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    MICROELECTROMECHANICAL SYSTEM SENSOR ASSEMBLY
    11.
    发明公开
    MICROELECTROMECHANICAL SYSTEM SENSOR ASSEMBLY 审中-公开
    微机电传感器系统

    公开(公告)号：EP1252484A4

    公开(公告)日：2006-08-09

    申请号：EP00991691

    申请日：2000-11-30

    Applicant: CALIFORNIA INST OF TECHN

    Inventor： TAI YU-CHONG ,  WU SHUYUN ,  LIN QIAO

    IPC: G01F1/684

    CPC classification number: G01F1/6845

    Abstract: A sensor assembly (100) has a substrate (102) with a microchannel (104) formed therein through which a fluid flows. At least one sensor (106) is proximate to the microchannel. The temperature of the at least one sensor or fluid indicates the condition of the fluid including the flow rate and the presence of gas bubbles and particulate substance.

    IMPLANTABLE MECHANICAL PRESSURE SENSOR AND METHOD OF MANUFACTURING THE SAME
    13.
    发明申请
    IMPLANTABLE MECHANICAL PRESSURE SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    可植入机械压力传感器及其制造方法

    公开(公告)号：WO2005121735A3

    公开(公告)日：2006-11-23

    申请号：PCT/US2005020244

    申请日：2005-06-07

    Applicant: CALIFORNIA INST OF TECHN ,  TAI YU-CHONG ,  MENG ELLIS ,  CHEN PO-JUI ,  RODGER DAMIEN C ,  HUMAYUN MARK

    Inventor： TAI YU-CHONG ,  MENG ELLIS ,  CHEN PO-JUI ,  RODGER DAMIEN C ,  HUMAYUN MARK

    IPC: G01L7/00 ,  A61B3/16 ,  A61B5/00 ,  G01L7/04 ,  G01L7/08

    CPC classification number: A61B3/16 ,  A61B2562/02 ,  A61B2562/028 ,  G01L7/045

    Abstract: A biocompatible, mechanical, micromachined pressure sensor and methods of manufacturing such a pressure sensor are provided. The pressure sensor of the current invention comprises a high-aspect-ratio curved-tube structure fabricated through a one-layer parylene process. The pressure sensor of the current invention requires zero power consumption and indicates the pressure variation by changes of the in situ in-plane motion of the sensor, which can be gauged externally by a direct and convenient optical observation. In one embodiment, the pressure sensor of the current invention has been shown to work as an IOP sensor for eye implantation where the intraocular in-plane motion of the sensor can be recorded from outside of the eye, such that the intraocular pressure in glaucoma patients can be constantly monitored.

    Abstract translation: 提供生物相容的，机械的，微加工的压力传感器以及制造这种压力传感器的方法。 本发明的压力传感器包括通过一层帕利灵法制造的高纵横比弯曲管结构。 本发明的压力传感器需要零功率消耗，并且通过传感器的原位面内运动的变化来指示压力变化，其可以通过直接和方便的光学观察在外部测量。 在一个实施例中，本发明的压力传感器已被证明可用作眼睛植入的IOP传感器，其中可以从眼睛外部记录传感器的眼内平面内运动，使得青光眼患者的眼内压 可以不断监控。

    PARYLENE CAPACITIVE ACCELEROMETER UTILIZING ELECTRICAL FRINGING FIELD SENSING AND METHOD OF MAKING
    14.
    发明申请
    PARYLENE CAPACITIVE ACCELEROMETER UTILIZING ELECTRICAL FRINGING FIELD SENSING AND METHOD OF MAKING 审中-公开
    采用电动仿真的电容式电容式加速度传感器及其制造方法

    公开(公告)号：WO2004086056A3

    公开(公告)日：2005-10-20

    申请号：PCT/US2004007813

    申请日：2004-03-12

    Applicant: CALIFORNIA INST OF TECHN ,  AOYAGI SEIJI ,  TAI YU-CHONG

    Inventor： AOYAGI SEIJI ,  TAI YU-CHONG

    IPC: G01P15/125 ,  G01P15/00 ,  H01G7/00 ,  H01L21/76

    CPC classification number: G01P15/125 ,  G01P2015/0857

    Abstract: An accelerometer device comprises a dielectric seismic mass separated by a gap from an underlying comb-shaped planar capacitor. The principle for measuring acceleration detecting capacitance change according to movement of the dielectric mass in the fringe electrical field. This measuring principle is verified by FEM simulation. The simple structure of the accelerometer device allows the polymer Parylene to be used as the proof mass, greatly simplifying the technology by requiring only surface micromachining. Prototype accelerometers are fabricated and calibrated with the aid of off-chip capacitive readout IC.

    Abstract translation: 加速度计装置包括由与下面的梳状平面电容器间隔开的电介质地震块。 根据介质质量在边缘电场中的移动量测加速度检测电容的原理。 该测量原理通过有限元模拟验证。 加速度计装置的简单结构允许将聚对苯二甲酸乙烯酯用作验证质量，通过仅需要表面微加工大大简化了技术。 借助于片外电容读出IC制造和校准原型加速度计。

    AN INTEGRATED CIRCUIT-INTEGRATED FLEXIBLE SHEAR-STRESS SENSOR SKIN AND METHOD OF FABRICATING THE SAME
    16.
    发明申请
    AN INTEGRATED CIRCUIT-INTEGRATED FLEXIBLE SHEAR-STRESS SENSOR SKIN AND METHOD OF FABRICATING THE SAME 审中-公开
    集成电路集成的柔性剪切传感器皮肤及其制造方法

    公开(公告)号：WO03083906A2

    公开(公告)日：2003-10-09

    申请号：PCT/US0309523

    申请日：2003-03-31

    Applicant: CALIFORNIA INST OF TECHN ,  TAI YU-CHONG ,  XU YONG

    Inventor： TAI YU-CHONG ,  XU YONG

    IPC: A61B5/103 ,  B81C1/00 ,  G01L9/00 ,  G01M9/06 ,  H01L20060101 ,  H01L21/00 ,  H01L21/311 ,  H01L51/40 ,  H01L

    CPC classification number: B81C1/00246 ,  A61B2562/028 ,  A61B2562/164 ,  B81C2203/0735 ,  G01L9/0055 ,  G01M9/065

    Abstract: An IC-integrates, flexible, shear-stress sensor skin is made by providing a wafer with integrated circuits and sensor elements which are fabricated in the wafer, disposing a first polymer layer on the wafer and sensor elements to provide mechanical support for the sensor elements, defining a cavity below the sensor elements to provide thermal isolation, while the sensor element remains supported by the first polymer layer, and isolating the sensor elements into a plurality of islands defined in the wafer, so that the islands, with at least one sensor element on at least one of the islands, and the integrated circuits form the IC-integrated, flexible, shear-stress sensor skin. The invention is an IC-integrated, flexible, sensor skin made according to the method.

    Abstract translation: IC集成，灵活的剪切应力传感器皮肤是通过提供晶片与在晶片上制造的集成电路和传感器元件制成的，在晶片上设置第一聚合物层和传感器元件以为传感器元件提供机械支撑 ，在所述传感器元件下方限定一个空腔以提供热隔离，同时所述传感器元件保持由所述第一聚合物层支撑，并且将所述传感器元件隔离成限定在所述晶片中的多个岛，使得所述岛与至少一个传感器 元件在至少一个岛上，并且集成电路形成IC集成的，灵活的剪切应力传感器皮肤。 本发明是根据该方法制造的IC集成的，灵活的传感器皮肤。

    POLYMER-BASED ELECTROSPRAY NOZZLE FOR MASS SPECTROMETRY
    17.
    发明申请
    POLYMER-BASED ELECTROSPRAY NOZZLE FOR MASS SPECTROMETRY 审中-公开
    基于聚合物的电喷雾喷嘴用于大量光谱

    公开(公告)号：WO0030167A9

    公开(公告)日：2000-11-09

    申请号：PCT/US9927500

    申请日：1999-11-18

    Applicant: CALIFORNIA INST OF TECHN

    Inventor： TAI YU-CHONG ,  WANG XUAN-QI ,  DESAI AMISH ,  LEE TERRY D ,  LICKLIDER LAWRENCE

    IPC: G01N30/60 ,  G01N30/72 ,  H01J49/04 ,  H01L21/302 ,  B01D59/44

    CPC classification number: H01J49/167 ,  G01N30/6095 ,  G01N30/7266 ,  H01J49/0018

    Abstract: A MEMS device with an overhanging "polymer" capillary (20) provides vital and significant improvements in interfacing a MEMS electrospray nozzle (50) to an MS inlet or other macroscopic instrumentation. The fabrication methodology associated therewith is easily expanded to include built-in micro particle filters (71) and centimeter long serpentine micro channels (75) provided on-chip (19) and fabricated using a low temperature process.

    Abstract translation: 具有悬垂“聚合物”毛细管（20）的MEMS装置提供了将MEMS电喷雾喷嘴（50）连接到MS入口或其他宏观仪器的重要和显着的改进。 与此相关的制造方法容易扩展到包括芯片（19）上提供的内置微粒过滤器（71）和厘米长的蛇形微通道（75），并使用低温工艺制造。

    MULTI-LAYER PACKAGING SCHEME FOR IMPLANT ELECTRONICS
    18.
    发明公开
    MULTI-LAYER PACKAGING SCHEME FOR IMPLANT ELECTRONICS 有权
    MEHRSCHICHTVERPACKUNGSSCHEMAFÜRIMPLANTATELEKTRONIK

    公开(公告)号：EP3046869A4

    公开(公告)日：2017-04-26

    申请号：EP14846305

    申请日：2014-09-12

    Applicant: CALIFORNIA INST OF TECHN

    Inventor： TAI YU-CHONG ,  CHANG HAN-CHIEH

    IPC: B81C1/00 ,  A61B50/30 ,  A61F2/14 ,  A61N1/36 ,  A61N1/372 ,  A61N1/375 ,  H01L21/56 ,  H01L23/00 ,  H01L23/02 ,  H01L23/31 ,  H05K5/06

    CPC classification number: H01L23/3135 ,  A61B50/30 ,  A61F2/14 ,  A61N1/36046 ,  A61N1/37211 ,  A61N1/3758 ,  B81C1/00 ,  H01L21/56 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.

    Abstract translation: 本发明提供了一种微包装装置，包括：基底，用于固定具有附着于基底的腐蚀屏障的装置，其中腐蚀屏障包括第一薄膜层，覆盖薄膜层的金属膜和第二薄膜层， 薄膜层以提供夹心层; 以及可选地设置在所述基底中的至少一个馈通，以允许至少一个输入和/或至少一个输出线进入所述微包装装置，其中所述微包装装置由所述腐蚀屏障封装。 还公开了制造微封装器件的方法。

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