公开(公告)号：EP4468834A3

公开(公告)日：2025-03-12

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：EP4468834A2

公开(公告)日：2024-11-27

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：EP3956941A1

公开(公告)日：2022-02-23

申请号：EP20722982.4

申请日：2020-04-16

Applicant: Apple Inc.

Inventor： PERKINS, Ryan C. ,  SANO, Tatsuya ,  WALTON, Christopher J. ,  WANG, Erik L. ,  WERNER, Christopher M. ,  ASHCROFT, Anthony M. ,  DE JONG, Erik G. ,  HUNTER, Tirshathah A. ,  KIM, Seul Bi ,  CROSBY, Justin D. ,  JUNG, Woojin ,  SCHAEVITZ, Samuel B. ,  AVENDAL, Johan ,  DA COSTA BRAS LIMA, Eduardo Jorge ,  DI NALLO, Carlo ,  NATH, Jayesh ,  PAPANTONIS, Dimitrios ,  GRAHAM, Christopher S. ,  THOMPSON, Paul J. ,  COPELAND, Devon K. ,  ELY, Colin M.

IPC: H01Q1/22 ,  H01Q3/26 ,  G01S3/14 ,  G01S5/02 ,  H04W4/029 ,  H01Q1/38 ,  H01Q21/30 ,  H01Q1/24 ,  G08B13/24 ,  E05B73/00

公开(公告)号：EP3454413A1

公开(公告)日：2019-03-13

申请号：EP18191231.2

申请日：2018-08-28

Applicant: Apple Inc.

Inventor： PANDYA, Sameer ,  MARTINIS, Mario ,  OZGEN, Baris ,  BUSHNELL, Tyler S. ,  TANG, Sherry ,  YANG, Henry H. ,  WERNER, Christopher M. ,  NATH, Jayesh ,  DI NALLO, Carlo ,  RUARO, Andrea

IPC: H01Q1/24 ,  H01Q1/27 ,  G04R60/12

Abstract: Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.

公开(公告)号：EP3005849A1

公开(公告)日：2016-04-13

申请号：EP14807212.7

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： JARVIS, Daniel W. ,  DINH, Richard Hung Minh ,  CHRISTOPHY, Miguel C. ,  XU, Hao ,  NATH, Jayesh ,  KOLE, Jared M. ,  PASCOLINI, Mattia ,  CABALLERO, Ruben ,  EDWARDS, Jennifer M. ,  BEVELACQUA, Peter I. ,  SCHLUB, Robert W.

IPC: H05K5/02 ,  H04B1/38

CPC classification number: H04M1/026 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1698 ,  H01Q1/2266 ,  H01Q1/243 ,  H01Q1/44 ,  H04B1/3888 ,  H04M1/0249

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.