公开(公告)号：EP1408584A1

公开(公告)日：2004-04-14

申请号：EP03078052.2

申请日：2003-09-26

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Visser, Roy A.

IPC: H01R12/04

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal (30) is provided for connecting a first circuit element (14) to a second circuit element (22) on respective first and second circuit boards (12 and 20). The terminal (30) includes a flat conductive member having a first end (32) for connecting to a first circuit element (14) and a second end (34) for connecting to a second circuit element (22). The conductive member is axially twisted about its longitudinal axis.

Abstract translation: 端子（30）包括一个平坦的导电构件，其一端连接到第一电路元件，而另一端连接到第二电路元件（22）。 导电构件在端部之间具有扭转部分，该扭转部分轴向地扭转45度至135度的角度（θ）。 包括用于电路的独立权利要求，以及用于在两个电路元件之间提供电连接的方法。

公开(公告)号：EP1496733A2

公开(公告)日：2005-01-12

申请号：EP04076923.4

申请日：2004-07-02

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

Abstract translation: 提供了一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离部件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

公开(公告)号：EP1983810A2

公开(公告)日：2008-10-22

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接收在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电子元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热熔粘合剂， 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

公开(公告)号：EP1672968A3

公开(公告)日：2006-07-19

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.

公开(公告)号：EP1565047A1

公开(公告)日：2005-08-17

申请号：EP05075212.0

申请日：2005-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Post, Scott E. ,  Cheok, Cheng Gek, c/o 700 Lorong 1-Toa Payoh ,  Stillabower, Morris D. ,  Nah, Chih Kai ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K3/34

CPC classification number: H05K1/112 ,  H05K3/3442 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic package (10) is provided having a surface mount electronic device (40) connected to a circuit board (12). The package (10) includes a circuit board (12) and a surface mount electronic device (40). A mounting pad (28) is formed on the circuit board (12). A plurality of vias (30) are formed each having an opening extending into the circuit board (12) and extending through the mounting pad (28). The package (10) further includes a solder joint (32) connecting a contact terminal (42) of the surface mount device (40) to the mounting pad (28) on the circuit board (12). The solder joint (32) extends at least partially into the openings in each of the plurality of vias (30) to support the arrangement of the surface mount device (40) on the circuit board (12).

Abstract translation: 提供具有连接到电路板（12）的表面安装电子装置（40）的电子封装（10）。 封装（10）包括电路板（12）和表面贴装电子器件（40）。 在电路板（12）上形成安装垫（28）。 形成多个通孔（30），每个通孔具有延伸到电路板（12）中并延伸穿过安装垫（28）的开口。 封装（10）还包括将表面安装器件（40）的接触端子（42）连接到电路板（12）上的安装焊盘（28）的焊接接头（32）。 焊接接头（32）至少部分地延伸到多个通孔（30）中的每一个中的开口中，以支撑表面安装器件（40）在电路板（12）上的布置。

公开(公告)号：EP1672968B1

公开(公告)日：2018-08-29

申请号：EP05077721.8

申请日：2005-11-25

Applicant: Delphi Technologies, Inc.

Inventor： Nah, Chih Kai ,  Yong, Sim Ying ,  Stillabower, Morris D. ,  Gromala, Przemyslaw ,  Pan, Binghua

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement (10) includes a discrete electronic component (12) having first and second terminals (20, 22) and a centre-exposed pad (29). A substrate (14) has a first electrical conductor (32) electrically connected to the first terminal, a second electrical conductor (34) electrically connected to the second terminal, and a third electrical conductor (31). A thermally conductive element (26) is in direct thermal communication with both said centre-exposed pad of said electronic component and said third electrical conductor of said substrate.

公开(公告)号：EP1983810A3

公开(公告)日：2009-10-14

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

公开(公告)号：EP1496728A1

公开(公告)日：2005-01-12

申请号：EP04076873.1

申请日：2004-06-29

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D.

IPC: H05K1/02

CPC classification number: H05K3/326 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A circuit assembly (10) comprising a substrate (12) formed to have one or more apertures (14,28) that define one or more compliant members (20) in the substrate (12), and to which a circuit device (18) can be attached so as to reduce thermally-induced stresses in the device (18) and in solder joints (19) securing the device (18) to the substrate (12). The compliant members (20) are sufficiently compliant to permit relatively large surface-mount devices (18) to be attached to an organic substrate (12) without sacrificing reliability.

Abstract translation: 一种电路组件（10），包括形成为具有在基板（12）中限定一个或多个柔性构件（20）的一个或多个孔（14,28）的衬底（12），并且电路装置（18） 可以附着以减少装置（18）和将装置（18）固定到基板（12）的焊接接头（19）中的热诱导应力。 顺应性构件（20）具有足够的柔顺性，以允许相对较大的表面安装装置（18）附着到有机衬底（12）而不牺牲可靠性。

公开(公告)号：EP1857706B1

公开(公告)日：2016-04-20

申请号：EP07075328.0

申请日：2007-05-02

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D.

IPC: F16F3/087

CPC classification number: F16F3/0876

公开(公告)号：EP1857706A1

公开(公告)日：2007-11-21

申请号：EP07075328.0

申请日：2007-05-02

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D.

IPC: F16F3/087

CPC classification number: F16F3/0876

Abstract: A vibration-sensitive module (12) having a mounting flange (36) is mounted to a vibrational base (10) with a bushing assembly (34) secured to the base (10), where the mounting flange (36) has cammed surfaces (36e, 36f) radially adjacent to the bushing assembly (34) that variably engage the radial peripheries of the bushings (38, 40) in response to vibrational movement of the base (10). The cammed surfaces (36e, 36f) produce a desired force vs. deflection characteristic of the mounting apparatus, and the bushing material retains its compressibility under load to minimize cross-coupling of vibrational force impulses.

Abstract translation: 具有安装凸缘（36）的振动模块（12）安装到具有固定到基座（10）的衬套组件（34）的振动基座（10）上，其中安装凸缘（36）具有凸轮表面 36e，36f），其径向地邻近所述衬套组件（34），所述衬套组件（34）响应于所述基座（10）的振动运动而可变地接合所述衬套（38,40）的径向外周。 凸轮表面（36e，36f）产生了安装装置所需的力与偏转特性，并且衬套材料在负载下保持其压缩性，以最小化振动力冲击的交叉耦合。