15.
    发明专利
    未知

    公开(公告)号:AT264368T

    公开(公告)日:2004-04-15

    申请号:AT01945306

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

    Antistatic polyoxymethylene molding compounds

    公开(公告)号:AU6756001A

    公开(公告)日:2002-01-08

    申请号:AU6756001

    申请日:2001-06-22

    Applicant: BASF AG

    Abstract: The invention relates to thermoplastic molding compounds, comprising at least (A) 10 to 99.99 wt.-% of a polyoxymethylene homopolymer or copolymer, at least (B) 0.01 to 5 wt.-% of a polyethylenimine homopolymer or copolymer, at least (C) 0.1 to 15 wt.-% of a polyalkylene glycol or polyalkylene glycolamine or the mixtures thereof, (D) 0 to 70 wt.-% of further additives, whereby the sum of the weight percentages of components (A) to (D) always adds up to 100%.

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