Adhesive film for bonding thermoplastic moulded parts - consists of thermoplastic polymer film contg. liq. which swells but does not dissolve polymer and lowers its Tg by more than 20 deg. C

    公开(公告)号:DE3924484A1

    公开(公告)日:1991-01-31

    申请号:DE3924484

    申请日:1989-07-25

    Applicant: BASF AG

    Abstract: Adhesive film (I) is based on a thermoplastic polymer (II) and contains 1-50 wt.% of a liq. (III) which swells but does not dissolve (II) and lowers its Tg by more than 20 deg.C. (II) is a polyether-sulphone, polyamide, polycarbonate, polyether-e or thermoplastic polyurethane; (I) is 20-2000 microns thick and contains reinforcing fibres and/or metal ply. USE/ADVANTAGE - (I) is useful for bonding moulded parts of thermoplastics. Bonding such moulded parts comprises placing (I) (based on the same polymer as the parts) between the parts and pressing the assembly together at a temp. below the Tg of the pure polymer but above the Tg of the swollen polymer; pref. the pressure applied is higher than the vapour pressure of (III) at the test temp.. Suitable (III) are, e.g. MEK, acetone, CH2Cl2 (for polyether-sulphone); water/ethanol or water/ethanol/ketone (for polyamide 6, 66, 6/66 etc.); DMF and/or ketone (for thermoplastic PU); ketone and/or CH2Cl2 (for polycarbonate); THF and/or CH2Cl2 (for polyether-imide).

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