公开(公告)号：EP1730600A4

公开(公告)日：2010-07-28

申请号：EP05724288

申请日：2005-03-02

Applicant: ADVANCED TECH MATERIALS

Inventor： RATH MELISSA K ,  BERNHARD DAVID D ,  MINSEK DAVID ,  KORZENSKI MICHAEL B ,  BAUM THOMAS H

IPC: G03F7/32 ,  A61K31/44 ,  C11D1/62 ,  G03F7/42

CPC classification number: C11D3/044 ,  C11D3/30 ,  C11D3/3947 ,  C11D7/06 ,  C11D11/0047 ,  G03F7/423 ,  G03F7/425

公开(公告)号：EP1488286A4

公开(公告)日：2005-09-28

申请号：EP03714254

申请日：2003-03-18

Applicant: ADVANCED TECH MATERIALS

Inventor： SEIJO MA FATIMA ,  WOJTCZAK WILLIAM A ,  BERNHARD DAVID ,  BAUM THOMAS H ,  MINSEK DAVID

IPC: C11D7/10 ,  C11D7/22 ,  C11D7/26 ,  C11D7/28 ,  C11D7/32 ,  C11D11/00 ,  C23G1/02 ,  G03F7/42 ,  H01L21/02 ,  H01L21/28 ,  H01L21/304 ,  H01L21/306 ,  H01L21/308 ,  H01L21/311 ,  H01L21/316 ,  H01L21/3213 ,  H01L21/768 ,  C23G1/06 ,  C23G1/14 ,  C23G1/18 ,  C23G5/00 ,  C23G5/02 ,  C23G5/032 ,  C23G5/036

CPC classification number: H01L21/02063 ,  C11D7/265 ,  C11D7/28 ,  C11D11/0047 ,  G03F7/425 ,  H01L21/02071

Abstract: A semi-aqueous cleaning formulation useful for removing particles from semiconductor wafer substrates formed during a dry etching process for semiconductor devices, the cleaning formulation comprising a buffering system a polar organic solvent, and a fluoride source.