公开(公告)号：WO2018013573A1

公开(公告)日：2018-01-18

申请号：PCT/US2017/041545

申请日：2017-07-11

Applicant: APPLE INC.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括限定第一界面表面的第一导电部件，界定面向第一界面表面的第二界面表面的第二导电部件以及界定第一和第二界面表面之间的接合结构。 接合结构包括形成壳体的外表面的一部分的模制元件以及在第一和第二导电部件之间形成防水密封的密封部件。 还公开了形成电子设备外壳的方法。

公开(公告)号：EP3420710A1

公开(公告)日：2019-01-02

申请号：EP17749239.4

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

公开(公告)号：EP4468834A3

公开(公告)日：2025-03-12

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：EP4468834A2

公开(公告)日：2024-11-27

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.