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公开(公告)号：KR1020090104505A
公开(公告)日：2009-10-06
申请号：KR1020080029954
申请日：2008-03-31
Applicant: 한국기계연구원
Abstract: PURPOSE: A micro thermoelectric conversion method for manufacturing module is provided to form the dummy pattern for a bonding and to enhance the bonding characteristic. CONSTITUTION: The micro thermoelectric conversion method for manufacturing module comprises as follows. The n-type semiconductor pattern is mutually faced to first substrate and the second substrate. The thermoelectric conversion element part(A) is formed by bonding the p-type semiconductor pattern and n-type semiconductor pattern serially by π-type. The dummy pattern for improving the bonding characteristic near the thermoelectric conversion element part of the first substrate or the second substrate is formed.
Abstract translation: 目的：提供一种用于制造模块的微型热电转换方法，以形成用于接合的虚拟图案，并提高接合特性。 构成：制造模块的微型热电转换方法如下。 n型半导体图案相互面对第一基板和第二基板。 热电转换元件部分（A）通过π型连接p型半导体图案和n型半导体图案而形成。 形成用于改善第一基板或第二基板的热电转换元件部分附近的接合特性的虚拟图案。
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公开(公告)号：KR100667217B1
公开(公告)日：2007-01-12
申请号：KR1020040116993
申请日：2004-12-30
Applicant: 한국기계연구원
IPC: G01Q40/00
Abstract: 본 발명은, 팁이 마련된 SPM 캔틸레버를 스캐너가 변위시키고, 위치 감응 검출기가 상기 SPM 캔틸레버에서 반사된 레이저광을 이용해 상기 SPM 캔틸레버의 변위량을 측정하도록 구성된 채 나노 구조물의 측정 및 조작에 이용되는 주사 탐침 현미경에 관한 것으로서, 종래의 SPM 장비에 쉽게 호환이 가능하면서(compatible) 손쉽게 그리고 정밀하게 SPM 캔틸레버의 강성 보정을 가능케 하는 장치를 제공하는 것을 목적으로 한다.
이를 위해, 본 발명에 주사 탐침 현미경의 보정장치는, 적어도 일 방향의 강성이 미리 결정되어지되, 상기 강성이 상기 SPM 캔틸레버에 의한 하중에 의해 일 방향으로 변위될 수 있도록 정해지는 보정용 구조물과, 상기 SPM 캔틸레버에 반사된 레이저광을 이용해 상기 SPM 캔틸레버의 변위량을 측정하는 위치 감응 검출기와, 자체의 변위량와 SPM 캔틸레버의 변위량 간의 차에 의해 상기 보정용 구조물의 변위량을 결정해주는 스캐너를 포함한다.
SPM, 캔틸레버, 팁, 보정, 강성, 위치 감응 검출기, 스캐너-
公开(公告)号：KR1020060087931A
公开(公告)日：2006-08-03
申请号：KR1020050008818
申请日：2005-01-31
Applicant: 한국기계연구원
Abstract: Disclosed herein is an apparatus for measuring adhesive and frictional properties of a polymer hemisphere relative to a contact plate provided in the apparatus. The apparatus comprise a body having a movable table installed to move along an X-axis and Y-axis and a vertical column positioned at a rear side of the movable table, a sample mount provided on the movable table and having a mirror to reflect surface images of a horizontal contact plate, a head assembly located at a front side of the column and having a polymer hemisphere used to press a surface of the contact plate to implement an adhesive force test, a camera device located at a front side of the mirror to capture the surface images of the contact plate during the adhesive force test, and a control device for analyzing various data inputted thereto during the adhesive force test.
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公开(公告)号：KR1020040103208A
公开(公告)日：2004-12-08
申请号：KR1020030035137
申请日：2003-05-31
Applicant: 한국기계연구원
Abstract: PURPOSE: A property measurement method of a thin film is provided to measure the property of the thin film by while minimizing the complexities of a sample preparation and a sample installation and the effect of a substrate. CONSTITUTION: A thin film is deposited on a substrate(100). The part of the substrate is removed in a circle or a square shape. The displacement and the load are precisely measured by performing an indentation test in the circle or the square thin film. The property of the thin film is calculated by applying the measured displacement and the load data to a theoretical formula. Thereby, the design of various products, the evaluation of the reliability and the quality of the product based on the thin film process are improved.
Abstract translation: 目的：提供一种薄膜的性质测量方法，以尽量减少样品制备和样品安装的复杂性以及基板的效果来测量薄膜的性质。 构成：薄膜沉积在基底（100）上。 将基板的一部分以圆形或正方形的形状去除。 通过在圆形或方形薄膜中进行压痕试验来精确地测量位移和载荷。 通过将测量的位移和载荷数据应用于理论公式来计算薄膜的性质。 因此，提高了各种产品的设计，基于薄膜工艺的产品的可靠性和质量的评估。
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Patent Agency Ranking
公开(公告)号：KR101796933B1
公开(公告)日：2017-11-13
申请号：KR1020150187272
申请日：2015-12-28
Applicant: 한국기계연구원
Abstract: 본발명은일측과타측의온도차에의해기전력을발생시키는열전소자에관한것으로, 더욱상세하게는열전소자의구성요소인 P형반도체와 N형반도체가소자의길이방향을따라형성된유연열전소자구조및 이의제조방법에관한것이다.
Abstract translation: 本发明涉及一侧和另一侧，更具体地说，被形成在器件热元件结构的纵向方向上的P型半导体和热电元件的N型半导体的弹性元件之间由温度差产生电动势的热电装置 及其制造方法。
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公开(公告)号：KR101408681B1
公开(公告)日：2014-07-02
申请号：KR1020130020626
申请日：2013-02-26
Applicant: 한국기계연구원
CPC classification number: G01N25/18 , G01M99/002 , H01L35/34
Abstract: The present invention relates to a method and an apparatus for measuring a non-contact seebeck coefficient of a thermoelectric material and, more specifically, to a method and an apparatus for measuring a non-contact seebeck coefficient, capable of measuring a precise seebeck coefficient of a thin film having a thickness thinner than one micrometer through a non-contact temperature measurement.
Abstract translation: 本发明涉及一种用于测量热电材料的非接触塞贝克系数的方法和装置，更具体地说，涉及一种用于测量非接触式贝贝系数的方法和装置，该方法和装置能够测量精确的塞贝克系数 通过非接触式温度测量，具有薄于一微米厚度的薄膜。
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公开(公告)号：KR1020100103079A
公开(公告)日：2010-09-27
申请号：KR1020090021510
申请日：2009-03-13
Applicant: 한국기계연구원
Abstract: PURPOSE: A thermoelectric conversion module is provided to increase a thermoelectric element by the thermoelectric element into a spring form. CONSTITUTION: A connecting electrode(13) of a thermoelectric conversion module(20) is formed in order to have a spring structure on a central part. The connecting electrode includes a junction part(13a) where a p-type semiconductor(1) and a n-type semiconductor(2) are contacted and a connection part(13b) which connects the junction parts to each other. The connection part has a spring structure into a zigzag shape.
Abstract translation: 目的：提供一种热电转换模块，用于通过热电元件将热电元件增加到弹簧形式。 构成：为了在中心部分具有弹簧结构，形成热电转换模块（20）的连接电极（13）。 连接电极包括p型半导体（1）和n型半导体（2）接触的接合部（13a）和将接合部彼此连接的连接部（13b）。 连接部分具有以Z字形形状的弹簧结构。
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公开(公告)号：KR1020100092159A
公开(公告)日：2010-08-20
申请号：KR1020090011392
申请日：2009-02-12
Applicant: 한국기계연구원 , 재단법인 서울테크노파크
CPC classification number: C25D17/06 , C25D7/12 , C25D17/007 , H01L21/687
Abstract: PURPOSE: An electroplating jig and an electrode pin for the same are provided to form a uniform plating layer on a work piece by supplying stable external current to the work piece. CONSTITUTION: An electroplating jig comprises a lower insulating member, an upper insulating member, a ring plate, and an electrode pin(900). The upper insulating member is connected to the lower insulating member and has and opening. The ring plate is inserted between the upper and the lower insulating member. The electrode pin is connected to the upper insulating member and comprises a pin body and first and second pin arms.
Abstract translation: 目的：提供一种电镀夹具和用于其的电极引脚，通过向工件提供稳定的外部电流，在工件上形成均匀的镀层。 构成：电镀夹具包括下绝缘构件，上绝缘构件，环形板和电极针（900）。 上绝缘构件连接到下绝缘构件并具有并打开。 环形板插入在上下绝缘构件之间。 电极针连接到上绝缘构件，并且包括销体和第一和第二销臂。
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