公开(公告)号：NL1036179A1

公开(公告)日：2009-05-25

申请号：NL1036179

申请日：2008-11-10

Applicant: ASML NETHERLANDS BV

Inventor： EDART REMI DANIEL MARIE ,  BIJNEN FRANCISCUS GODEFRIDUS CASPER ,  PELLENS RUDY JAN MARIA ,  MAURY PASCALE ANNE

IPC: G03F9/00 ,  G03F7/20 ,  H01L21/68

公开(公告)号：SG145753A1

公开(公告)日：2008-09-29

申请号：SG2008061210

申请日：2006-09-20

Applicant: ASML NETHERLANDS BV

Inventor： BIJNEN FRANCISCUS GODEFRIDUS CASPER ,  WEENINK WILLEM DIETER

Abstract: CONTACTS TO MICRODEVICES Provided are microdevices, e.g. integrated circuits, with contact bumps and processes for making the same. The microdevices may have contact bumps on two or more sides of the microdevices. Also provided are stacks of microdevices.

公开(公告)号：SG155856A1

公开(公告)日：2009-10-29

申请号：SG2009018151

申请日：2009-03-10

Applicant: ASML NETHERLANDS BV

Inventor： WARNAAR PATRICK ,  BIJNEN FRANCISCUS GODEFRIDUS CASPER

Abstract: A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.

公开(公告)号：NL1036476A1

公开(公告)日：2009-08-04

申请号：NL1036476

申请日：2009-01-28

Applicant: ASML NETHERLANDS BV

Inventor： BIJNEN FRANCISCUS GODEFRIDUS CASPER ,  TENNER MANFRED GAWEIN ,  WARNAAR PATRICK ,  KEMENADE MARC VAN

IPC: G03F9/00 ,  H01L23/544