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公开(公告)号：WO2018013573A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/041545
申请日：2017-07-11
Applicant: APPLE INC.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括限定第一界面表面的第一导电部件，界定面向第一界面表面的第二界面表面的第二导电部件以及界定第一和第二界面表面之间的接合结构。 接合结构包括形成壳体的外表面的一部分的模制元件以及在第一和第二导电部件之间形成防水密封的密封部件。 还公开了形成电子设备外壳的方法。
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公开(公告)号：WO2015048788A1
公开(公告)日：2015-04-02
申请号：PCT/US2014/058427
申请日：2014-09-30
Applicant: APPLE INC.
Inventor： GABLE, Brian M. , WRIGHT, James A. , KUEHMANN, Charles J. , DEMERS, Brian , YOUNG, Chune-Ching , CHIANG, Chun-Hsien
IPC: C22C21/10
Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt% ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.
Abstract translation: 本公开提供了一种铝合金，其包括具有不同范围的合金元素。 在各个方面，合金的Zn与Mg的重量％比为4:1至7:1。 本公开还包括用于生产铝合金的方法和包含铝合金的制品。
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Patent Agency Ranking
公开(公告)号：EP3420710A1
公开(公告)日：2019-01-02
申请号：EP17749239.4
申请日：2017-07-11
Applicant: Apple Inc.
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公开(公告)号：EP3798326A1
公开(公告)日：2021-03-31
申请号：EP20195946.7
申请日：2020-09-14
Applicant: Apple Inc.
Inventor： SASSAMAN, Katie L. , GABLE, Brian M. , JOU, Herng Jeng , HUANG, Weiming , YURKO, James A.
Abstract: The disclosure is directed to aluminum alloys made from recycled components. The alloys have copper (Cu) from 0.051 to 0.10 wt%, chromium (Cr) from 0.01 to 0.10 wt%, zinc (Zn) from 0.02 to 0.20 wt%, manganese (Mn) from 0.03 to 0.10 wt%, iron (Fe) in an amount of at least 0.10 wt%, silicon (Si) in an amount of at least 0.35 wt%, magnesium (Mg) in amount of at least 0.45 wt%, and the remaining wt% being Al and incidental impurities. In other aspects, the disclosure is directed to aluminum alloys having copper (Cu) from 0.010 to 0.050 wt%, chromium (Cr) from 0.01 to 0.10 wt%, zinc (Zn) from 0.01 to 0.20 wt%, manganese (Mn) from 0.03 to 0.10 wt%, iron (Fe) in an amount of at least 0.10 wt%, silicon (Si) in an amount of at least 0.35 wt%, magnesium (Mg) in amount of at least 0.45 wt%, and the remaining wt% being Al and incidental impurities. The b* color of the alloys ranges from -2 to 2, and the L* color ranges from 70 to 100.
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公开(公告)号：EP3052668A1
公开(公告)日：2016-08-10
申请号：EP14789666.6
申请日：2014-09-30
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , WRIGHT, James A. , KUEHMANN, Charles J. , DEMERS, Brian , YOUNG, Chune-Ching , CHIANG, Chun-Hsien
IPC: C22C21/10
Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt % ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.
Abstract translation: 本公开内容提供了包括具有不同范围的合金元素的铝合金。 在各个方面，合金的Zn与Mg的重量比为4:1至7:1。 本公开还包括用于生产铝合金的方法和包含铝合金的制品。
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公开(公告)号：EP4468834A3
公开(公告)日：2025-03-12
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：EP4468834A2
公开(公告)日：2024-11-27
申请号：EP24206651.2
申请日：2017-07-11
Applicant: Apple Inc.
Inventor： GABLE, Brian M. , DI NALLO, Carlo , ELY, Colin M. , HORTON, Craig A. , DE JONG, Erik G. , ROTHKOPF, Fletcher R. , WETTERSTEN, Henry B. , LI, Hoishun , SAUERS, Jason C. , NATH, Jayesh , MARTINIS, Mario , PASCOLINI, Mattia , COLEMAN, Michael P. , EHMAN, Rex T. , WANG, Zheyu
IPC: H05K7/18
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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