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公开(公告)号：WO2019050682A1
公开(公告)日：2019-03-14
申请号：PCT/US2018/047497
申请日：2018-08-22
Applicant: APPLE INC.
Inventor： RUARO, Andrea , DI NALLO, Carlo , DA COSTA BRAS LIMA, Eduardo, Jorge , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , WANG, Zheyu , PANDYA, Sameer
Abstract: An electronic device such as a wristwatch may have a housing with metal sidewalls and a display having conductive display structures. Printed circuits having corresponding ground traces may be coupled to the display for conveying data to and/or from the display. The conductive display structures may be separated from the metal sidewalls by a gap. A conductive interconnect may be coupled to the metal sidewalls and may extend across the gap to the conductive display structures. The conductive interconnect may be coupled to the ground traces on the printed circuits and/or may be shorted or capacitively coupled to the conductive display structures. When configured in this way, the metal sidewalls, the conductive display structures, and the conductive interconnect may define the edges of a slot antenna resonating element for a slot antenna.
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公开(公告)号：WO2018013573A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/041545
申请日：2017-07-11
Applicant: APPLE INC.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括限定第一界面表面的第一导电部件，界定面向第一界面表面的第二界面表面的第二导电部件以及界定第一和第二界面表面之间的接合结构。 接合结构包括形成壳体的外表面的一部分的模制元件以及在第一和第二导电部件之间形成防水密封的密封部件。 还公开了形成电子设备外壳的方法。
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Patent Agency Ranking
公开(公告)号：EP4050429A1
公开(公告)日：2022-08-31
申请号：EP21211152.0
申请日：2021-11-29
Applicant: Apple Inc.
Inventor： DE JONG, Erik G. , MU, Junlin , PANDYA, Sameer , CROWLEY, Patrick J. , HERRERA, Antonio , HORIUCHI, James G. , TANG, Sherry , MARTINIS, Mario
Abstract: A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.
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公开(公告)号：EP3420710A1
公开(公告)日：2019-01-02
申请号：EP17749239.4
申请日：2017-07-11
Applicant: Apple Inc.
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公开(公告)号：EP3454413A1
公开(公告)日：2019-03-13
申请号：EP18191231.2
申请日：2018-08-28
Applicant: Apple Inc.
Inventor： PANDYA, Sameer , MARTINIS, Mario , OZGEN, Baris , BUSHNELL, Tyler S. , TANG, Sherry , YANG, Henry H. , WERNER, Christopher M. , NATH, Jayesh , DI NALLO, Carlo , RUARO, Andrea
Abstract: Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.
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公开(公告)号：EP4468834A3
公开(公告)日：2025-03-12
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：EP4468834A2
公开(公告)日：2024-11-27
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
IPC: H05K7/18
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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