制备：将丙烯酸单体，具有羟基的丙烯酸酯单体，具有环氧基的丙烯酸酯单体，具有氟基的丙烯酸酯单体混合，然后进行聚合; 并且进行聚合物基团的羟基和具有乙烯基的单体的异氰酸酯基团的氨基甲酸酯加成。
-
公开(公告)号：KR1020090042165A
公开(公告)日：2009-04-29
申请号：KR1020080103105
申请日：2008-10-21
Applicant: 제일모직주식회사
IPC: C08J5/18 , C08L33/14 , C08L63/00 , C09J133/08
CPC classification number: C09J163/00 , C08G59/621 , C08L33/08 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/04 , C09J133/08 , Y10T428/2848
Abstract: An adhesive composition for die bonding in semiconductor assembly is provided to satisfy heat resistance, wetproof property, resin mobility and minimization of insulation property by crack. An adhesive composition for die bonding in semiconductor assembly comprises acrylic polymer 10-85 weight% which contains cross-linkable epoxy radical having the epoxy equivalent of 1,000-10,000 and has the average molecular weight of 100,000-1,000,000; epoxy resin 5-40 weight% including multifunctional epoxy radical 5-40 weight%; phenol type hardened resin 5-40 weight%; curing catalyst 0.01-10 weight%; silane coupling agent 0.01-10 weight%; and filler 0.1-60 weight%.
Abstract translation: 提供半导体组件中用于芯片接合的粘合剂组合物，以满足耐热性，耐湿性，树脂迁移性和通过裂纹最小化绝缘性能。 用于半导体组件中的芯片粘合的粘合剂组合物包含10-85重量％的丙烯酸聚合物，其含有环氧当量为1,000-10,000的可交联的环氧基团，其平均分子量为100,000-1,000,000; 环氧树脂5-40重量％，包括多官能环氧基5-40重量％; 酚型硬化树脂5-40重量％; 固化催化剂0.01-10重量％; 硅烷偶联剂0.01-10重量％; 和填料0.1-60重量％。
-
公开(公告)号：KR1020080062642A
公开(公告)日：2008-07-03
申请号：KR1020060138677
申请日：2006-12-29
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/06 , C09J7/02 , C09J7/00
CPC classification number: C09J133/06 , C09J7/00 , C09J7/385 , C09J2203/326 , C09J2433/00
Abstract: An adhesive, adhesive composition containing the adhesive, and a dicing film formed by using the composition are provided to improve pick up property, UV transmissivity, elasticity and surface energy aging change. An adhesive is represented by the formula 1 and is prepared by the addition reaction of an acrylic copolymer binder obtained by copolymerizing at least one monomer selected from the group consisting of an acrylate having at least one hydroxyl group, an acrylate having at least one carboxyl group, a functional monomer, a soft acrylic monomer and a hard acrylic monomer, at least one kind of radiation curing acrylate having an epoxy group, and a radiation curing acrylate having at least one kind of isocyanate group, wherein R1 is at least one selected from 2-hydroxyethyl (meth)acrylate, hydroxybutyl acrylate, hydroxypropyl (meth)acrylate and vinyl caprolactam; R2 is at least one selected from 2-hydroxyethyl (meth)acrylate, hydroxybutyl acrylate, hydroxypropyl (meth)acrylate and vinyl caprolactam; and R3 is at least one selected from dimethylaminoethyl methacrylate, t-butylaminoethyl methacrylate, diethylaminoethyl methacrylate, acrylamide and glycidyl methacrylate.
Abstract translation: 提供含有粘合剂的粘合剂，粘合剂组合物和通过使用该组合物形成的切割膜以改善拾取性能，UV透射率，弹性和表面能老化变化。 粘合剂由式1表示，并且通过将至少一种选自具有至少一个羟基的丙烯酸酯，至少一个羧基的丙烯酸酯，至少一个羧基的丙烯酸酯共聚合得到的丙烯酸共聚物粘合剂的加成反应来制备 功能性单体，软质丙烯酸类单体和硬质丙烯酸类单体，至少一种具有环氧基的辐射固化丙烯酸酯和具有至少一种异氰酸酯基团的辐射固化丙烯酸酯，其中R1是选自以下的至少一种： （甲基）丙烯酸2-羟乙酯，丙烯酸羟丁酯，（甲基）丙烯酸羟丙酯和乙烯基己内酰胺; R2是选自（甲基）丙烯酸2-羟乙酯，丙烯酸羟丁酯，（甲基）丙烯酸羟丙酯和乙烯基己内酰胺中的至少一种; 并且R 3是选自甲基丙烯酸二甲基氨基乙酯，甲基丙烯酸叔丁基氨基乙酯，甲基丙烯酸二乙基氨基乙酯，丙烯酰胺和甲基丙烯酸缩水甘油酯中的至少一种。
-
公开(公告)号：KR1020080060608A
公开(公告)日：2008-07-02
申请号：KR1020060134920
申请日：2006-12-27
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J183/00 , C09J7/02
CPC classification number: C09J7/00 , C09J133/08 , C09J167/00 , C09J183/00 , C09J2203/326
Abstract: A radical curable adhesive film composition for semiconductor packaging is provided to reduce the time required for fabricating semiconductors by a cure skip process using radical polymerization. A radical curable adhesive film composition for semiconductor packaging comprises: a radical polymerizable elastomer resin; an adhesion enhancing crystalline polyester-based film-forming resin; a radical polymerizable resin; a radical polymerizable thermal initiator; a silane coupling agent; a filler; additives; and an organic solvent. The radical polymerizable elastomer resin is formed by bonding a (meth)acrylate monomer to an elastomer having a hydroxyl, carboxyl or epoxy group.
Abstract translation: 提供了用于半导体封装的自由基固化粘合剂膜组合物，以通过使用自由基聚合的固化跳过工艺来减少半导体制造所需的时间。 一种用于半导体封装的可自由基固化的粘合膜组合物，包括：可自由基聚合的弹性体树脂; 粘合增强结晶聚酯基成膜树脂; 可自由基聚合的树脂; 可自由基聚合的热引发剂; 硅烷偶联剂; 填料; 添加剂; 和有机溶剂。 可自由基聚合的弹性体树脂通过将（甲基）丙烯酸酯单体粘合到具有羟基，羧基或环氧基的弹性体而形成。
-
10.发明授权플라스마 디스플레이 패널 전극 형성용 감광성 조성물 및그에 의한 전극의 제조방법, 이를 이용한 플라즈마디스플레이 패널 有权用于等离子体显示面板和等离子体显示面板的总线ELCTRODE0的光敏组合物及其制造方法
公开(公告)号：KR100841205B1
公开(公告)日：2008-06-24
申请号：KR1020070069654
申请日：2007-07-11
Applicant: 제일모직주식회사
IPC: G03F7/004
CPC classification number: G03F7/0045 , G03F7/004 , G03F7/0047
Abstract: A photosensitive composition for an electrode, a method for preparing a plasma display panel by using the composition, and a plasma display panel prepared by the method are provided to improve precipitation stability and dispersion stability even at a low viscosity. A photosensitive composition for an electrode comprises 3-15 wt% of a black pigment; 5-40 wt% of an organic binder; 3-20 wt% of glass frit; 1-10 wt% of a photopolymerizable compound; 0.5-3 wt% of a photopolymerization initiator; 0.5-15 wt% of an alkyl ether-maleic anhydride-styrene copolymer having a molecular weight of 10,000-100,000 represented by the formula 1; and the balance of a solvent, wherein R is a C1-C20 alkyl group, an allyl group or a phenyl group; and m is 1-10.
Abstract translation: 提供一种用于电极的光敏组合物，通过使用该组合物制备等离子体显示面板的方法，以及通过该方法制备的等离子体显示面板，以提高即使在低粘度下的沉淀稳定性和分散稳定性。 用于电极的光敏组合物包含3-15重量％的黑色颜料; 5-40重量％的有机粘合剂; 3-20重量％的玻璃料; 1-10重量％的光聚合化合物; 0.5-3重量％的光聚合引发剂; 0.5-15重量％的由式1表示的分子量为10,000-100,000的烷基醚 - 马来酸酐 - 苯乙烯共聚物; 余量为溶剂，其中R为C1-C20烷基，烯丙基或苯基; m为1-10。
-
-
-
-
-
-
-
-
-
Search Results
77
records
(took 0.031 seconds)
