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公开(公告)号：BRPI0615863A2
公开(公告)日：2012-12-18
申请号：BRPI0615863
申请日：2006-08-31
Applicant: BASF SE
Inventor： SCHNEIDER NORBERT , LIPPERT GERALD , LOCHTMAN RENE , MAAS HEIKO , PFISTER JUERGEN , SOBOTKA BETTINA , WAGNER NORBERT
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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公开(公告)号：NO20081107A
公开(公告)日：2008-04-07
申请号：NO20081107
申请日：2008-03-04
Applicant: BASF SE
Inventor： LOCHTMAN RENE , WAGNER NORBERT , PFISTER JUERGEN , LIPPERT GERALD , MAAS HEIKO , SCHNEIDER NORBERT , SOBOTKA BETTINA
CPC classification number: H01B1/22 , C09D5/24 , H05K1/095 , H05K3/246 , H05K2201/0245 , H05K2201/0248 , H05K2201/0272 , H05K2201/0347 , Y10T428/25 , Y10T428/256 , Y10T428/258
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公开(公告)号：AT513301T
公开(公告)日：2011-07-15
申请号：AT06763965
申请日：2006-06-29
Applicant: BASF SE
Inventor： OETTER GUENTER , LAUN MARTIN , PFISTER JUERGEN , LOCHTMAN RENE , LIPPERT GERALD , MAAS HEIKO
Abstract: A magnetorheological formulation which comprises at least one base oil, at least one magnetizable particle, a at least one dispersant and a at least one thixotropic agent is described.
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公开(公告)号：CA2778645A1
公开(公告)日：2011-05-05
申请号：CA2778645
申请日：2010-10-18
Applicant: BASF SE
Inventor： PRUSTY MANORANJAN , BAUMERT MARTIN , WILMS AXEL , DESBOIS PHILIPPE , TRAUT ALEXANDER , LIPPERT GERALD , KURIKOV JORDAN
Abstract: The invention relates to thermoplastic molding compounds comprising A) 10 to 99.999 wt % of a polyamide, B) 0.001 to 20 wt % of powdered iron having a particle size of no greater than 10 µm (d50 value) that can be obtained by thermally disintegrating iron pentacarbonyl, C) 0 to 70 wt % of further additives, wherein the sum of the weight percentages of the components A) to C) is 100%.
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公开(公告)号：AU2006289126A1
公开(公告)日：2007-03-15
申请号：AU2006289126
申请日：2006-08-31
Applicant: BASF SE
Inventor： WAGNER NORBERT , SOBOTKA BETTINA , PFISTER JURGEN , MAAS HEIKO , LOCHTMAN RENE , SCHNEIDER NORBERT , LIPPERT GERALD
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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Patent Agency Ranking
公开(公告)号：AU2010311729B2
公开(公告)日：2015-12-17
申请号：AU2010311729
申请日：2010-10-18
Applicant: BASF SE
Inventor： PRUSTY MANORANJAN , BAUMERT MARTIN , WILMS AXEL , DESBOIS PHILIPPE , TRAUT ALEXANDER , LIPPERT GERALD , KURIKOV JORDAN
Abstract: The invention relates to thermoplastic molding compounds comprising A) 10 to 99.999 wt % of a polyamide, B) 0.001 to 20 wt % of powdered iron having a particle size of no greater than 10 μm (d
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公开(公告)号：PL2493968T3
公开(公告)日：2015-05-29
申请号：PL10765464
申请日：2010-10-18
Applicant: BASF SE
Inventor： PRUSTY MANORANJAN , BAUMERT MARTIN , WILMS AXEL , DESBOIS PHILIPPE , TRAUT ALEXANDER , LIPPERT GERALD , KURIKOV JORDAN
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公开(公告)号：AU2010311729A1
公开(公告)日：2012-05-17
申请号：AU2010311729
申请日：2010-10-18
Applicant: BASF SE
Inventor： PRUSTY MANORANJAN , BAUMERT MARTIN , WILMS AXEL , DESBOIS PHILIPPE , TRAUT ALEXANDER , LIPPERT GERALD , KURIKOV JORDAN
Abstract: The invention relates to thermoplastic molding compounds comprising A) 10 to 99.999 wt % of a polyamide, B) 0.001 to 20 wt % of powdered iron having a particle size of no greater than 10 μm (d value) that can be obtained by thermally disintegrating iron pentacarbonyl, C) 0 to 70 wt % of further additives, wherein the sum of the weight percentages of the components A) to C) is 100%.
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公开(公告)号：DE502006005931D1
公开(公告)日：2010-03-04
申请号：DE502006005931
申请日：2006-08-31
Applicant: BASF SE
Inventor： SCHNEIDER NORBERT , LIPPERT GERALD , LOCHTMAN RENE , MAAS HEIKO , PFISTER JUERGEN , SOBOTKA BETTINA , WAGNER NORBERT
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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公开(公告)号：NO20081107L
公开(公告)日：2008-04-07
申请号：NO20081107
申请日：2008-03-04
Applicant: BASF SE
Inventor： LOCHTMAN RENE , WAGNER NORBERT , PFISTER JUERGEN , LIPPERT GERALD , MAAS HEIKO , SCHNEIDER NORBERT , SOBOTKA BETTINA
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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