公开(公告)号：EP3646105A1

公开(公告)日：2020-05-06

申请号：EP18779843.4

申请日：2018-08-31

Applicant: Apple Inc.

Inventor： MEURSING, Marinus ,  POORE, Killian J. ,  OLSON, Jeffrey C. ,  ROTHKOPF, Fletcher R. ,  SAUERS, Jason C.

IPC: G02B27/01 ,  G02C3/00

公开(公告)号：EP4468834A3

公开(公告)日：2025-03-12

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：EP4468834A2

公开(公告)日：2024-11-27

申请号：EP24206651.2

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： GABLE, Brian M. ,  DI NALLO, Carlo ,  ELY, Colin M. ,  HORTON, Craig A. ,  DE JONG, Erik G. ,  ROTHKOPF, Fletcher R. ,  WETTERSTEN, Henry B. ,  LI, Hoishun ,  SAUERS, Jason C. ,  NATH, Jayesh ,  MARTINIS, Mario ,  PASCOLINI, Mattia ,  COLEMAN, Michael P. ,  EHMAN, Rex T. ,  WANG, Zheyu

IPC: H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：EP4242731A3

公开(公告)日：2023-11-22

申请号：EP23182199.2

申请日：2018-08-31

Applicant: Apple Inc.

Inventor： MEURSING, Marinus ,  POORE, Killian J. ,  OLSON, Jeffrey C. ,  ROTHKOPF, Fletcher R. ,  SAUERS, Jason C.

IPC: G02B27/01 ,  G02C3/00

Abstract: A head-mounted display to be worn by a user includes a housing, and an eye chamber to be positioned adjacent to eyes of the user. A support assembly includes a headband and an adjustment mechanism that is operable to change fit of the headband relative to the head of the user in response to a control signal, wherein the adjustment mechanism includes a feedback component, and the control signal is generated based on output from the feedback component.

公开(公告)号：EP3914957A1

公开(公告)日：2021-12-01

申请号：EP20722053.4

申请日：2020-04-01

Applicant: Apple Inc.

Inventor： TAO, Jia ,  ZIMMERMAN, Aidan N. ,  HOBSON, Phil M. ,  FRANKLIN, Jeremy C. ,  MARIC, Ivan S. ,  SAUERS, Jason C. ,  QUIJALVO, Jan K. ,  VERGO, Eric N.

IPC: G02B27/01

公开(公告)号：EP3901688A2

公开(公告)日：2021-10-27

申请号：EP21167896.6

申请日：2021-04-12

Applicant: Apple Inc.

Inventor： MARIC, Ivan S. ,  ZIMMERMANN, Aidan N. ,  BAILLARGEON, Brian ,  CHRISTENSEN, Evan D. ,  SAUERS, Jason C. ,  TAO, Jia ,  HOBSON, Phil M. ,  SELVAKUMAR, Sivesh

IPC: G02B27/01

Abstract: A head-mounted device may have a head-mounted housing. The housing may include a chassis with left and right openings that overlap respective left and right optical modules that present images eye boxes. Each optical module may have a lens and display that presents an image through the lens. The chassis may have an inner frame and outer frame. A middle portion of the chassis may form a stiffened nose bridge structure. Components in the housing such as a display, a fan housing, a heat sink layer, optical module guide rods, and a rear cover may span the width of the housing and may be attached to edge portions of the chassis, thereby forming a box-shaped structure that provides rigidity and helps prevent housing deformation.

公开(公告)号：EP3625613A1

公开(公告)日：2020-03-25

申请号：EP18773696.2

申请日：2018-08-31

Applicant: Apple Inc.

Inventor： SAUERS, Jason C. ,  HOBSON, Phil M. ,  HUO, Edward S. ,  ROTHKOPF, Fletcher R.

IPC: G02B27/01

公开(公告)号：EP4204890A2

公开(公告)日：2023-07-05

申请号：EP21755161.3

申请日：2021-07-16

Applicant: Apple Inc.

Inventor： MARIC, Ivan S. ,  ZIMMERMAN, Aidan N. ,  SAUERS, Jason C. ,  TAO, Jia ,  CAMP, John S. ,  HOBSON, Phil M. ,  SMITH, Jacob L. ,  CHRISTENSEN, Evan D.

IPC: G02B27/01 ,  G02B7/12

公开(公告)号：EP3914961A1

公开(公告)日：2021-12-01

申请号：EP20736889.5

申请日：2020-06-18

Applicant: Apple Inc.

Inventor： MARIC, Ivan S. ,  WEBER, Andreas G. ,  MIRABELLA, Anna V. ,  SHAFFER, Benjamin A. ,  WANG, Forrest C. ,  SAUERS, Jason C. ,  FRANKLIN, Jeremy C. ,  HOENIG, Julian ,  JAEDE, Julian ,  BAUERLY, Kristi E. ,  DEY, Stephen E. ,  LIN, Wey-Jiun

IPC: G02C9/00 ,  G02B27/01

公开(公告)号：EP3785065A1

公开(公告)日：2021-03-03

申请号：EP18786474.9

申请日：2018-09-18

Applicant: Apple Inc.

Inventor： HUO, Edward S. ,  SCHMUCK, David A. ,  SAUERS, Jason C. ,  GROSS, Kevin A.

IPC: G02B27/01 ,  G06F3/01 ,  H04N13/383