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    BUTTON INTEGRATION FOR AN ELECTRONIC DEVICE
    11.
    发明申请
    BUTTON INTEGRATION FOR AN ELECTRONIC DEVICE 审中-公开
    用于电子设备的按钮集成

    公开(公告)号：WO2016039787A1

    公开(公告)日：2016-03-17

    申请号：PCT/US2014/066754

    申请日：2014-11-21

    Applicant: APPLE INC.

    Inventor： SHUKLA, Ashutosh Y. ,  CATER, Tyler B. ,  COHEN, Sawyer I. ,  HUO, Edward S. ,  PAKULA, David A. ,  BUSTLE, Benjamin Shane ,  SHAH, Dhaval N. ,  ZHANG, Yaocheng ,  KATIYAR, Vivek

    IPC: H01H13/704 ,  H01H13/48

    CPC classification number: H01H13/704 ,  H01H2213/00 ,  H01H2215/006 ,  H01H2223/002

    Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.

    Abstract translation: 本申请涉及与便携式电子设备一起使用的各种按钮相关实施例。 在一些实施例中，卡扣夹可以与按钮支架集成，以节省空间，其中两个单独的支架将占据便携式电子装置中太多的空间。 在其他实施例中，触觉开关可以通过在触觉开关组件顶部焊接聚合物层来防水。 以这种方式，可以防止水与触觉开关组件的湿气敏感部件接触。 将聚合物层连接到触觉开关的焊接可以包括围绕触觉开关组件的被捕获的气体的至少一个间隙，以在由各种操作和/或组装操作引起的热偏移期间进入和离开。

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    14.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4092507A3

    公开(公告)日：2023-02-08

    申请号：EP22183352.8

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: G06F1/16 ,  G06F3/01 ,  G06F3/0354 ,  H01L41/113 ,  G06K9/00

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    16.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4456704A2

    公开(公告)日：2024-10-30

    申请号：EP24200008.1

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: H10N30/20

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    19.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4456704A3

    公开(公告)日：2025-01-08

    申请号：EP24200008.1

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: G06F1/16 ,  G06F3/01 ,  G06F3/0354 ,  G06V40/12

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    20.
    发明公开
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开

    公开(公告)号：EP4092507A2

    公开(公告)日：2022-11-23

    申请号：EP22183352.8

    申请日：2017-07-24

    Applicant: Apple Inc.

    Inventor： BROWNING, Lucy Elizabeth ,  POPE, Benjamin J. ,  LEUTHEUSER, Paul U. ,  MYERS, Scott A. ,  DINH, Richard Hung Minh ,  HUO, Edward S.

    IPC: G06F1/16 ,  G06F3/01 ,  G06F3/0354 ,  H01L41/113 ,  G06K9/00

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

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