Abstract:
A semiconductor optoelectronic integrated circuit and a forming method thereof are provided to increase a degree of integration by arranging an optical active element on an optical grating of an optical waveguide. A semiconductor optoelectronic integrated circuit includes an optical waveguide(105), an optical grating(107), and an optical active element. The optical waveguide is arranged on a substrate. The optical waveguide includes an input terminal and an output terminal. The optical grating is formed on the optical waveguide. The optical active element is formed on the optical grating. The optical active element receives an optical signal from the optical waveguide through the optical grating. The optical active element modulates the received optical signal.
Abstract:
A semiconductor laser diode using change of an energy band structure is provided to raise an electric barrier through a critical value changing from type 1 to type 2. A semiconductor laser diode using change of an energy band structure includes an active layer, a cladding layer, a second compound semiconductor layer, and a third compound semiconductor layer. The active layer has a structure of a quantum well. The cladding layer is contacted to one side of the active layer, and is composed of a first compound semiconductor layer. The second compound semiconductor layer is contacted to the other end of the active layer, and forms an energy step for the active layer. The third compound semiconductor layer is inserted into the second semiconductor layer, and separates the second compound semiconductor layer to have a critical point having a non-conductive band energy step of "0" with the second compound semiconductor layer.
Abstract:
A method for etching a multi-layer of group III-V semiconductor materials and a method for manufacturing a vertical cavity surface emitting laser device are provided to obtain clearness and smoothness of an etched surface by etching the multi-layer with plasma of a mixed gas including Cl2, Ar, CH4, and H2. A first semiconductor layer(22) is formed with group III-V semiconductors. A second semiconductor layer(24) is formed with group III-V semiconductors that are different from the group III-V semiconductors of the first semiconductor layer. A method for etching a lamination structure including the first and second semiconductor layers includes a process for etching the lamination structure by exposing the lamination structure to plasma of a mixed gas including Cl2, Ar, CH4, and H2.
Abstract:
PURPOSE: A method for fabricating high power and high frequency(RF) high electron mobility transistor(HEMT) by quenching is provided to improve a contact characteristic and an electrical characteristic by improving the uniformity of the surface of a metal layer and adhesion on an interface between the metal layer and a semiconductor layer. CONSTITUTION: The first and second semiconductor layers that have different bandgap to form a heterojunction are sequentially formed on a substrate. A source/drain made of a multiple metal layer is formed on the second semiconductor layer. A heat treatment process is performed on the substrate having the source/drain to make an ohmic contact between the source/drain and the second semiconductor layer. The first quenching is performed on the resultant structure with no time delay. A gate made of a multiple metal layer is formed on the second semiconductor layer between the source/drain. A heat treatment process is performed on the substrate including the gate to make a Schottky contact between the gate and the semiconductor layer. The second quenching is performed on the resultant structure with no time delay.
Abstract:
Disclosed is s a multi-channel optical reception module. The module comprises; a bench; a first substrate which is arranged on one side of the bench and has grooves; optical fibers which are arranged inside the grooves of the first substrate and transfer an optical signal; a first lens which is arranged on the first substrate and collimates the optical signal; a second substrate which is separated from the first substrate and is arranged on the other side of the bench; an optical reception element which is arranged on the second substrate and receives the optical signal; a second lens which concentrates the optical signal on the optical reception element on the optical reception element; a mirror which reflects the optical signal between the first and second lenses; and a block which fixates the mirror to be tilted from a sidewall of the first substrate to the second substrate and has a penetration hole which transfers the optical signal between the first and second lenses without refraction.
Abstract:
According to an embodiment of the present invention, a wavelength division multiplexing (WDM) optical transmitter includes first to n^th optical transmitters which output first to n^th optical signals having different wavelengths; a wavelength multiplexer which generates an output optical signal by multiplexing the first to n^th optical signals; a tap coupler which receives the output optical signal, and which generates an optical signal for control based on a part of the output optical signal; a light receiving device for control which receives the optical signal for control, and which outputs an optical current based on the optical signal for control; and a controller which separately controls the first to n^th optical transmitters based on the optical current, wherein the controller includes a look-up table, sequentially detects driving conditions of the first to n^th optical transmitters, and stores the detected driving conditions in the look-up table.
Abstract:
PURPOSE: A hybrid-integrated optical waveguide platform with an optical transmission device and an optical active device and a fabrication method thereof are provided to bond a monitoring photodiode to an over-cladding layer of a planar lightwave circuit (PLC) via flip-chip bonding, of which a spot size is increased by reducing the line width of a core layer of an optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during the flip-chip bonding. CONSTITUTION: The optical waveguide platform (10) with hybrid-integrated an optical transmission device (30) and an optical active device comprises an optical waveguide region (20) formed by stacking an under-cladding layer (101), a core layer (102) and an over-cladding layer on a substrate (100); a trench (400) region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region. The optical transmitter device is mounted in the trench region and the optical active device is flip-bonded to the spot expanding region. A monitoring photodiode (40) is flip-chip bonded to the spot expanding region of the core layer of an optical waveguide.