公开(公告)号：US10438897B2

公开(公告)日：2019-10-08

申请号：US15753426

申请日：2016-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Siang Sin Foo ,  Hiromitsu Kosugi ,  Alejandro Aldrin A. Narag, II ,  Ravi Palaniswamy

IPC: H01L23/544 ,  H01L23/498 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01L33/62 ,  H01L21/48 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.

公开(公告)号：US20190135611A1

公开(公告)日：2019-05-09

申请号：US16241014

申请日：2019-01-07

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Phillip J. Bergeron ,  Brent D. Lunceford ,  John D. Geissinger ,  Douglas B. Gundel ,  Justine A. Mooney ,  Ravi Palaniswamy ,  Siang Sin Foo

IPC: B81B3/00 ,  B81C1/00

Abstract: A Micro Electrical Mechanical Systems (MEMS) article including a non-planar surface and a continuous film conforming to the non-planar surface is described. The continuous film includes a polymer layer disposed between two metal layers and is patterned to define one or more MEMS elements.

公开(公告)号：US10207916B2

公开(公告)日：2019-02-19

申请号：US15306569

申请日：2015-05-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Phillip J. Bergeron ,  Brent D. Lunceford ,  John D. Geissinger ,  Douglas B. Gundel ,  Justine A. Mooney ,  Ravi Palaniswamy ,  Siang Sin Foo

IPC: B81B3/00 ,  B81C1/00

Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

公开(公告)号：US20170073215A1

公开(公告)日：2017-03-16

申请号：US15306569

申请日：2015-05-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Phillip J. Bergeron ,  Brent D. Lunceford ,  John D. Geissinger ,  Douglas B. Gundel ,  Justine A. Mooney ,  Ravi Palaniswamy ,  Siang Sin Foo

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2207/053 ,  B81C1/00182

Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

Abstract translation: 描述了包括一个或多个MEMS元件和包括柔性膜的制品的柔性膜。 柔性膜包括在两个金属层之间的聚合物层，其中一个金属层包含穿孔。 聚合物层包括允许两个金属层的相对运动的空隙区域。

公开(公告)号：US20240372301A1

公开(公告)日：2024-11-07

申请号：US18284594

申请日：2022-03-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Chin Hua Lim ,  Saujit Bandhu ,  YunLong Qiao ,  Kok Hoe Lee ,  Siang Sin Foo

IPC: H01R13/6583 ,  H01R12/70 ,  H01R12/73 ,  H01R13/627 ,  H01R13/633 ,  H01R13/6594

Abstract: A connector assembly, configured to mate with a mating connector along a mating direction, includes a circuit board, at least one cable, an insulative housing, an electrically conductive unitary shield, a pull tab, and a retention feature. The cable includes a plurality of conductors having front ends terminated at conductive pads of the circuit board. The housing is tightly overmolded around at least a portion of the circuit board. A mating end of the circuit board extends forwardly from a mating face of the housing. The shield includes a top wall extending between a back end and a front end thereof. The pull tab is rotatably attached to the shield near a front end of a top wall of the shield. The retention feature of the shield engages a corresponding retention feature of the mating connector to prevent the connector assembly from unmating from the mating connector.

公开(公告)号：US20170290212A1

公开(公告)日：2017-10-05

申请号：US15626373

申请日：2017-06-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agacaoili Narag ,  Siang Sin Foo ,  Fong Liang Tan ,  Wei Meng Pee ,  Andrew J. Ouderkirk ,  Justine A. Mooney

IPC: H01L23/498 ,  H01L33/62

CPC classification number: H01L23/4985 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/49872 ,  H01L24/17 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/10106

Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.

公开(公告)号：US09564568B2

公开(公告)日：2017-02-07

申请号：US14859512

申请日：2015-09-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney

IPC: H05K1/02 ,  H01L33/64 ,  H01L33/48 ,  H01L23/00 ,  H01L33/60 ,  H01L33/62 ,  H05K1/18

CPC classification number: H01L33/647 ,  H01L24/17 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物电介质层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。