1.
    发明专利
    未知

    公开(公告)号:DE59611245D1

    公开(公告)日:2005-08-18

    申请号:DE59611245

    申请日:1996-07-26

    Abstract: The module includes at least one semiconductor chip (2) provided with its respective main electrode pair (2,4). One electrode is provided on a ground plate (5) and the other is in contact with a plunger (8). Also provided are two main connectors (6,7) with the ground plate electrically connected to one of the connectors (6) and the plunger in contact with the other (7). The position of each plunger corresponds to the distance between the contacting electrode of each chip to the corresponding main connector. The plungers are installed between the electrode and connector and are held there by two solder layers (9,10).

    3.
    发明专利
    未知

    公开(公告)号:DE19709607A1

    公开(公告)日:1998-09-10

    申请号:DE19709607

    申请日:1997-03-08

    Abstract: The guide blade has a cavity (18) under low pressure, e.g. connected directly to the condenser, inside it, and has an aperture (3) for fluid suction in the region of its rear edge. This aperture has a porous cover (7) with capillaries which are filled with the fluid being sucked during operation. The porous cover is anchored in the blade by a mechanical fixing element (20) in the form of a spring-loaded quick lock. It consists of a bush (21) which locates the cover in the blade aperture. The cylindrical part (24) projects into the blade cavity. A movable mandrel (25) in the bush is loaded by a spring (26) and has a cap (28) on the inner wall of the blade.

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