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公开(公告)号:DE4340001A1
公开(公告)日:1995-06-01
申请号:DE4340001
申请日:1993-11-24
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD
IPC: B22C9/04
Abstract: A mould is mfd. by the following process: a) mixing of a dross; b) incorporation of an organic binder in said dross; c) immersion of a wax model in the resulting applicable substance; d) deposition of solid particles from the applicable substance in layers onto the wax model; e) removal of the coated wax model from the applicable substance; f) repetition of steps c), d) and e) until a multi-layer coating of the required thickness is achieved; g) drying of the coated wax model; h) removal of the wax model from the multi-layer, unfinished mould by melting; and i) sintering the unfinished mould to give the finished product. Also claimed is a mould mfd. by the claimed process.
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公开(公告)号:PL182552B1
公开(公告)日:2002-01-31
申请号:PL34435196
申请日:1996-12-02
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD
Abstract: A method of applying a metallic bonding layer for thermally sprayed ceramic heat insulating layers (6) on metallic components involves (a) applying a binder onto the degreased and oxide-free metallic surface of the substrate material (2); (b) applying metallic bonding powder (4) uniformly onto the binder; (c) applying solder powder (5), of smaller particle size than the bonding powder (4), uniformly onto the binder; and (d) drying the binder and heat treating to effect soldering. In an alternative method, an oxidation and corrosion resistant layer is produced on the cleaned metallic surface by gas-shielded plasma spraying prior to step (a), the bonding powder is a coarse powder having the same composition as this oxidation and corrosion resistant layer, step (c) is omitted and step (d) comprises drying the binder and then heat treating (solution annealing) to form a sintered bond between the metallic component and the oxidation and corrosion resistant layer and between the oxidation and corrosion resistant layer and the bonding powder. Also claimed are metallic bonding layers produced by the above methods.
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公开(公告)号:DE19808025A1
公开(公告)日:1999-09-02
申请号:DE19808025
申请日:1998-02-26
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD , SKINDHOJ JORGEN , VEENSTRA MARTIN , ETTER PETER
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公开(公告)号:HU9503704D0
公开(公告)日:1996-02-28
申请号:HU9503704
申请日:1995-12-21
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD , ERNST PETER
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公开(公告)号:DE4322085A1
公开(公告)日:1995-01-12
申请号:DE4322085
申请日:1993-07-02
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD
Abstract: This method for the production of a moulding from a powder material comprises the following steps: a) introduction of the powder material into a rough mould, b) compaction of the material by mechanical tapping, c) presintering of the blank in the rough mould, d) removal of the blank from the rough mould, e) machining of the blank and f) shot-blasting of the blank g) final sintering of the blank to give the definitive moulding. With this method for the production of a moulding from a powder material, the energy consumption for the sintering process can be kept at an advantageously low level while maintaining the same quality of surface finish of the moulding.
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公开(公告)号:DE4322083A1
公开(公告)日:1995-01-12
申请号:DE4322083
申请日:1993-07-02
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD , ERNST PETER DR
Abstract: This method for the production of a moulding from a powder material comprises the following steps: a) introduction of the powder material into a rough mould, b) compaction of the material by mechanical tapping, c) presintering of the blank in the rough mould, d) removal of the blank from the rough mould, e) machining of the blank and f) final sintering of the blank to give the definitive moulding. The fully sintered moulding no longer requires to be finished. In this method, the effect of shrinkage during final sintering is kept small and this is advantageous.
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公开(公告)号:DE19542162C2
公开(公告)日:2000-11-23
申请号:DE19542162
申请日:1995-11-11
Applicant: ABB RESEARCH LTD
Inventor: BAIATU TUDOR , ETTER PETER , FRIED REINHARD , WIESMANN HANS JUERG
Abstract: The current limiting device is formed by a pair of zig zag shaped PTC resistors (1,2) that are placed in parallel and are separated by an insulating layer. Electrical connection points (A,B) are formed at each end. The reactive layers can be formed in a foil using a chemical or electro-chemical process. The layers may be located in grooves formed in a thermally cooling material that has flow channels through which a cooling fluid flows.
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公开(公告)号:DE19709607A1
公开(公告)日:1998-09-10
申请号:DE19709607
申请日:1997-03-08
Applicant: ABB RESEARCH LTD
Inventor: ERNST PETER DR , FALLER KURT , FRIED REINHARD
Abstract: The guide blade has a cavity (18) under low pressure, e.g. connected directly to the condenser, inside it, and has an aperture (3) for fluid suction in the region of its rear edge. This aperture has a porous cover (7) with capillaries which are filled with the fluid being sucked during operation. The porous cover is anchored in the blade by a mechanical fixing element (20) in the form of a spring-loaded quick lock. It consists of a bush (21) which locates the cover in the blade aperture. The cylindrical part (24) projects into the blade cavity. A movable mandrel (25) in the bush is loaded by a spring (26) and has a cap (28) on the inner wall of the blade.
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19.
公开(公告)号:CZ9603468A3
公开(公告)日:1997-08-13
申请号:CZ346896
申请日:1996-11-26
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD
CPC classification number: C23C28/00 , C23C4/02 , Y10T428/12028 , Y10T428/12056 , Y10T428/12063 , Y10T428/12097
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20.
公开(公告)号:CA2188614A1
公开(公告)日:1997-06-03
申请号:CA2188614
申请日:1996-10-23
Applicant: ABB RESEARCH LTD
Inventor: FRIED REINHARD
Abstract: In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings (6) to metallic components (1), the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder (3) is applied to the metallic surface of the base material (2) in a second process step. Metallic adhesive powder (4) is applied uniformly to the binder (3) in a third process step and solder powder (5), which has a smaller particle size than the adhesive powder (4), is applied uniformly to the binder (3) in a fourth process step. After drying the binder (3), a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings (6) which are to be sprayed thereon.
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