公开(公告)号：EP1496733A3

公开(公告)日：2007-03-28

申请号：EP04076923.4

申请日：2004-07-02

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

公开(公告)号：EP1672968A2

公开(公告)日：2006-06-21

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.

Abstract translation: 一种电子部件，装置（10）包括具有第一值的分立元件（12）和第二端子（20,22）和一个中心暴露焊盘（29）。 的基板（14）具有第一电导体（32）电连接到所述第一端子，第二电导体（34）电连接到所述第二终端，和第三电导体（31）。 导热元件（26）与所述直接热连通，所述电子部件和所述基板的所述第三电导体的两个中心暴露焊盘。