公开(公告)号：EP1672968B1

公开(公告)日：2018-08-29

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.

公开(公告)号：EP1926182A3

公开(公告)日：2011-05-18

申请号：EP07120979.5

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Chow, Kin Yean ,  Fang, Ching Meng ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H01R13/52 ,  H05K5/06 ,  H05K5/00

CPC classification number: H01R13/5202 ,  H01R13/6658 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/065

Abstract: A partially overmolded component (38) having a precisely defined overmolding edge (48) includes a component (44) having a protruding elongate rib (52) and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool (24) and a more tortuous flow path to bleed-through.

公开(公告)号：EP1672968A2

公开(公告)日：2006-06-21

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.

Abstract translation: 一种电子部件，装置（10）包括具有第一值的分立元件（12）和第二端子（20,22）和一个中心暴露焊盘（29）。 的基板（14）具有第一电导体（32）电连接到所述第一端子，第二电导体（34）电连接到所述第二终端，和第三电导体（31）。 导热元件（26）与所述直接热连通，所述电子部件和所述基板的所述第三电导体的两个中心暴露焊盘。

公开(公告)号：EP2854177A1

公开(公告)日：2015-04-01

申请号：EP14184326.8

申请日：2014-09-10

Applicant: Delphi Technologies, Inc.

Inventor： Pan, Binghua ,  Low, Yew Kwang ,  Yong, Sim Ying

IPC: H01L27/146

CPC classification number: H01L31/02005 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly (10) that attaches a ball grid array (BGA) packaged camera device (12) to a printed circuit board (PCB) substrate (14) is provided. The assembly (10) includes a spacer (30) between the device (12) and the substrate (14). The spacer (30) is configured to prevent excessive collapse of solder balls (26) located between the device (12) and the substrate (14) during reflow of the solder balls (26). The spacer (30) includes one of solder mask, tape, and/or legend ink.

Abstract translation: 提供了一种将球栅阵列（BGA）封装的相机装置（12）附接到印刷电路板（PCB）基板（14）的组件（10）。 组件（10）包括在装置（12）和衬底（14）之间的间隔件（30）。 间隔件（30）构造成防止在焊球（26）回流期间位于装置（12）和基板（14）之间的焊球（26）的过度塌陷。 间隔物（30）包括焊料掩模，胶带和/或传说油墨之一。

公开(公告)号：EP2088841A3

公开(公告)日：2012-08-15

申请号：EP09151465.3

申请日：2009-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Fang, Ching Meng ,  Chow, Kin Yean ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K5/00 ,  H05K5/06 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

公开(公告)号：EP2088841A2

公开(公告)日：2009-08-12

申请号：EP09151465.3

申请日：2009-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Fang, Ching Meng ,  Chow, Kin Yean ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K5/00 ,  H05K5/06

CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

Abstract translation: 一种改进的包覆成型电子组件包括背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路装置，电连接器 ，电连接器的热塑性壁构件的外侧上的金属环和包覆成型体。 金属环围绕电连接器的外部连接器引脚，并且包覆模体与电连接器的背板和热塑性壁构件一起密封地包围电路基板和限定在基板上的电路装置，其中包覆模体具有周边边缘 与金属环粘合。 本发明避免了与不包含金属环的类似装置相关联的分层问题。

公开(公告)号：EP1926182A2

公开(公告)日：2008-05-28

申请号：EP07120979.5

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Chow, Kin Yean ,  Fang, Ching Meng ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H01R13/52

CPC classification number: H01R13/5202 ,  H01R13/6658 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/065

Abstract: A partially overmolded component (38) having a precisely defined overmolding edge (48) includes a component (44) having a protruding elongate rib (52) and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool (24) and a more tortuous flow path to bleed-through.

Abstract translation: 具有精确限定的包覆成型边缘（48）的部分包覆模制的部件（38）包括具有突出的细长肋（52）的部件（44），并且所述包覆成型具有邻接突出细长肋的末端边缘。 所述肋限定了在所述部件和包覆成型工具（24）之间提供更大的接触面积的表面和更弯曲的流动路径以渗透。

公开(公告)号：EP2854177B1

公开(公告)日：2017-03-22

申请号：EP14184326.8

申请日：2014-09-10

Applicant: Delphi Technologies, Inc.

Inventor： Pan, Binghua ,  Low, Yew Kwang ,  Yong, Sim Ying

IPC: H01L27/146

CPC classification number: H01L31/02005 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2088841B1

公开(公告)日：2015-10-14

申请号：EP09151465.3

申请日：2009-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Fang, Ching Meng ,  Chow, Kin Yean ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K5/00 ,  H05K5/06 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

公开(公告)号：EP1672968A3

公开(公告)日：2006-07-19

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.